COPPER THERMAL LEADFRAME Search Results

Contextual Info: Thermal Data DPAK & PPAK 3 leads 5 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Thermal Resistance & Maximum Power Dissipation vs P.C.B. Copper Area

diode sm4007 -MELF

Abstract: SMA Package diode schottky 1000V 2a TVS diode MELF FLYBACK CLAMPING DIODE Schottky melf diode sm4007 SM4007 Diode 3A 440V TVS Diode cross
Contextual Info: Application Note Comparison between Melf and SMA package Comparison between Melf and SMA package Melf package cross section SMA package (cross section) Build with massive copper plugs (Nickel Build in copper leadframe technology plated) * Superior thermal resistance due to massive * Leadframe technology has got higher thermal

TQFP 64 PACKAGE rth

Abstract: 10X10
Contextual Info: Thermal Data  TQFP 10x10 44,64 leads 64 leads 44 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach epoxy glue silver filled

MO-048

Abstract: MULTIWATT die TH17023
Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

MO-048

Abstract: MULTIWATT die CMC 15 EPOXY RESIN
Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

MO-048

Contextual Info:  Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder

Contextual Info: Thermal Data  D2PAK 3 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Charts enclosed : 1) Thermal Resistance and Maximum Power Dissipated

heat sink to220

Abstract: TH17023
Contextual Info: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder

Contextual Info: Thermal Data D2PAK 3 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Charts enclosed : 1) Thermal Resistance and Maximum Power Dissipated

MO-166

Abstract: heat slug for JEDEC MO-166 Power SO20
Contextual Info: Thermal Data POWER SO-20 Family 20, 36 leads JEDEC MO-166 20 leads 36 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach soft solder

TQFP 64 PACKAGE rth

Abstract: conductivity w502
Contextual Info: Thermal Data  TQFP 10x10 44,64 leads 44 leads 64 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C slug high thermal conductivity Cu 0.5 mm 3.9 W/cm°C die attach silver glue 10-40 µm 0.01 W/cm°C

FLEXIWATT25

Abstract: Flexiwatt
Contextual Info: Thermal Data  FLEXIWATT 25 leads 25 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.38 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C

Flexiwatt25 thermal data

Abstract: flexiwatt25
Contextual Info: Thermal Data  FLEXIWATT 25 leads 25 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C

Alloy 42

Contextual Info: AN815 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 6-Pin MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION pins as drain leads, which helps to reduce on-resistance and junction-to-ambient thermal resistance.

MF202

Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical

Contextual Info: VISHAY SILICONIX www.vishay.com Power MOSFETs Application Note AN917 Dual-Channel LITTLE FOOT 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance 175 °C Rated Part INTRODUCTION The new dual 6-pin SC-70 package with a copper leadframe

AN816

Abstract: Dual N-Channel mosfet sot-363 SC70-6 sc-70 package pcb layout
Contextual Info: AN816 Vishay Siliconix Dual-Channel LITTLE FOOTR 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance INTRODUCTION 87 mil 26 (mil) The new dual 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced

TQFP 14X14

Contextual Info: Thermal Data  TQFP 14x14 44, 80,100 leads 44 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin

Alloy 42

Abstract: AN815 sc-70 package pcb layout SC70-6 Si19xxEDH
Contextual Info: AN815 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 6-Pin MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance INTRODUCTION EVALUATION BOARDS Ċ SINGLE SC70-6 The new single 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced

Contextual Info: Thermal Data  SO 16 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.20 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.65 mm 0.0063W/cm°C Charts enclosed :

Contextual Info: Thermal Data MINIDIP 8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :

Contextual Info: Thermal Data  SDIP 30 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :

Contextual Info: Thermal Data  SDIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.3 mm 0.0063W/cm°C Leadframe options: