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    COMPONENT DATA Search Results

    COMPONENT DATA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NFMJMPC226R0G3D Murata Manufacturing Co Ltd Data Line Filter, Visit Murata Manufacturing Co Ltd
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    CUZ24V Toshiba Electronic Devices & Storage Corporation Zener Diode, 24 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation

    COMPONENT DATA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    xilinx 1200

    Abstract: cas number 14808-60-7
    Text: 100% Material Declaration Data Sheet FT64 PK232 v1.1 March 19, 2012 Average Weight: 0.2450g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Component Weight/ Substance Weight (grams) Component Percent of Total


    Original     		PDF PK232 2450g 1333-86-inx xilinx 1200 cas number 14808-60-7

    peak atlas DCA55

    Abstract: ATLAS dca55 DCA55 thyristor-triac specifications A 103 TRANSISTOR pinout 220MV ATLAS III pinout all type of triac how to test transistor SK17
    Text: atlas component analyser PRODUCT BRIEF Model: DCA55 The Peak Atlas A fresh approach to component analysis has resulted in the fantastic Peak Atlas, an intelligent, slim and invaluable tool. A world of detailed component data has never been so accessible. Just connect your component any way round and


    Original     		PDF DCA55 GP23A peak atlas DCA55 ATLAS dca55 DCA55 thyristor-triac specifications A 103 TRANSISTOR pinout 220MV ATLAS III pinout all type of triac how to test transistor SK17

    E317132

    Abstract: ELECTROMAGNETIC Underwriters Laboratories
    Text: FOKY2.E317132 - Electromagnetic Interference Filters - Component Page 1 of 1 FOKY2.E317132 Electromagnetic Interference Filters - Component Page Bottom Electromagnetic Interference Filters - Component See General Information for Electromagnetic Interference Filters - Component


    Original     		PDF E317132 E317132 ELECTROMAGNETIC Underwriters Laboratories

    QII54005-10

    Abstract: No abstract text available
    Text: 6. Component Editor QII54005-10.0.0 The SOPC Builder component editor provides a GUI to support the creation and editing of the Hardware Component Description File _hw.tcl file that describes a component to SOPC Builder. You use the component editor to do the following:


    Original     		PDF QII54005-10

    material declaration

    Abstract: VO48
    Text: 100% Material Declaration Data Sheet VO48 PK176 v2.0 February 12, 2008 Material Declaration Data Sheet Average Weight: 0.543 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight


    Original     		PDF PK176 material declaration VO48

    1747-CP3 CABLE CONFIGURATION

    Abstract: 2711C-CBL-AB03 2711-CBL-PM05 1761-CBL-PM02 siemens mpi RS232 interface cable 2711C-T6T 2711C-T6C 2711C-CBL-UU02 2711C-K3M 2711C-T10C
    Text: Technical Data PanelView Component Specifications Catalog Numbers 2711C-F2M, 2711C-K2M, 2711C-T3M, 2711C-K3M, 2711C-T6M, 2711C-T6C, 2711C-T6T, 2711C-T10C PanelView Component Family Topic Page PanelView Component Family 1 Environmental Specifications 2 Certifications


    Original     		PDF 2711C-F2M, 2711C-K2M, 2711C-T3M, 2711C-K3M, 2711C-T6M, 2711C-T6C, 2711C-T6T, 2711C-T10C Micro800 RA-DU002, 1747-CP3 CABLE CONFIGURATION 2711C-CBL-AB03 2711-CBL-PM05 1761-CBL-PM02 siemens mpi RS232 interface cable 2711C-T6T 2711C-T6C 2711C-CBL-UU02 2711C-K3M 2711C-T10C

    pl232

    Abstract: PL-232 34590-94-8 silver sulfate 14808-60-7 epoxy resin PK232
    Text: 100% Material Declaration Data Sheet FT64 PK232 v1.0 May 6, 2008 100% Material Declaration Data Sheet Average Weight: 0.245 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight


    Original     		PDF PK232 pl232 PL-232 34590-94-8 silver sulfate 14808-60-7 epoxy resin PK232

    pk205

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet PC20 PK205 v1.1 January 16, 2012 Average Weight: 0.68189g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die attach material Mold Compound 7440-21-3 100.00 Component % of Total


    Original     		PDF PK205 68189g pk205

    pollution

    Abstract: No abstract text available
    Text: Product catalogue | Electronics housings | Component housings for mounting on DIN rail | CH20M - modular component housing | CH20M6 - modular component housing, width of 6 mm General ordering data Order No. Part designation Version 2418600000 CH20M6 BP 4P-4P BK


    Original     		PDF CH20M CH20M6 SolidCH20M6 pollution

    BT 8123

    Abstract: FF484
    Text: 100% Material Declaration Data Sheet FF484 PK402 v1.2 September 28, 2012 Average Weight: 4.1856g Component Substance Description CAS Number or Description Percentage of Component Silicon Die (FPGA) Doped silicon 7440-21-3 Use in Product Component Weight/


    Original     		PDF FF484 PK402 1856g secret19/10 BT 8123 FF484

    Untitled

    Abstract: No abstract text available
    Text: PK582 v1.0 September 21, 2012 100% Material Declaration Data Sheet FGG400 XC3S400AN Average Weight: 2.0000 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/


    Original     		PDF PK582 FGG400 XC3S400AN 12visions

    Untitled

    Abstract: No abstract text available
    Text: PK225 v1.1 September 21, 2012 100% Material Declaration Data Sheet for FF1136 Package Average Weight: 9.9112 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon 7440-21-3 100.00 Solder Bump Component Weight/ Substance Weight


    Original     		PDF PK225 FF1136

    Untitled

    Abstract: No abstract text available
    Text: PK584 v1.0 September 28, 2012 100% Material Declaration Data Sheet FG400 XC3S400AN Average Weight: 2.0455 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/


    Original     		PDF PK584 FG400 XC3S400AN

    butyrolactone

    Abstract: xilinx so20
    Text: 100% Material Declaration Data Sheet SO20 PK209 v1.1 January 16, 2012 Average Weight: 0.5610 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Component % of Total


    Original     		PDF PK209 butyrolactone xilinx so20

    Untitled

    Abstract: No abstract text available
    Text: PK394 v1.1 January 16, 2012 100% Material Declaration Data Sheet for XC3S1400AN FGG676 Package Average Weight: 3.188g Component Silicon Die (FPGA) Substance Description Silicon CAS# or Description 7440-21-3 % of Component 100.00 Silicon Die (PROM) Component Weight/


    Original     		PDF PK394 XC3S1400AN FGG676

    E172884

    Abstract: Underwriters Laboratories
    Text: NKCR2.E172884 - Auxiliary Devices - Component Page 1 of 1 NKCR2.E172884 Auxiliary Devices - Component Page Bottom Print-friendly version Questions? Previous Page Auxiliary Devices - Component See General Information for Auxiliary Devices - Component E172884


    Original     		PDF E172884 E172884 Underwriters Laboratories

    FF784

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet FF784 PK404 v1.2 September 28, 2012 Average Weight: 5.5545 g Component Silicon Die (FPGA) Substance Description Doped silicon CAS Number or Description 7440-21-3 Percentage of Component Use in Product Component Weight/


    Original     		PDF FF784 PK404 M30/10 FF784

    FT256

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet FT256 PK158 v1.3 July 27, 2012 Average Weight: 0.7530g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon 7440-21-3 100.00 Die Attach Use in Product Component Weight/


    Original     		PDF FT256 PK158 7530g 7440-22-d FT256

    Untitled

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet for VQG64 Package PK129 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PDF VQG64 PK129

    Untitled

    Abstract: No abstract text available
    Text: PK171 v1.3 November 18, 2011 100% Material Declaration Data Sheet for VQ44 Package Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PDF PK171 7440-mponent

    Untitled

    Abstract: No abstract text available
    Text: PK130 v1.4 August 24, 2012 100% Material Declaration Data Sheet for VQG100 Package Average Weight: 0.5392 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Component Weight/


    Original     		PDF PK130 VQG100

    Untitled

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet for VQ44 Package PK171 v1.4 August 24, 2012 Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PDF PK171 7440-31-5ptions

    Untitled

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet for VQ64 Package PK172 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PDF PK172 7440-31-5ptions

    Untitled

    Abstract: No abstract text available
    Text: Component Data


    OCR Scan     		PDF