CONN 5MM Search Results

INNER CARTON LABEL

Abstract: 912-050
Contextual Info: 107-68160 Packaging Specification 18Jun07 Rev H 2.5 mm Single Mate Conn on Tape Header 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 2.5 mm Single Mate Conn on Tape Header product. 订定 2.5 mm Single Mate Conn on Tape Header 产品之包装规格及包装方式。

cx20582

Abstract: IT8512E-L MAX17033 Conexant CX20582-10z MAX17033G T4610 CX20582-10z asus C4429 circuit max17031e
Contextual Info: 5 D C B A 4 01 Block Diagram 61 02 System Setting 62 USB CONN 03 POWER SEQUENCE 63 * 04 CPU-Penryn HOST 64 * 05 CPU-Penryn(PWR) 65 06 * 66 * 07 Cantiga(HOST) 67 DEBUG CONN 08 Cantiga(DMI & CFG) 68 DC & BAT IN 09 Cantiga(GRAPHIC) 69 * 10 Cantiga(DDR2) 70 *

Nylon 6 GF30

Contextual Info: 0.5mm Pitch Fine Stack Conn. H=1.5mm 0.5mm t°yf "7 7 ^ =i $ H=1. 5mm AMR Product Specification 108-5546 16 Mar. ’01 Rev. E 1 Scope : . 1. 1.1 Contents 11.1 ^ ^ £ 0 . 5mm tfyf- ^ r - f > This specification covers the requirements for product performance, test methods and quality

USM1I-DC24

Abstract: USM1I-DC24P E52283
Contextual Info: CONTROL No:_ 115 REV DATE ECO 3-10-99 N/A DESCRIPTION INIT RELEASE BY CK APP GCT N/A N/A 7 8 . Omm 3.07] 2. 5mm 10 [. ] 17.5mm• [.69] [2.17] WIRE P/N CONN TYPE USM1I-DC24 PRESSURE USM1I-DC24P PLATE Î RMS SYM TORQUE RATING IN-LBS 100K GOULD PRODUCT MANAGER

US3J1I

Abstract: US3J1 E52283 2T14
Contextual Info: CONTROL Nn: REV DATE ECO 3-11-99 N/A 115 DESCRIPTION INIT RELEASE BY CK APP GCT N/A N/A 6. 5mm [•26] [2 . 20] [.12: [l .28] NOTES: WIRE P/N US3J1 US3J1I CONN TYPE PRESSURE PLATE RMS SYM TORQUE RATING IN-LBS 200K 35 WIRE RANGE » 2 - t 14 75 374 MERRIMAC STR EET

HR202

Abstract: HR210 HR303 HR107-ND HR208-ND HR213 HR207-ND HR100-ND HR201 HR307-ND
Contextual Info: p139-146 Hirose-Circular Conn 3/7/05 4:00 PM Page 1 Circular Connectors HR10 Series 7mm Push-Pull Connectors GOLD PLATED Dust Cap CONTACTS Plug Features: The most compact HR10 series with well balanced, simplified layout in limited space; Easy “Push-Pull” Operation;

US3J3I

Abstract: US3J3 E52283
Contextual Info: CONTROL No : REV DATE ECO 3-11-99 N/A DESCRIPTION INIT RELEASE 115 BY CK APP GCT N/A N/A 6 . 5mm [.2 6 ] 2.20 [3 .8 4 ] P/N US3J3 US3J3I CONN TYPE PRESSURE PLATE WIRE RMS SYM TORQUE RATING IN-LBS 200K 35 WIRE RANGE *2-#14 U/L TYPE 75 CU NOTES: CSA FILE NO.

OPIC Photointerrupter

Abstract: GP2A11
Contextual Info: s harp GP2A11 GP2A1 1 Light Modulation OPIC Photointerrupter • Features ■ Outlne Dimensions 1. Light m odu lation typ e free from ex tern a l disturbing light U n it : m m Internal conn ection diagram / Am p, C om parator V o ltag e regulator D em o d u lato r circuit

Contextual Info: \! El $ n m a I t SECT A - A 2.5 2.5X 4= 10 ^ :108-5459 2. NOTESi 1. PRODUCT SPEC.I 109-5459 2. APPLICABLE CONN. P/NjSEE TABLE 1 SEE TABLE2 7 917691 m 3 ( P /N MANUFACTURING PLACE ~ a * AMP JAPAN XH: qr Copyright Xtt —+ - + AMP 3 r AMP tp m CHINA(PRC)

CONN1

Abstract: D-MK70
Contextual Info: A DEGSON Product S p e cification DEGSON ELECTRONICS CO., LTD. S p e c if ic a t io n 1 Terminal block (2) End Cover Q MK 70 10 D-MK70 10 QL2-70 QL3-70 20 5 (3) Separting Plate (4) Small Partition /c\ Cross Conn' ' ection Links 2P 3P 4P 10P je. Removable Cross

Contextual Info: RECTANGULAR CONNECTOR •CRT SOCKET OPTICAL LINK - IC/LSI SOCKET 1* 't S DETACHABLE CONNECTOR Pluq-ln Type m VMF Series VST Series c v T 3 2 7 5 -n n n n cvT 3 3 2 D -n n n n 8.5 D ETACH ABLE CONN ECTOR D T 3 *?$ • Rating: 1A 16V DC • Contact Resistancel30mO max.

Contextual Info: RL01 SERIES CONNECTORS 0.8mm .0 31 " Contact Spacing, PCB-to-Cable (Discrete Wire) Connectors • • • • • • • • • • • f t * * RL01 Series c o n n e c to rs are low profile conn e c to rs designed for b o ard-to-c able applications. The reduced w e ig h t and size of

Panasonic SU-d50

Abstract: acer battery pinout pt2323 OZT01J05 BC109 BC184 BC549 BC629 ic Panasonic Su-d50 BC519 BC348 acer e1
Contextual Info: SEP 11 '01 CPU Tualatin Ver. CLK GEN B0 HOST BUS 133MHz CRT P.3 Almador-M GMCH Ver. MEM BUS 133MH z A5 P.1 0 VCH Ver. 66MH z LCD CONN A2 P.1 1 P.1 2 P.7,8 ,9 HUB I/F 66MHz 25.1MH z ATA100 Primary IDE USB 2.0 USB*1 P.2 1 12MH z C Doc k USB*2 P.1 6 ICH3-M

5I18

Abstract: II0006 L5005
Contextual Info: 4 1.9 l±0.15 SLOT No. B CKT. No. I l.27±0.l A ! 1 SLOT No. B CKT. No. I GND 52760-1400 CKT. No. 7 1 52760- 1400 CKT. No. I GND REC. HS'G ASS'Y 52760-1400 CKT. No. 70 GND GND molex SHEET 3 OF 3 # SEE SHEET 3 OF TITLE I S t M i B DRAWN B Y M E M O R Y CARD CONN.

P909

Abstract: UCP2003-2572
Contextual Info: 42 2 5 4 D IS C R E T E NO CONN. C0NNIN CHAIN CKT S IZ E OF DIM. DIM. 2 .7 5 6 7 0 .0 0 (2.50 . 197 2 .9 5 3 (7 5 .0 0 .295 2 .7 5 6 (7.50 (7 0 .0 0 .394 . 150 DIM. B (REF. 2 .7 5 6 ( 10.00 (7 0 .0 0 .492 _ . 130 DIM . A -(REF.) 2 .5 5 6 (3.30) C IR C U IT

JIS D1601 vibration Testing Method for Automobile

Contextual Info: Product Specification 108-5280 19AUG10 Rev.F6 プリント基板用 ハイブリッド I/O コネクタ プリント基板用.040/.070 基板用 .040/.070 Hybrid I/O Conn. For Printed Circuit Board 1. 適用範囲 1. Scope 1.1 内容 本規格はプリント基板用.040/.070 ハイブリット I/O

push button 4 pin

Contextual Info: 10 NORMAL MOUNT TYPE A A 4 I.9 I± 0 .1 5 SLOT N o .B CKT. No. 68 ' GND R E C . H S 'G A S S 'Y CKT. No GND R E C . H S 'G R E C . H S 'G I6Ö A S S 'Y A S S 'Y ^CKTo No. 80 55150-1609 M A T E R IA L NO. i— I THIRD ANGLE — ' PROJECTION PC CARD CONN. EJECT

Contextual Info: CD CD CD g CD i O -jA M P K U -K V -^ 7 TRAD E MARK A ji • i Í 1 r CNJ 1 -i I a 0Ï o: h- o LU I l i ? SECT A - A B r L IM^i CAP 7 PLUG 1ÈE. E * 1. : 108—5 4 5 9 N O T E S; 1. PRODUCT S P E C . i 1 0 8 - 5 4 5 9 2 . A P P L IC A B L E CONN. P / N l S E E T A B L E

Contextual Info: Signal Relays AXICOM Card SN Relay V23030 n Low profile, therefore particularly suited for flat pack components grouping n For relays with 1 or 2 form C CO contacts: - creepage and clearance distances between contacts and frame >5mm or >10mm (depending on the relay version)

V23030-A1026-A104

Abstract: V23030-A1021-A104 V23030-A2021-A104 V23030 V23030-A1017-A104 V23030-C1021-A104 V23030A2021A104 5-1393801-0 V23030-C1017-A104 V23030-A2017-A104 V23030-A2012-A104
Contextual Info: Signal Relays Axicom Card SN Relay V23030 n Low profile, therefore particularly suited for flat pack components grouping n For relays with 1 or 2 form C CO contacts: - creepage and clearance distances between contacts and frame >5mm or >10mm (depending on the relay version)

V23030-A1021-A104

Abstract: V23030-A2021-A104 V23030-A1026-A104 A1021A1 v23030-a1017-a104 v23030 V23030A1021A104 3-1393801-8 V23030A2021A104 5-1393801-0
Contextual Info: Signal Relays AXICOM Card SN Relay V23030 n Low profile, therefore particularly suited for flat pack components grouping n For relays with 1 or 2 form C CO contacts: - creepage and clearance distances between contacts and frame >5mm or >10mm (depending on the relay version)

Contextual Info: RFPA2235 RFPA2235Single-Stage Power Amplifier 2W, 700MHz to 2700MHz Single-Stage Power Amplifier 2W, 700MHZ to 2700MHZ Package Style: DFN, 12-Pin, 4mm x 5mm VBIAS 1 Features  WCDMA Power at 2140MHz = 20dBm with -60dBc ACPR Gain = 13dB at 2140MHz  P1dB = 32.5dBm at 2140MHz

Contextual Info: RFPA2224 RFPA2224 Single-Stage Power Amplifier 1W, 700MHz to 2700MHz Package: DFN, 12-Pin, 4mm x 5mm Features  WCDMA Power at 2140MHz = 17dBm with -60dBc ACPR Gain = 14dB at 2140MHz  P1dB = 30dBm at 2140MHz  Externally Matched  Power-down Capability

JIS D1601 vibration Testing Method for Automobile

Abstract: ULF-300R JASO d605 R5210 D0203 D0204 D1601 D605 D7101 ULF300R
Contextual Info: Product Specification 108-5342 06 MAR 08 Rev.D3 040Ⅱ 040Ⅱ/070Ⅱ 070Ⅱ Hybrid I/O Connector Connector MKMK-Ⅱ for WireWire-toto-Board Termination 1. Scope : 1.1 Contents : This specification covers the requirements for product performance, test methods and quality assurance