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    CQ 455 Search Results

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    Micro Commercial Components MCQ4559-TP

    MOSFET N/P-CH 60V 4.5A/3.5A 8SOP
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    DigiKey MCQ4559-TP Reel
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    MCQ4559-TP Cut Tape
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    MCQ4559-TP Digi-Reel 1
    • 1 $1.15
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    Micro Commercial Components MCQ4559A-TP

    MOSFET N/P-CH 60V 4.5A/3.5A 8SOP
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    DigiKey MCQ4559A-TP Reel 4,000
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    Mouser Electronics MCQ4559A-TP
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    HUBER+SUHNER 33_BNC-QLA-01-1/1--_NE

    RF Adapters - Between Series BNC plug(m) to QLA jack(f)
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    Mouser Electronics 33_BNC-QLA-01-1/1--_NE 7
    • 1 $56.5
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    HUBER+SUHNER 34_BNC-QLA-01-1/1--_UE

    RF Adapters - Between Series BNC jack(f) to QLA jack(f) bulkhead
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    Mouser Electronics 34_BNC-QLA-01-1/1--_UE
    • 1 $72.38
    • 10 $66.34
    • 100 $60.2
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    • 10000 $60.2
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    CQ 455 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Content Addressable Memory

    Abstract: "Content Addressable Memory" ternary content addressable memory IDT75K52134 Ternary CAM IDT75K62134 idt cam QDR cypress ternary
    Text: Product Brief IDT75K52134 IDT75K62134 4.5M and 9M Network Search Engine NSE with QDR Interface To request the full datasheet, please contact your local IDT Sales Representative or call 1-831-754-4555 Introduction Device Description Evolving network speeds require critical functions such as forwarding


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    PDF IDT75K52134 IDT75K62134 drw04aa DSC-6070/00 Content Addressable Memory "Content Addressable Memory" ternary content addressable memory IDT75K52134 Ternary CAM IDT75K62134 idt cam QDR cypress ternary

    Content Addressable Memory

    Abstract: ternary content addressable memory QDR cypress "Content Addressable Memory" idt cam IDT75K52134 IDT75K62134 IXP2400 IXP2800 ternary
    Text: Product Brief IDT75K52134 IDT75K62134 4.5M and 9M Integrated IP Co-Processors IIPC with QDR Interface To request the full product brief, please contact your local IDT Sales Representative or call 1-831-754-4555 Introduction Device Description Evolving network speeds require critical functions such as forwarding


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    PDF IDT75K52134 IDT75K62134 drw04aa DSC-6070/00 Content Addressable Memory ternary content addressable memory QDR cypress "Content Addressable Memory" idt cam IDT75K52134 IDT75K62134 IXP2400 IXP2800 ternary

    Content Addressable Memory

    Abstract: "Content Addressable Memory" Ternary CAM ternary content addressable memory
    Text: Product Brief IDT75K52134 IDT75K62134 4.5M and 9M Integrated IP Co-Processors IIPC with QDR Interface To request the full product brief, please contact your local IDT Sales Representative or call 1-831-754-4555 Introduction Device Description Evolving network speeds require critical functions such as forwarding


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    PDF IDT75K52134 IDT75K62134 drw04aa DSC-6070/00 Content Addressable Memory "Content Addressable Memory" Ternary CAM ternary content addressable memory

    PD44647186AF5-E22-FQ1-A

    Abstract: PD44647366AF5-E25-FQ1-A
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT PD44647094A-A, 44647184A-A, 44647364A-A, 44647096A-A, 44647186A-A, 44647366A-A 72M-BIT QDRTM II+ SRAM 2.0 & 2.5 CLOCK CYCLES READ LATENCY 4-WORD BURST OPERATION Description The μPD44647094A-A and μPD44647096A-A are 8,388,608-word by 9-bit, the μPD44647184A-A and μPD44647186A-A


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    PDF PD44647094A-A, 4647184A-A, 4647364A-A, 4647096A-A, 4647186A-A, 4647366A-A 72M-BIT PD44647094A-A PD44647096A-A 608-word PD44647186AF5-E22-FQ1-A PD44647366AF5-E25-FQ1-A

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT PD44646187A-A 72M-BIT DDR II+ SRAM SEPARATE I/O 2.5 CLOCK CYCLES READ LATENCY 2-WORD BURST OPERATION Description The μPD44646187A-A is 4,194,304-word by 18-bit synchronous double data rate static RAM fabricated with advanced


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    PDF PD44646187A-A 72M-BIT PD44646187A-A 304-word 18-bit M8E0904E

    PD44647366AF5-E22-FQ1-A

    Abstract: No abstract text available
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF M8E0904E PD44647366AF5-E22-FQ1-A

    Untitled

    Abstract: No abstract text available
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF M8E0904E

    Untitled

    Abstract: No abstract text available
    Text: CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 72-Mbit QDR -II SRAM 2-Word Burst Architecture Features Configurations • Separate Independent Read and Write Data Ports ❐ Supports concurrent transactions ■ 267 MHz Clock for High Bandwidth ■


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    PDF CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 72-Mbit CY7C1510JV18 CY7C1525JV18 CY7C1512JV18

    CY7C1510JV18

    Abstract: CY7C1512JV18 CY7C1514JV18 CY7C1525JV18
    Text: CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 72-Mbit QDR -II SRAM 2-Word Burst Architecture Features Configurations • Separate independent read and write data ports ❐ Supports concurrent transactions ■ 267 MHz clock for high bandwidth ■


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    PDF CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 72-Mbit CY7C1510JV18 CY7C1512JV18 CY7C1510JV18 CY7C1512JV18 CY7C1514JV18 CY7C1525JV18

    CY7C1512JV18

    Abstract: CY7C1514JV18 CY7C1525JV18
    Text: CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 72-Mbit QDR II SRAM 2-Word Burst Architecture Features Configurations • Separate Independent Read and Write Data Ports ❐ Supports concurrent transactions ■ 267 MHz Clock for High Bandwidth CY7C1525JV18 – 8M x 9


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    PDF CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 72-Mbit CY7C1512JV18 CY7C1514JV18 CY7C1525JV18

    CY7C1512JV18

    Abstract: CY7C1514JV18 CY7C1525JV18
    Text: CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 72-Mbit QDR II SRAM 2-Word Burst Architecture Features Configurations • Separate Independent Read and Write Data Ports ❐ Supports concurrent transactions ■ 267 MHz Clock for High Bandwidth CY7C1525JV18 – 8M x 9


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    PDF CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 72-Mbit CY7C1512JV18 CY7C1514JV18 CY7C1525JV18

    Untitled

    Abstract: No abstract text available
    Text: THIS SPEC IS OBSOLETE Spec No: 001-14435 Spec Title: CY7C1525JV18 CY7C1512JV18 CY7C1514JV18, 72-MBIT QDR R II SRAM 2-WORD BURST ARCHITECTURE Sunset Owner: Anuj Chakrapani (AJU) Replaced by: None CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 72-Mbit QDR II SRAM 2-Word Burst


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    PDF CY7C1525JV18 CY7C1512JV18 CY7C1514JV18, 72-MBIT CY7C1514JV18 CY7C1525JV18 CY7C1512JV18

    gs8182q36

    Abstract: No abstract text available
    Text: GS8182Q18/36D-200/167/133 18Mb Burst of 2 SigmaQuad-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 200MHz133MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


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    PDF GS8182Q18/36D-200/167/133 165-Bump 165-bump, 144Mb 200MHz 133MHz 8182Qxx gs8182q36

    Untitled

    Abstract: No abstract text available
    Text: GS8182Q18/36D-200/167/133 200MHz133MHz 1.8 V VDD 1.8 V and 1.5 V I/O 18Mb Burst of 2 SigmaQuad-II SRAM 165-Bump BGA Commercial Temp Industrial Temp SigmaRAM Family Overview Bottom View 165-Bump, 13 mm x 15 mm BGA 1 mm Bump Pitch, 11 x 15 Bump Array JEDEC Std. MO-216, Variation CAB-1


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    PDF GS8182Q18/36D-200/167/133 165-Bump 165-bump, 144Mb 200MHz 133MHz 8182Qxx

    Untitled

    Abstract: No abstract text available
    Text: GS8182T19/37BD-435/400/375/333/300 18Mb SigmaDDR-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaDDR-II Interface • Common I/O bus • JEDEC-standard pinout and package


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    PDF GS8182T19/37BD-435/400/375/333/300 165-Bump 165-bump, 818TxxBD

    Untitled

    Abstract: No abstract text available
    Text: GS8182T19/37BD-435/400/375/333/300 18Mb SigmaDDR-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaDDR-II Interface • Common I/O bus • JEDEC-standard pinout and package


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    PDF GS8182T19/37BD-435/400/375/333/300 165-Bump 165-bump, 818TxxBD

    GS818

    Abstract: No abstract text available
    Text: GS8182T19/37BD-435/400/375/333/300 18Mb SigmaCIO DDR-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 435 MHz–300 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaCIO Interface • Common I/O bus


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    PDF GS8182T19/37BD-435/400/375/333/300 165-Bump 165-bump, 818TxxBD GS818

    RAM32M

    Abstract: RAM64X1D SRLC32E RAM128X1D RAM256X1S SRL32 RAM64M ROM64x1 XC6VLX75T ROM256x1
    Text: Virtex-6 FPGA Configurable Logic Block User Guide Virtex-6 FPGA CLB [optional] UG364 v1.1 September 16, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development


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    PDF UG364 RAM32M RAM64X1D SRLC32E RAM128X1D RAM256X1S SRL32 RAM64M ROM64x1 XC6VLX75T ROM256x1

    BW110

    Abstract: No abstract text available
    Text: Preliminary GS8182T19/37BD-450/435/400/375/333/300 18Mb SigmaCIO DDR-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 450 MHz–300 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaCIO Interface


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    PDF GS8182T19/37BD-450/435/400/375/333/300 165-Bump 165-bump, GS818Tx36BD-300T. 818TxxBD BW110

    CV7105

    Abstract: No abstract text available
    Text: NJM2247A/B mu m If l- NJM2247A/B i, ts ^5 — 7.— A — f >/1? — K (Y , T*To 7 - f y ^ l / 3 > ij, Y, ^ - T .A V R-Y, R-Y, X-<n&WM B-Y hP — =fc B - Y il- t ^ if ib t iS f o K T 'O T f f - t M S C J : U, fcnTtiC L T l ' i t . tt HJH2247ANI/BM • 5 V # .—


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    PDF NJM2247A/B NJM2247A/Blà njm2247am/bm DMP20 165mV CV7105

    Untitled

    Abstract: No abstract text available
    Text: 10 MAT'L NO. ENG NO. 15-24-4557 A -89 81-4 V 4 -LF 9.53 .375 TYP. 0.74 .029 5.08 RECOMMENDED PCB HOLE LAYOUT .200 I V /// /// /M X /, NOTES : 0 2.10 ±0.03 . . 6.98 .275 l"56±0" 10 4X .06 l±.004 I. PLATING POSTPLATE 0 .0 0 2 5 4 /.0 0 0 I00 MIN. TIN


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    PDF 8981-4P2 PS-8981-4V4/4R UL94V-0

    d1943g

    Abstract: PD1943 PD6120 HPD-61
    Text: MOS INTEGRATED CIRCU IT , / ¿ P D 6 1 2 1 „.• D ■T! Pint >Kitsnoiefi aimçmO Î? two or,tOM»ito?Vi art1 tte>' M U L T I- P U R P O S E R EM O T E C O N T R O L T R A N S M IT T E R 1C C M O S LS I D ESCRIPTIO N The ¿¿PD6121 is an infrared remote control transmitter LSI for T V , V C R , stereo components, cassette decks, air con­


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    PDF uPD6121 WS60-00 bM27525 d1943g PD1943 PD6120 HPD-61

    uPD6120

    Abstract: npd19 KL SN 102 PD1913 Li42 UD1943 ud271 27S9S KL 13 diode UPD6120C102
    Text: MOS DIGITAL INTEGRATED CIRCU IT /¿ P D 6 1 2 0 M U L T I- P U R P O S E R E M O T E C O N T R O L T R A N S M IT T E R IC C M O S LSI D ESCRIPTIO N The pPD6120 is an LSI for the transmission of general-purpose, infrared, remote control codes to TV s, V TR s, audio equip­


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    PDF uPD6120 457sas /IPD6120 npd19 KL SN 102 PD1913 Li42 UD1943 ud271 27S9S KL 13 diode UPD6120C102

    HOA0825-4

    Abstract: HOA0825-1 HOA0825-3 HOA0825-2 7N55 6n55 2N55 HOA0825 1T55 5T55
    Text: HONEYWELL INC/ MICRO M1E D • 4551330 0013fl75 1 *HONl T - Ml-73 Transmissive With Plastic Encapsulated Components Assemblies Assem blies on this page are based on plastic-encapsulated components from the SEP8506 and SDP8406 device fam ilies. All sensors are phototransistors.


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    PDF Ml-73 SEP8506 SDP8406 HOA0825-1 HOA0825-2 HOA0825-3 HOA0825-4 -0-L51 060x0 -0-L55 HOA0825-4 HOA0825-1 HOA0825-3 HOA0825-2 7N55 6n55 2N55 HOA0825 1T55 5T55