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    DGP24 Search Results

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    TE Connectivity KRPA-11DGP-24

    RELAY GEN PURPOSE DPDT 10A 24V
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    DGP24 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PHD64

    Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
    Contextual Info: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle


    Original     		100MHz PHD64 land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14 PDF

    SLMA002

    Abstract: "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004
    Contextual Info: Application Report SLMA002E – November 1997 – Revised January 2010 PowerPAD Thermally Enhanced Package Steven Kummerl. ABSTRACT


    Original     		SLMA002E SLMA002 "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004 PDF