CQFP 208 Search Results

RTAX2000S

Abstract: rtax2000 RTSX32SU-CQ208E RTSX32SU-CQ84E 5962-0422101QXC rtax2000s-cq352e 5962-0422102QXC 5962-0422104QNA rtsx32su apa600-cq208b
Contextual Info: DSCC Cross Reference Guide Table 1: Actel Part Numbers to DSCC Drawing Numbers Actel Part Number Devices A1010B A1020B Pin-Package 84-CPGA 84-CPGA 84-CQFP A1240A A1280A 132-CPGA 176-CPGA 172-CQFP A1280XL 176-CPGA 172-CQFP A1425A A1460A A14100A 132-CQFP 207-CPGA

TEA 1732

Abstract: A09 N03
Contextual Info: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

RTAX1000S

Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Contextual Info: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP 240
Contextual Info: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most

Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

8N07

Abstract: 030 b03 cn/A/U 237 BG
Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

2 010 073 007

Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Contextual Info: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a

b09 n03

Abstract: B07 P03
Contextual Info: 1. 6 Pow erPC 604e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 604e C4-CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C 4 - C Q F P P a c k a g e Table 10 provides the pinout listing for the 604e C4-CQFP package.

CERAMIC QUAD FLATPACK CQFP

Abstract: 8361H CY7C37512P208B-UM
Contextual Info: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069

5271SC

Abstract: military mcm 1553 military mcm cpu R4400 RM5271
Contextual Info: Standard Products ACT5271SC Multichip Module Microprocessor with 2MB Secondary Cache www.aeroflex.com/Avionics May 5, 2005 FEATURES ❑ Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack CQFP

QL24X32B-1PQ208C

Abstract: ql24x32b PF144 PQ208 QL24X32B-1PF144C
Contextual Info: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F

DSP96000

Abstract: DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 brand tai hen FE60 marking ha02 Nippon capacitors
Contextual Info: Freescale Semiconductor, Inc. Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package.

FBGA-484

Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly

QL24X32B-1PF144C

Abstract: OPTOCOUPLER 817c data sheet 77-I PF144 PQ208 QL24X32B-1PQ208C
Contextual Info: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

emcp 162

Abstract: DL10 DL12 emcp TEA 2111 WT111 eMCP qualification dh29 code
Contextual Info: WC64P603EV-XQ3X RISC 603e MODULE, SECONDARY L2 CACHE ADVANCED * MAIN FEATURES • Based on RISC 603e 3.3V Microprocessor ■ Processor Clock Frequencies: 66.6, 80, 100 MHz ■ Footprint compatible with 603e µp CQFP package ■ Bus Clock Frequencies: Up to 66.6 MHz

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

UT6325

Abstract: 484-CLGA CL484 CQFP 208 datasheet PBGA 484P UT-SG-CQ208 CQ208 QT-SG-PS484
Contextual Info: RadHard Eclipse Devices UT6325-W* 208-PQFP 9 N/A UT8RHEEB-208PC UT8RHE-SKT208P N/A N/A QT-SG-PQ208 9 UT6325-X* 208-CQFP 9 9 UT8RHEEB-208PC UT8RHE-SKT208C UT8RHE-SKT208P with proper land pads 9 UT-SG-CQ208 9 UT6325-P* 280-PBGA 9 N/A UT8RHEEB-288PC UT8RHE-SKT280P

Analog Dialogue

Abstract: la 4440 amplifier circuit diagram 300 watt ad7730 pcb circuit example cd player amplifier double ic 4440 matlab code for filter Emg signal motorcycle regulator microcontroller based water level controller circuit pcb ad7730 AD7730 weighing scale code example 0.2MF CAPACITOR
Contextual Info: A forum for the exchange of circuits, systems, and software for real-world signal processing Li-Ion BATTERY CHARGING REQUIRES ACCURATE VOLTAGE SENSING page 3 Quad-SHARC in CQFP—A 480-MFLOPS DSP Powerhouse (page 10) Ask the Applications Engineer—Capacitive Loads on Op Amps (page 19)

Contextual Info: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </

schematic impulse sealer

Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Contextual Info: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").