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    CQ06PF

    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &


    Original     		PDF CQ06PF 55mmx 63VDC 63VAC. CQ06PF

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    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &


    Original     		PDF CQ06PF 55mmx 63VDC 63VAC. CQ06PF