COPPER WIRE COMPOSITION Search Results

Contextual Info: Soft Shell Pin and Socket Connectors AMP Power Double Lock PDL Connectors (Wire-to-Board and Wire-to-Wire) (Continued) Contacts and Product Composition Contacts Material and Finish Pre-tinned copper alloy High Density Receptacle for Plug Housing, Tab for Cap Housing

Contextual Info: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide

608501-1

Abstract: copal TYCO ELECTRONICS splice kits splice 40820 copalum tubing
Contextual Info: 408-2049-36 COPALUM* Splices Pressure Type Wire Connectors 07 MAY 08 Pressure Type Wire Connectors Use Tool 933150-1 or 68068-6 PART NO. ALL SOLID WIRE SIZE SIZE RANGE COLOR CODE Copper (CU) 10 14 Aluminum 1 - - 1 and 2 - - - LENGTH 12 ALL SOLID WIRE SIZE

yellow led 5mm

Abstract: red led red led 5mm CD43
Contextual Info: mVEREXr OPTIONAL ACCESSORIES - CATHODE & GATE LEAD KITS -• 11.80 . L .O ,L U S / / / / / * V / / / / / A YELLOW LEAD I I I (RED LEAD) 1. WIRE COMPOSITION: AWG 2 2 , TINNED COPPER STRANDED WIRE WITH ETEF INSULATION RATED TO 125’ C. 2. LEAD COLORS:

VDE 0812 S

Abstract: DIN 47100 DIN47100 CEAM cavi 50265-2-1 RAL7032 ceam RAL-7032 LIYCY liycy 8
Contextual Info: CAVI PER ELETTRONICA ED INFORMATICA - SERIE Li-YCY ELECTRONICS AND COMPUTER CABLES - Li-YCY SERIES MULTICOPPIE SCHERMATE - SHIELDED MULTIPAIR CABLES POSA FISSA - FIXED INSTALLATION COMPOSIZIONE - COMPOSITION conduttori / conductors rame nudo, flessibile / flexible bare copper wire

Contextual Info: RSDF FLAME PROOF CARBON POWER RESISTOR TYPE INTRODUCTION Small size, high power, excellent pulse characteristics CARBON COMPOSITION SUBSTITUTE 1 SOLDER PLATED COPPER LEAD WIRE (2) FINE CARBON FILM WITHSTANDING PULSE VOLTAGE (3) NON-FLAMMABLE INSULATING SILICON COATING

Contextual Info: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester

Contextual Info: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester

Contextual Info: HM53-101R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester

Contextual Info: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition

Contextual Info: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g

MC9S08SH8/4

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Abstract: MC9S08JM60 c code example
Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

Contextual Info: HM53-50370HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

Contextual Info: HM56-10100R15LF summary material content, BI Technologies Corporation Index Item Material Name FS2 1 CORE M25 2 3 4 5 ADHESIVE Epoxy Resin COIL Enamelled Copper Magnet Wire SOLDER TAPE Lead Free Solder Tape # 1H860 Element Composition Iron Oxide Nickel Oxide

Contextual Info: HM53-60130HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

Contextual Info: HM53-40360HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating

Contextual Info: HM54-44R42VLF summary material content, BI Technologies Corporation Index Item Material Name Element Composition CAS No Material Mass mg Composition (mg) 7439-89-6 - 1730 1712.7 10.38 6.92 1 CORE Toroid Core Iron Binder Lubricant 2 WIRE NY UEW-H Copper Polyurethane (PU)

Contextual Info: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others

Contextual Info: Lead Information Types: The following paragraphs correlate the terms with the actual lead composition and application. Oxygen free leads are copper wire normally coated with a 60% tin 40% lead composition. The primary function of the coating is to prevent oxidation of the

Contextual Info: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW CERAMIC STRUCTURE ANTI SURGE HIGH VOLTAGE PCF 1 2 3 4 5 6 Metal oxide composition Silver edge Steel caps Cu, Sn plated Solder plated copper wire Welding joint Silicon overcoating IDENTIFICATION PRODUCT CODE COATING COLOR

Contextual Info: HM88-10091R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 ADHESIVE Epoxy Resin 3 COIL Enamelled Copper Wire 4 5 SOLDER DUMMY Lead Free Solder Dummy Lead Element Composition CAS No