DC500 SERIES Search Results

Contextual Info: What HEWLETT W!HMPACKARD Avantek Products Double Balanced Mixer 1.0 to 500 MHz Technical Data UMX-520 Features Description Pin Configuration • 50 dB LO to RF Isolation The UMX Series double-balanced mixers feature exceptionally high isolation and good harmonicallyrelated intermodulation product

Contextual Info: H Avantek Products Double Balanced Mixer 1.0 to 500 MHz Technical Data UMX-520 Features Description Pin Configuration • 50 dB LO to RF Isolation The UMX Series double-balanced mixers feature exceptionally high isolation and good harmonicallyrelated intermodulation product

Contextual Info: Whol HEW LETT mLUM PACKARD Avantek Products Double Balanced Mixer 1.0 to 500 MHz Technical Data UMX-570 Features Description Pin Configuration • 40 dB LO to RF Isolation • 5.5 dB Conversion Loss/ Noise Figure • +34 dBm Input Intercept Point The UMX Series double-balanced

Contextual Info: SERIES PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz GENERAL INFORMATION These high power devices are designed to dissipate power in RFcircuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in

do500

Contextual Info: What HEW LETT mLlÍMPACK ARD Avantek Products Double Balanced Mixer 1.0 to 500 MHz Technical Data UMX-520 Features Description Pin Configuration • 50 dB LO to RF Isolation The UMX Series double-balanced mixers feature exceptionally high isolation and good harmonicallyrelated interm odulation product

Stripline Flange Terminations

Abstract: 975-250-3 PPR 975-250-3
Contextual Info: SERIES PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz GENERAL INFORMATION These high power devices are designed to dissipate power in RFcircuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in

AVANTEK TO-8

Contextual Info: Whpl H E W L E T T mLKM P A C K A R D Avantek Products Double Balanced Mixer 1.0 to 500 MHz Technical Data UMX-570 Features Description Pin Configuration • 40 dB LO to RF Isolation The UMX Series double-balanced mixers feature exceptionally high isolation and good harmonicallyrelated intermodulation product

975-250-3

Abstract: Stripline Flange Terminations thick film ppt PPT Series PPR 975-250-3 PPT 975-250-3
Contextual Info: SERIES PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz RoHS GENERAL INFORMATION These high power devices are designed to dissipate power in R.F. circuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in

975-250-3

Abstract: thick film ppt 1.57 GHz 515-30 6 watts resistor KDI "power divider" PMS-100 PPT Diode data sheet specifications PPT800-100A
Contextual Info: SERIES PMS, PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz RoHS GENERAL INFORMATION These high power devices are designed to dissipate power in R.F. circuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in

Contextual Info: SERIES PMS, PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz GENERAL INFORMATION These high power devices are designed to dissipate power in R.F. circuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in

Contextual Info: SERIES PMS, PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz RoHS GENERAL INFORMATION These high power devices are designed to dissipate power in R.F. circuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in

Contextual Info: H Avantek Products Double Balanced Mixer 1.0 to 500 MHz Technical Data UMX-570 Features Description Pin Configuration • 40 dB LO to RF Isolation The UMX Series double-balanced mixers feature exceptionally high isolation and good harmonicallyrelated intermodulation product

triangle KDI PPA

Contextual Info: HIGH POWER SER IES PPA, PAC ATTENUATORS DC-12.4 GHz, UP TO 200 WATTS I FEATURES: • Flange Mounted or Chip • 10 to 200 Watts • 1 to 20 dB GENERAL INFORMATION: The KDI/Triangle PPA Series of attenuators utilize a Beryllium oxide chip and thin film technology to provide devices which can dissipate up to 200

MLP-102

Abstract: ma 117d DC200 Series MHP-105 103B
Contextual Info: TOROIDAL MIXERS SERIES MLP GENERAL SPECIFICATIONS: Impedance: DC Offset: Input Rowan RF + LO : 50 ohms nominal 1 mV Typical Low Level 50 MW Max. Med Level 200 MW Max. High Level 500 MW Max. — 55 to +100°C (operating & storage) 40 MA (Low Level Only) Temperature Rang«:

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4 GHz The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 Watts of RF power. The PPA series must be thermally bonded to a heat sink, using the mounting

triangle KDI PPA

Abstract: 003-001 triangle KDI
Contextual Info: HIGH POWER ATTENUATORS SERIES PPA DC-4 GHz GENERAL INFORMATION The KDI/Triangle PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

Contextual Info: HIGH POWER ATTENUATORS SER IES PPA DC-4 GHz GENERAL INFORMATION The KDI/Triangle PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat

PPA100

Contextual Info: SERIES PPA ATTENUATORS RoHS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

PPA-20

Contextual Info: SERIES PPA ATTENUATORS RoHS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

triangle KDI PPA

Abstract: high power Attenuators
Contextual Info: HIGH POWER ATTENUATORS SERIES PPA DC-4 GHz GENERAL INFORMATION The KDI/Triangle PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4 GHz The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 Watts of RF power. The PPA series must be thermally bonded to a heat sink, using the mounting

Contextual Info: HIGH POWER SERIES PPA ATTENUATORS DC-4 GHz GENERAL INFORMATION The KDI/Triangle PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 200 watts of R.F. power. The PPA series must be thermally bonded to a heat

PPT800-40-3

Abstract: ppt975-250-3 ppt 0020 A PPT1900-800
Contextual Info: HIGH POWER CHIP RESISTORS, TERMINATIONS SERIES PPC, NPC 50 & 100 OHMS GENERAL INFORMATION When mounted on an appropriate heat sink, these chip devices provide high power dissipation in terminations and as balancing resistors in Wilkenson power divider networks. Laser trimming provides maximum