CRACK Search Results

2012size

Contextual Info: PSF www.vishay.com Vishay Dale Metal Film Resistors, High Precision, High Stability, Surface Mount FEATURES • Extremely low temperature coefficient of resistance • Molded encapsulation • Wraparound compliant terminations eliminate the risk of solder fillet cracking

100812

Abstract: H63A
Contextual Info: Ferrite Chip EMI Suppressors ACB Series RELIABILITY AND TEST CONDITIONS Item Performance Operating temperature range -2 5 to +85°C Test conditions Storage temperature and humidity ranges 40°C max., 70%RH max. Soldering heat resistance The chip must have no cracks.

Contextual Info: Multilayer Ceramic Chip Capacitors FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • WIDE VOLTAGE RANGE 16V TO 5KV • HIGH CAPACITANCE (UP TO 10 F) • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* NMC-P Series RoHS Compliant

Open Mode Capacitors

Contextual Info: X7R Open Mode and Tandem MLCC Capacitors Open Mode Range Open Mode capacitors have been designed specifically for use in applications where mechanical cracking is a severe problem and short circuits due to cracking are unacceptable. Open Mode capacitors use inset electrode margins, which prevent any mechanical cracks

Contextual Info: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren’t recommended because of cracking. The natural

Contextual Info: 7 PART NUMBER AWG DIM B DIM C 5 6 DIM E DIM F 5D-82024-*«01 TYPE OF FORM 4 3 2 CODE A STRIP C 5D-82024-««02 LOOSE PIECE C 1. MA X BURR .005/.002 : NO CRACK5. 5L1VER5 OR ORANGE PEEL 5D-82024— 03 5TRIP A 2. MA X CAMBER 3.175/. 125 IN 610/24 5D-82024—

Contextual Info: MULTILAYER VARISTORS Reliability and Test Conditions ITEM 0402 Operating temp. Range Storage temp. & humidity Requirements 0603 0805 Test Condition 1206 -55 ~ +125°C - 40°C max, 70% RH max. Packed Condition Resistance to solder heat 1. No damage such as cracks should be visible in chip element.

mch 210

Contextual Info: Types MCH and MCHN Multilayer RF Capacitors 2500 Volt RF Capacitors for Medical Imaging Coils, Plasma Generators, Transmitters and Antenna Tuning with Nonmagnetic Option Mica’s natural rugged flexibility and high tempera ture threshold eliminates cracking and permits wave

code 8r2

Contextual Info: Multilayer Ceramic Capacitors OP Series OPEN-MODE DESIGN MERITEK FEATURES • • • Minimize the short curcuit probability due to flex cracks High current applications Input side filtering PART NUMBER SYSTEM OP 0805 XR 101 K 500 Meritek Series Size Dielectric

Contextual Info: Multilayer Ceramic Chip Capacitors FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • WIDE VOLTAGE RANGE 16V TO 5KV • HIGH CAPACITANCE (UP TO 10 F) • RoHS COMPLIANT • SAC SOLDER COMPATIBLE* NMC-P Series RoHS Compliant

1210 ceramic capacitor .22uf 10 250V

Abstract: capacitor 560 pF 500V 0.018uf NMCP1206X7R
Contextual Info: Multilayer Ceramic Chip Capacitors NMC-P Series FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • X7R DIELECTRIC, HIGH VOLTAGE 50V TO 1KV • WIDE VALUE RANGE (180pF ~ 2.2µF) includes all homogeneous materials • RoHS COMPLIANT

Contextual Info: application brief AB13 Soldering SuperFlux LEDs SuperFlux LEDs HPWx xxxx Standard Part Numbers Caution is recommended with the preheat conditions to ensure that the LED lamps are not damaged due to prestressing. Prestress damage can result in cracks and/or delamination of structures within the device.

Contextual Info: MIOCONNECTOR Board-to-wire HIT Features ●Low profile AIT Using the short length female terminal, low profile is realized. HCM ●Solder crack prevention configuration Pin configuration of PC board side connector is designed for solder crack prevention. MIO

SHCM-A03T-P025

Abstract: SHCM-A04T-P025
Contextual Info: MIOCONNECTOR Board-to-wire Features ●Low profile Using the short length female terminal, low profile is realized. ●Solder crack prevention configuration Pin configuration of PC board side connector is designed for solder crack prevention. ●Reliability

din 74234

Abstract: din 73378 TUBE din 73378 74234 BS5409 High pressure polyurethane TUBE din 74234 T50Y0007
Contextual Info: Non-Return Valves T50 Series In Line Push-ln Non-Return Valves 4, 6, 8 , 1 0 , 12m m 0 D M etric tube 5/32m, W , 5/i6 M, 3/8m, 1/ 2 mInch tube • A llow free flo w in one direction only • S im ple reliable design • Low w eight • Low cracking pressure

E107536

Contextual Info: Date 02/17/12 03/09/12 SYM A B REVISION RECORD AUTH DR. CK. Updated Specification Updated UL Rating T.B. B.S. T.B. B.S. 25.40 [1.00] i 2.59 [0.10] 1 ~ SPECIFICATIONS: * Material- Polypropylene, High environment stress crack resistance, Color Clear Flammability rating: UL94-HB, file no. E107536

PSF20

Contextual Info: PSF www.vishay.com Vishay Dale Metal Film Resistors, High Precision, High Stability, Surface Mount FEATURES • Extremely low temperature coefficient of resistance • Molded encapsulation • Wraparound compliant terminations eliminate the risk of solder fillet cracking

X7RA

Contextual Info: VJ OMD - X7R Vishay Vitramon Surface Mount Ceramic Capacitor Solutions for Boardflex Sensitive Applications FEATURES • OMD-Cap reduce the risk of shorts or low IR because of board flex cracks. RoHS • Efficient low-power consumption, ripple current COMPLIANT

array resistor

Abstract: MORY mechanical engineering ESD process MEMORY MODULE
Contextual Info: Memory Module Handling Guide Since 2005 Module Module Process Process Engineering Engineering Group Group 1 11 Overview Recently memory module failure related with TSOP, FBGA or 4 array resistor crack has increased. Main root causes are mechanical damage caused by wrong handling

EK 110

Abstract: WSF2012 WSF201 WSF4527 WSF25
Contextual Info: WSF Vishay Dale Metal Film Resistors, Power, Surface Mount FEATURES • Molded encapsulation • Wraparound Compliant Terminations eliminate risk of solder fillet cracking Pb-free Available e3 • Solderable terminations • Excellent stability at different environmental

Contextual Info: N D T E S iU n le s s o th e r w is e s p e c ifie d , IMMATERIAL: FLUOROPOLYMER, THERMOPLASTIC. COLOR BLACK. 2. PARTS SHALL BE FREE OF FLASH, VOIDS, SINKS, SHORTS, AND CRACKS. A | B INITIAL RELEASE |ADDED TABLE TO THE DRAWING. 0 .0 7 2 T_ J 4 9B 7/20/92 524

DC varistor

Abstract: 14D220K VCR-14D220K vcr14d vcr14 VCR-14D 14D220 2003UL
Contextual Info: 規 格 承 認 書 SPECIFICATION SPECIFICATION PART NO. NO. PAGE 1 OF 2 VCR-14D220K DATE: 07 Augest, 2003 UL CSA 1. Machenical Requirements 1.1 1.2 APPEARANCE WITHOUT ANY CRACK, MARKING SHOULD BE CLEAR DIMENSIONS DIMENSIONS mm w 2.ELECTRICAL PARAMETER 2.1

Contextual Info: Crimp 2.5mm XAD CONNECTOR Disconnectable Crimp style connectors .098" pitch Features ––––––––––––––––––––––– • Solder crack prevention The header wafer is manufactured using glass-filled PA66 nylon, as a prevention against solder crack.

MC18

Abstract: 1210 case 8290 Cornell Dubilier MC08CA010D-F MC08CA020D-F MC08CA030D-F MC08CA070D-F MC08CA080D-F MC08CA090D-F
Contextual Info: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren’t recommended because of cracking. The natural mica