DAP 07 Search Results

dap 002

Abstract: DAP 018 dap002 DAP 02 power supply DAP 002 power supply 5sdb
Contextual Info: THICK FILM K 5 l/ B'ÌE D TRIAN6LE ATTENUATORS, DIGITAL • T - 74 * HIGH RELIABILITY S0M1S0B 00 01 1^ 3 0^ - - 1 1 H K D IT DAP SERIES 20-2000 MHz GENERAL INFORMATION: The DAP Series of Thick Film digital attenuators offers high reliability for operation up to 2 GHz. The

dap 002

Abstract: dap002 DAP 018 DAP 002 power supply DAP 02 power supply dap 11 DAP0024 til 710
Contextual Info: THICK FILM i I M t t l l U U U " " DAP SERIES ATTENUATORS, DIGITAL 20-2000 MHz HIGH RELIABILITY GENERAL INFORMATION: The DAP Series of Thick Film digital attenuators offers high reliability for operation up to 2 GHz. The plug-in style package offers a very reliable, easy to use and cost

AIC331

Abstract: PD3048 TAS1020B TLV320AIC33 SLAA301 AIC33EVM TLV320AIC3x AIC33
Contextual Info: Application Report SLAA301 – July 2006 Using TDM Function to Interface Four TLV320AIC33 Codecs With a Single Host Processor Wendy Fang . DAP - Industrial Audio

ECM microphone

Abstract: electret condenser microphone preamplifier block diagram OF CONDENSER MICROPHONE two wire electret microphone AIC33 condenser microphone preamplifier from texas AIC33EVM electret condenser microphone preamplifier from texas microphone filter electret condenser mic 3 pin
Contextual Info: Application Report SLAA275 – November 2005 Using the Digital Microphone Function on TLV320AIC33 With AIC33EVM/USB-MODEVM System Wendy Fang and Mark Toth . DAP Group

c311c

Abstract: C398C ACTP-105 DUT12 c311c310c460 c403c ADS8410 ADS8413 CDCF5801 SN65LVDS152
Contextual Info: Application Report SLAA296 – May 2006 Using ADS8410/13 in Daisy-Chain Mode Bhaskar Goswami, Vikash Sethia . DAP Nyquist ABSTRACT Many applications require multiple analog-to-digital converters ADC in a system.

L2208

Contextual Info: MICRO LINEAR 25E D • bGH341A 0000331 5 ■ October 1989 7T<7 ^ Micro Linear PRELIMINARY ML2200, ML2208 Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The ML2200 and ML2208 Data Acquisition Peripherals DAP are monolithic CMOS data acquisition subsystems. These

Contextual Info: ORAHtm MAX IN THJUO AH9LÊ PROJgCTJON THIS DRAWING IS ÜNPU0LISHEO, COPYRIGHT 19 LOC RELEASED FOR PUBLICATION ,19 BY AMP INCORPORATE! . ALL INTERNATIONAL RIGHTS RCSCRVCO. OZST REVISIONS 74 ZONE DESCRIPTION LTR OATE APPO REV,RDRW,£ SM PKG PER 0720-0040-93 3-70-93 \&DAP

Contextual Info: SOLDER TERMINALS - MOULDED DAP, TWIN TURRET Dimensions in inches mm See page 94 for recommended Anvil and Punch How to order code 572 - 4XXX - XX - XX - 16 Insulator Colour Basic Part No. Material Code Table Component Material RoHS Insulator Diallyl ✓

Contextual Info: DRAWING K A K IN Th IRQ ANQLC PROJECTION THIS DRAWING TS UNPUBLISHED. COPYRIGHT 19 LOC RELEASED FOR PUBLICATION BY AMP INCORPORATED. oisr 14 ALL INTERNATIONAL RIGHTS RESERVED. REVISIONS ZONE LTR DESCRIPTION OATE APPO REV,RDRW,£ 5M PKG PER 0720-0040-93 3-10-33 Ï&DAP

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: ALSO AVAILABLE High Temperature High Voltage Disc Capacitors Call Factory for More Information DAP up to 220°C

Contextual Info: O ctober 1990 PRELIMINARY ML2200 ML22Q8 *e,M icro Linear 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The ML2200 and ML2208 Data Acquisition Peripherals DAP are monolithic CMOS data acquisition subsystems. These data acquisition peripherals feature an input multiplexer, a

Contextual Info: SOLDER TERMINALS - MOULDED DAP, SINGLE TURRET Dimensions in inches mm See page 94 for recommended Anvil and Punch How to order code 572 - 4XXX - XX - XX - 16 Insulator Colour Basic Part No. Material Code Table Component Material RoHS Insulator Diallyl ✓

RT5854

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

Contextual Info: SOLDER TERMINALS - MOULDED DAP, PIN Dimensions in inches mm See page 94 for recommended Anvil and Punch How to order code 572 - 48XX - XX - XX - 16 Insulator Colour Basic Part No. Material Code Table Component Material RoHS Insulator Diallyl ✓ Mounting Stud

RT6864

Contextual Info: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS L MECHANICAL: DAP up to 220°C Code B PEEK up to 240°C Code P Leads: Solder coated copper clad steel is standard;

TSC2301SPI

Abstract: AT91RM9200 PXA250 TSC2301
Contextual Info: Application Report SLAA187 - December 2003 TSC2301 WinCE Generic Drivers Yannick Chammings—WinCE Consultant, ADESET Inc., France ychammings@adeset.com Wendy X. Fang —Application Engineer, DAP Group, Texas Instruments, Dallas, TX, USA ABSTRACT This application report presents the basic concept and methodology to develop the TSC2301

capacitor 100-10L

Abstract: 100-10L SCX15DNC 100-10L WD SENSYM scx15dnc 100-10L AD DD118 ML2208 ML2200 ML2208CCP
Contextual Info: October 1994 PRELIM IN ARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input

MIL-C-55302

Abstract: Hypertac connector hypertac MILC55302 HYPERTAC CONNECTORS MIL-C-55302 CRIMP male contact solder pins hypertac HYPERTAC CONTACT PIN CHC HYPERTRONICS HYPERTAC PIN
Contextual Info: Impa opuscoli 1° 17-11-2000 14:54 Pagina 13 HYPERTAC INTERCONNECT WORLDWIDE PRESENCE TECHNICAL CHARACTERISTICS SPECIFICATION DAP per MIL-M-14 MATERIAL Insulator In excess of 2000 operations Brass Nickel plated brass or stainless steel 0.7 N 2.5 oz nominal per contact

BP-300

Abstract: TPS2070 TPS2070DAP TPS2070DAPR TPS2071 TPS2071DAP TPS2074 TPS2074DB TPS2075 TPS2075DB
Contextual Info: TPS2070, TPS2071 FOUR-PORT USB HUB POWER CONTROLLERS SLVS287A – SEPTEMBER 2000 – REVISED FEBRUARY 2001 D D D D D D D D D D DAP PACKAGE TOP VIEW Complete USB Hub Power Solution Meets USB Specifications 1.1 and 2.0 Independent Thermal and Short-Circuit

Contextual Info: TPS2070, TPS2071 FOUR-PORT USB HUB POWER CONTROLLERS SLVS287A – SEPTEMBER 2000 – REVISED FEBRUARY 2001 D D D D D D D D D D DAP PACKAGE TOP VIEW Complete USB Hub Power Solution Meets USB Specifications 1.1 and 2.0 Independent Thermal and Short-Circuit

TUSB2046B

Contextual Info: TPS2070, TPS2071 FOUR-PORT USB HUB POWER CONTROLLERS SLVS287A – SEPTEMBER 2000 – REVISED FEBRUARY 2001 D D D D D D D D D D DAP PACKAGE TOP VIEW Complete USB Hub Power Solution Meets USB Specifications 1.1 and 2.0 Independent Thermal and Short-Circuit

RT3933

Contextual Info: HIGH TEMPERATURE 225°C HIGH VOLTAGE RADIAL LEADED CAPACITORS XHT and NPO DIELECTRIC Consult factory for requirements above 225°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;

dap 001

Abstract: DAP 011 dap 002 DAP 015 dap 010 DAP 018 DAP+015
Contextual Info: • Highly reliable dual-metal PV contact. • Available in a variety of spring thick­ nesses and platings. • For right-angle p.c. board mounting. • Two different housing materials: DAP and polyester. • Connectors made of polyester are stackable end-to-end.