DIE PRODUCTS Search Results

FPD63310

Abstract: TFTLCD LMC7532 bare die
Contextual Info: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die TFT-LCD Panels Applications Bare Die/Known Good Die TFT-LCD Panels 1 7 2 CD 1 CD N 3 4 6 5 www.national.com 1 N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die

bare die

Contextual Info: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die Portable Digital Assistant Applications Bare Die/Known Good Die Portable Digital Assistant 1 2 3 4 5 6 7 8 www.national.com 1 N January 1998 Die Products Business Unit Applications

LMxxx

Contextual Info: DPBU Die Datasheet LMXXX MDA MWA EXAMPLE DIE DATASHEET DEVICE DISCRIPTION November 14,2002 DIE LAYOUT A-STEP DIE/WAFER CHARACTERISTICS Fabrication Attributes Physical Die Identification Die Step General Die Information LMXXX Bond Pad Opening Size 000µm x 000µm

Contextual Info: Application Note Switch Die Measurement Fixture Rev 0 RELEVANT PRODUCTS • calibration structure and the other 24 elements are used to measure die. Figure 1 illustrates a measurement element for a single pole, double throw SPDT switch die. All ANADIGICS Switch Die

Contextual Info: Die Specifications Die Information EXAR offers a wide variety of standard products in die form. This new section contains a data sheet for each product available in die form, with specific ordering information, electrical specifications, and physical characteristics useful to the end user.

Contextual Info: DIE PRODUCTS B U R R -B R O W N * E 0PA2111 DIE ] Dual, Low Noise, Precision Difet OPERATIONAL AMPLIFIER DIE FEATURES DESCRIPTION • • • • • • The OPA2111 die is a high-precision monolithic Dlfet Dielectrically isolated FET operational ampli­

Burr Brown part marking

Abstract: OPA21 OPA2111 fet operational amplifier
Contextual Info: DIE PRODUCTS B U R R -B R O W N * OPA2111 DIE 1 Dual, Low Noise, Precision Difet OPERATIONAL AM PLIFIER DIE FEATURES DESCRIPTION • LOW NOISE: 100% TESTED The OPA2111 die is a high-precision monolithic D ifet Dielectrically isolated FET operational ampli­

burr brown date code marking

Abstract: burr brown date code
Contextual Info: DIE PRODUCTS BURR-BROW N* OPA128 DIE Difet Electronics Grade OPERATIONAL AMPLIFIER DIE FEATURES DESCRIPTION • • • • • The OPA128 die is an ultra-low bias current mono­ lithic operational amplifier. Using advanced geome­ try, dielectrically isolated FET Difet inputs, this

Contextual Info: DIE PRODUCTS BURR-BROWN* •B B OPA633 DIE I High Speed Buffer AMPLIFIER DIE FEATURES DESCRIPTION • • • • The OPA633 die is a monolithic unity-gain buffer am­ plifier featuring very wide bandwidth and high slew rate. A dielectric isolation process incorporating both

Contextual Info: Direct Link 1173 Products & Technologies Miniaturisierte Drucksensorelemente Februar 2009 Robuster Allrounder Nur noch 1,65 x 1,65 mm² messen die Sensorelemente der Familie C32. Die neuen Chips stattet EPCOS mit optimierten Bondpads aus, die über räumlich abgesetzte Testpad-Strukturen für Waferprober verfügen. Wie die

HI-508

Abstract: HI-508KD ad 508 die
Contextual Info: DIE PRODUCTS B U R R -B R O W N * HI-508 DIE 1 [ Single-Ended 8-Channel CMOS ANALOG MULTIPLEXER DIE FEATURES DESCRIPTION • ANALOG OVERVOLTAGE PROTECTION: 70Vp-p The HI-508KD die is an 8-channel single-ended analog multiplexer with input overvoltage pro­

LRIS64K

Abstract: DSASW003741
Contextual Info: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):

marking E5 amplifier

Abstract: mdb 501 E5 monolithic amplifier M11 marking OPA633 OPA633AD isolation amplifier ad
Contextual Info: DIE PRODUCTS « Ü R R -B R Q W M » OPA633 DIE High Speed Buffer AMPLIFIER DIE FEATURES DESCRIPTION • • • • The OPA633 die is a monolithic unity-gain buffer am­ plifier featuring very wide bandwidth and high slew rate. A dielectric isolation process incorporating both

Burr Brown part marking

Abstract: 506K 50s MARKING CODE marking 1be HI-506 HI-506KD IN1613 burr brown date code
Contextual Info: DIE PRODUCTS B U R R -B R O W N l B B HI-506 DIE | Single-Ended 16-Channel CMOS ANALOG MULTIPLEXER DIE FEATURES DESCRIPTION • ANALOG OVERVOLTAGE PROTECTION: 70Vp-p The HI-506KD die is a 16-channel single-ended analog multiplexer with input overvoltage pro­

F37011

Contextual Info: TN0055 Technical note SRI4K die description Product information ● Product name: SRI4K ● Die code: P117ZMY Wafer and die features October 2007 Wafer diameter 8" Wafer thickness 180 µm Die technology F6SPs40s 3M 1P Diffusion Plant Chartered Die identification

astro tool

Abstract: m22520 astro tool m22520
Contextual Info: DIE M22520/23-04 4 GAGE [AMT23004DA] - : Astro Tools HOME PRODUCTS LOG IN Home : Products : Die Sets & Locators : DIE (M22520/23-04) 4 GAGE SEARCH Enter Model #, NSN, MPN Here Advanced Search M39029 Search Die Sets & Locators Product 3/239

lexan 920

Abstract: Lexan-920 lexan .920 VI-260-CV VI-J00 Wakefield Engineering
Contextual Info: 8 Sicherheits-Vorschriften Sicherungen. Die Zulassungsbestimmungen der Sicherheitsbehörden machen es erforderlich, daß die Module abgesichert werden. Die Sicherung muß in die +Input Leitung geschaltet werden, nicht in die –Input Leitung, da eine Unterbrechung der –Input Leitung bewirken würde, daß die GateAnschlüsse auf das Spannungspotential der +Input Leitung

SPANSION date code format

Abstract: AM29 T0003 Am29f 405 gde 8 905 959 252
Contextual Info: ‹ Chapter 8 Die and Wafer Shipments CHAPTER 8 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Storage Conditions for Die and Wafer Carrier Designs for Singulated Die Waffle Pack Surftape and Reel Carrier Designs for Wafers Wafer Jar

47821

Abstract: 69051 47824 47820 Terminal crimping training 59974-1 408-1729 47822 HAND TERMINAL CRIMPING TOOL tyco ram repair
Contextual Info: Instruction Sheet 408-1729 Crimping Dies 47820 through 47825, 47915, and 47918 Typical Crimping Dies 29 NOV 07 Rev H 2. DESCRIPTION Stationary Die Nest Locator Each crimping die consists of a stationary die (nest) and a moving die (anvil). The stationary die features a

AM29

Abstract: 29f800bb AMD xp
Contextual Info: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray

1NA110

Abstract: marking 1be INA110AD AZK734 INA110 1na1 OA 95
Contextual Info: DIE PRODUCTS INA110 DIE BURR-BROWN* 1 Fast-Settling FET-lnput Very-High Accuracy INSTRUMENTATION AMPLIFIER DIE FEATURES APPLICATIONS • • • • • FAST SCANNING RATE MULTIPLEXED INPUT DATA ACQUISITION SYSTEM AMPLIFIER • FAST DIFFERENTIAL PULSE AMPLIFIER

transistor B 1184

Contextual Info: SIPMOS Chip-Produkte/SIPMOS Die Products SIPMOS Power Transistor Dice Die type Recommended source bond wire diameter1 urn Die topology Page 1.500 0.600 SIPC08P20 SIPC08P10 250 250 - 50 0.030 0.035 0.055 0.055 0.070 0.070 0.100 0.100 SIPC20AN05 SIPC20AN05L

IRG41BC20W

Abstract: IRG41BC20UD Drive circuit for IGBT using IR2130 IR2184 application notes IR2110 driver CIRCUIT FOR INVERTERS DC MOTOR SPEED CONTROL USING IGBT IRG41BC30W IR2181 application notes IR2103 bldc driver 1KW dc motor
Contextual Info: TABLE OF CONTENTS Selection Guides Fast Diode Die Data Sheets FRED Die Data Sheets HEXFET Power MOSFET Die Data Sheets HEXFRED® Rectifier Die Data Sheets IC Data Sheets IGBT Die Data Sheets IGBT Modules for Motor Drive & UPS IGBT Modules for Motor Drives in Industrial Electric Vehicles

MPY534

Abstract: Sd 602
Contextual Info: BURR-BROÜJN CORP h e d 17313b5 I 0 0 1 S S 27 - :-:- 4 ~T L ' T ï n T R? .r°V T | -7LPI DIE PRODUCTS - MPY534 DIE l,= B i Precision ANALOG MULTIPLIER DIE DESCRIPTION