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    CSP 1088 Search Results

    CSP 1088 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    DA14531-00OGDB-P Renesas Electronics Corporation SmartBond TINY™ DA14531 Bluetooth® Low Energy 5.1 System-on-Chip Development Kit Pro - WL-CSP Daughterboard Visit Renesas Electronics Corporation

    CSP 1088 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CSP1088 Lucent Technologies Original PDF
    CSP1088 AT&T Microelectronics GSM Conversion Signal Processor for Cellular Handset and Modem Applications V2.2 Scan PDF

    CSP 1088 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    0.3mm pitch csp package

    Abstract: 116PIN qfp 20x20 0.3mm pitch package bga
    Text: CSP Chip Size Package small! CSP Chip Size Package • CSP(Chip Size Package)とは? チップサイズとほぼ同じ大きさにつくることのできるパッケージを総称して 「CSP」 といいます。 チップサイズとパッケージ外形サイズが同じものは特にリアルチップサイズタイプと呼ばれて


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    PDF 8mm120 5mm208 C13185JJ2V0PF00 0.3mm pitch csp package 116PIN qfp 20x20 0.3mm pitch package bga

    Untitled

    Abstract: No abstract text available
    Text: STLED524 Intelligent matrix LED display driver Datasheet - preliminary data Description CSP 56 bumps 0.4 mm pitch 3.4x3.0 mm Features • Operating input voltage range from 2.7 V to 5.5 V • 5x24 LED matrix driver • Adjustable luminance separately for each LED


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    PDF STLED524 STLED524 DocID026217

    D78 NEC

    Abstract: spx 1404 DSPG 71051 MCM NAND VR10000 NEC 71055 986M
    Text: CB-C10 2.5-Volt, 0.25-Micron drawn CMOS Cell-Based ASIC NEC Electronics Inc. Preliminary March 1997 Figure 1. Chip Size Package (CSP) Description NEC’s 0.25 µm drawn (0.18 µm L-effective) CB-C10 family incorporates ultra-high-performance cores with deep submicron process technology for high-end applications


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    PDF CB-C10 25-Micron CB-C10 A12504EU1V0DS00 D78 NEC spx 1404 DSPG 71051 MCM NAND VR10000 NEC 71055 986M

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


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    PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    LPC TPM

    Abstract: lpc interface ST19WP18 ST19WP18-TPM-C TSSOP28 Trusted platform module SERIRQ intel LPC interface spec 1.0 lad1 NTRU Cryptosystems
    Text: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)


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    PDF ST19WP18-TPM-C 2000/XP 33-MHz LPC TPM lpc interface ST19WP18 ST19WP18-TPM-C TSSOP28 Trusted platform module SERIRQ intel LPC interface spec 1.0 lad1 NTRU Cryptosystems

    intel LPC interface spec 1.0

    Abstract: No abstract text available
    Text: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)


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    PDF ST19WP18-TPM-C 2000/XP 33-MHz ST19W ST19WP18-TPM-C intel LPC interface spec 1.0

    LPC TPM

    Abstract: ST19WP18-TPM-C ST19WP18 TSSOP28 PKCS-11 st19wp18-tpm intel LPC interface spec 1.0
    Text: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)


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    PDF ST19WP18-TPM-C 2000/XP 33-MHz LPC TPM ST19WP18-TPM-C ST19WP18 TSSOP28 PKCS-11 st19wp18-tpm intel LPC interface spec 1.0

    TQFP 44 PACKAGE footprint

    Abstract: CSP1035A "voice codec" modem qam v.29 telephone modem caller id pin csp1035 DP2V90DX CSP1034C DP2V32DX FSK 9600 line modem
    Text: Product Brief, Rev. 1 May 2002 Agere Systems DP2Vxx Data Pump Chip Sets Features • Two-chip V.92 modem solution: — DP2Vxx in 48-pin TQFP — CSP1034C in a 48-pin TQFP package or CSP1035A in a 48-pin TQFP package ■ Data mode capabilities: — ITU-T V.92: 56000 bits/s—28000 bits/s


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    PDF 48-pin CSP1034C CSP1035A bits/s--28000 bits/s--2400 27ter: PB02-019DMOD-1 TQFP 44 PACKAGE footprint "voice codec" modem qam v.29 telephone modem caller id pin csp1035 DP2V90DX DP2V32DX FSK 9600 line modem

    Bull CP8 chip specs

    Abstract: SERIRQ LPC TPM intel LPC interface spec 1.0 lpc interface year 2000 compliant motherboard LAD1 Trusted platform module mobile MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD CIRCUIT diagram full
    Text: ST19WP18 Trusted Platform Module TPM DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ FULL TPM SOLUTION WITH COMPLETE TCG COMPLIANT SOFTWARE STACK LAYERS ■ 33-MHz LOW PIN COUNT (LPC) INTERFACE V1.1


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    PDF ST19WP18 33-MHz ST19W 1088-bit Bull CP8 chip specs SERIRQ LPC TPM intel LPC interface spec 1.0 lpc interface year 2000 compliant motherboard LAD1 Trusted platform module mobile MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD CIRCUIT diagram full

    TDA4866

    Abstract: BC548 pin diagram pic 817 texas flyback flyback data pin diagram TCI International transistor current booster circuit v guard ups 1N4448 BC556
    Text: INTEGRATED CIRCUITS DATA SHEET TDA4866 Full bridge current driven vertical deflection booster Product specification Supersedes data of 1996 Oct 10 File under Integrated Circuits, IC02 1999 Jun 14 Philips Semiconductors Product specification Full bridge current driven vertical deflection


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    PDF TDA4866 TDA4866 TDA485xx. 545004/04/pp16 BC548 pin diagram pic 817 texas flyback flyback data pin diagram TCI International transistor current booster circuit v guard ups 1N4448 BC556

    ST19NP18-TPM

    Abstract: GPI05 EEPROM at TSSOP28 ST19NP18 Trusted platform module v11b GPI04
    Text: ST19NP18-TPM Trusted Platform Module TPM Data Brief Features • Single-chip Trusted Platform Module (TPM) ■ Embedded TPM 1.2 firmware ■ TPM driver for BIOS and Windows 2000/XP 33-MHz Low Pin Count (LPC) interface V1.1 ■ Compliant with TCG PC client specific TPM


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    PDF ST19NP18-TPM 2000/XP 33-MHz ST19N 1088-bit 140xtend ST19NP18-TPM GPI05 EEPROM at TSSOP28 ST19NP18 Trusted platform module v11b GPI04

    LPC TPM

    Abstract: ST19WP18 ST19WP18-TPM-A TSSOP28 SMARTCARD IC intel LPC interface spec 1.0 SERIRQ PC Bios diagram Trusted platform module tpm tssop28
    Text: ST19WP18-TPM-A Trusted Platform Module TPM With Bios and Windows Device Driver DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP 33-MHz LOW PIN COUNT (LPC)


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    PDF ST19WP18-TPM-A 2000/XP 33-MHz ST19W 1088-bit LPC TPM ST19WP18 ST19WP18-TPM-A TSSOP28 SMARTCARD IC intel LPC interface spec 1.0 SERIRQ PC Bios diagram Trusted platform module tpm tssop28

    CSP1034

    Abstract: SV92P D0670 csp1035 CSP1035A agere 1034c CSP1034C 100-PIN 48-PIN S28000
    Text: Product Brief February 2002 SV92P PCI Soft Modem Chip Set Features • Two-chip 3.3 V soft modem solution with an integrated 5 V tolerant PCI interface ■ Data mode capabilities: — ITU-T V.92*: 56000 bits/s—28000 bits/s — ITU-T V.90*: 56000 bits/s—28000 bits/s


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    PDF SV92P CSP1034C CSP1035A bits/s--28000 bits/s--2400 32bis, 42bis CSP1034 D0670 csp1035 agere 1034c 100-PIN 48-PIN S28000

    AGERE

    Abstract: CSP1034S CSP1035A tcm Bell-202 CSP1034S-T11-DB DP2V90DX FSK 9600 DP2L17X FSK 9600 line modem DP2L34X
    Text: Product Brief Rev. 1 December 2004 DP2 Data Pump Chip Sets Features Q Q Q Q Q Q Two-chip modem solutions: — DP2xxx in 48-pin TQFP. — CSP1034S in a 48-pin TQFP package or CSP1035A in a 48-pin TQFP package. Data mode capabilities range: 2400 bits/s—56000 bits/s.


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    PDF 48-pin CSP1034S CSP1035A bits/s--56000 bits/s--33600 CSP1034S) CSP1035A) PB03-032DMOD-1 AGERE tcm Bell-202 CSP1034S-T11-DB DP2V90DX FSK 9600 DP2L17X FSK 9600 line modem DP2L34X

    ST19NP18-TPM

    Abstract: LPC TPM TPM module Low Pin Count LPC Interface Specification embedded firmware GPI05 TSSOP28 ST19NP18 Trusted platform module CT 2048
    Text: ST19NP18-TPM Trusted Platform Module TPM Data Brief Features • Single-chip Trusted Platform Module (TPM) ■ Embedded TPM 1.2 firmware ■ TPM driver for BIOS and Windows 2000/XP 33-MHz Low Pin Count (LPC) interface V1.1 ■ Compliant with TCG PC client specific TPM


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    PDF ST19NP18-TPM 2000/XP 33-MHz TSSOP28 ST19N 1088-bit ST19NP18-TPM LPC TPM TPM module Low Pin Count LPC Interface Specification embedded firmware GPI05 TSSOP28 ST19NP18 Trusted platform module CT 2048

    Trusted platform module

    Abstract: intel 1088 pin diagram
    Text: ST19WP18-TPM-A Trusted Platform Module TPM With Bios and Windows Device Driver DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP 33-MHz LOW PIN COUNT (LPC)


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    PDF ST19WP18-TPM-A 2000/XP 33-MHz ST19W 1088-bit ST19WP18-TPM-A Trusted platform module intel 1088 pin diagram

    Trusted platform module

    Abstract: 1. Mobile Computing block diagram
    Text: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)


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    PDF ST19WP18-TPM-B 2000/XP 33-MHz ST19W 1088-bit ST19WP18-TPM-B Trusted platform module 1. Mobile Computing block diagram

    LPC TPM

    Abstract: GPI05 ST19WP18 ST19WP18-TPM-A TSSOP28 v11b
    Text: ST19WP18-TPM-A Trusted Platform Module TPM With Bios and Windows Device Driver DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP 33-MHz LOW PIN COUNT (LPC)


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    PDF ST19WP18-TPM-A 2000/XP 33-MHz ST19W 1088-bit LPC TPM GPI05 ST19WP18 ST19WP18-TPM-A TSSOP28 v11b

    ST19WP18-TPM-B

    Abstract: year 2000 compliant motherboard LPC TPM ST19WP18 TSSOP28 "multiplexed command" pkcs-11
    Text: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)


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    PDF ST19WP18-TPM-B 2000/XP 33-MHz ST19W 1088-bit ST19WP18-TPM-B year 2000 compliant motherboard LPC TPM ST19WP18 TSSOP28 "multiplexed command" pkcs-11

    ISO-9002

    Abstract: 3M Philippines 1s01 NEPS-90 NEC Components Philippines nec d 75 p NEC 027 ISO9002
    Text: 製品開発の ベストパートナーを目指す NECのプリント配線板 最先端から汎用製品まで あらゆるニーズに応えます。 ビルドアップ・プリント配線板 「DVマルチ」 高密度多層プリント配線板


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    PDF 100MHz EP0500JJ2V0SG00 ISO-9002 3M Philippines 1s01 NEPS-90 NEC Components Philippines nec d 75 p NEC 027 ISO9002

    Lucent w2020

    Abstract: BA rx transistor ba rx equalizer algorithm multipath 7495 function table W2020 T 1734 CSP1088 csp 1088 roaming mobile
    Text: Application Note January 1997 Example for a Gain Tracking Algorithm Required in a GSM Terminal Based on the Lucent Technologies Sceptre Platform Introduction This note gives an example implementation of the gain tracking algorithm required in a GSM physical


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    PDF AP97-004WDSP Lucent w2020 BA rx transistor ba rx equalizer algorithm multipath 7495 function table W2020 T 1734 CSP1088 csp 1088 roaming mobile

    Untitled

    Abstract: No abstract text available
    Text: E522.31/33 SWITCH-MODE CONSTANT CURRENT LED CONTROLLER FAMILY ADVANCE PRODUCT INFORMATION - MAR 6, 2013 Features General Description ÿ Switch-mode, single LED controller ÿ 5.0V to 55V input voltage range, up to 80V boosted output voltage ÿ Boost-, Boost-to-battery-, Buck-to-battery- or SEPICtopology


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    PDF 100Hz

    D78 NEC

    Abstract: 986M
    Text: CB-C10 2.5-Volt, 0.25-M icron drawn CMOS Cell-Based ASIC NEC NEC Electronics Inc. Preliminary March 1997 Figure 1. Chip Size Package (CSP) Description NEC’s 0.25 n.m drawn (0.18 (j.mL-effective)CB-C10family incorporates ultra-high-performance cores with deep sub­


    OCR Scan
    PDF CB-C10 CB-C10family D78 NEC 986M

    S56000

    Abstract: CSP1035A CSP1034S DP2V90DX FSK 9600 DP2L17X t32c pll modem v.92 ITU-T V92 l-dp2l34x
    Text: systems age re Product Brief Rev. 1 December 2004 DP2 Data Pump Chip Sets Features Introduction • Two-chip modem solutions: — DP2xxx in 48-pin TQFP. — CSP1034S in a 48-pin TQFP package or CSP1035A in a 48-pin TQFP package. The new DP2 fam ily of devices is designed to serve


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    PDF 48-pin CSP1034S CSP1035A CSP1034S) CSP1035A) PB03-032DMQD-1 S56000 DP2V90DX FSK 9600 DP2L17X t32c pll modem v.92 ITU-T V92 l-dp2l34x