DIMENSIONS PQFP 132 Search Results

PQFP 132 PACKAGE DIMENSION intel

Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
Contextual Info: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch

land pattern PQFP 132

Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

m0-112

Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

atop

Contextual Info: OEM PQFP Sockets Latching Aid Latching Latch ng A Aid d Part Number Lead Count Dimensions A Sq. B Sq. C 1.02 [ 25.9 ] .40 [ 10.2 ] 4-0000-07242-000-099-000 84 1.11 [ 28.2 ] 4-0000-07243-000-099-000 100 1.21 [ 30.7 ] 1.12 [ 28.4 ] .50 [ 12.7 ] 4-0000-07244-000-099-000

land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for

DIMENSIONS PQFP 132

Abstract: MO-069 TS-0361
Contextual Info: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package

Contextual Info: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board

amp pga socket

Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

18022

Abstract: 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

mounting pad PQFP

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

132 pin PGA socket

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

MO-069

Abstract: TS-0361-13 2100-7243-00-1807 2132-7244-YY-1807 2132-7244-75-1807
Contextual Info: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package

DIMENSIONS PQFP 132

Contextual Info: Model 5780, 132 Pin JEDEC Test Clip, .025” Lead Pitch, .025” sq. pins on .100 Centers These new test clips provide the user with an easy means to connect instrumentation to the 132 pin fine pitch plastic PQFP chip leads. • Connects to 132 pin high density

Contextual Info: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

831A01

Abstract: MC68306 MC68306FC16 MC68306PV16
Contextual Info: SECTION 9 ORDERING INFORMATION AND MECHANICAL DATA This section contains the ordering information, pin assignments, and package dimensions for the MC68306. 9.1 STANDARD ORDERING INFORMATION Package Type Frequency MHz Temperature Order Number 132-Lead Plastic Quad Flat Pack (FC Suffix)

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

AF3 din 74

Abstract: PQFP-128 footprint AT40K AT40K05 AT40K05LV AT40K10 AT40K10LV AT40K20 AT40K20LV AT40K40
Contextual Info: Features • Ultra High Performance • • • • • • • • • – System Speeds to 100 MHz – Array Multipliers > 50 MHz – 10 ns Flexible SRAM – Internal Tri-state Capability in Each Cell FreeRAM – Flexible, Single/Dual Port, Synchronous/Asynchronous 10 ns SRAM

DSP56001A

Abstract: PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP
Contextual Info: Pin-out and Package General Purpose I/O Pin Tables The DSP56001A signals which may be programmed as general purpose I/O are listed with their primary function in Table 18. Table 19 and Table 20 identify pins on each package in numeric order. Table 21 identifies each signal name in order while giving the pin number for each

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch