DIP 28 Search Results

DO220

Abstract: DO-220 DIP-22 DIP28 dip18pin DIP18
Contextual Info: TO 220 7-pin HW Special Case Plastic 5*leads Version V Special Case Plastic 5*leads Version H DO 220 TOP 3 TO 92 16*pin DIP spec.case 12-pin QIP Special case , 8 leads 4*pin DIP SIP 8 SIP 6 6*pin DIP 8*pin DIP 14*pin DIP 16*pin DIP 18*pin DIP 20*pin DIP 22*pin DIP

LC7566

Abstract: LC7060AN LC 7560 sanyo sanyo lc7060 LC-7566 DIP42S DIP-42S LC7535 LC7565
Contextual Info: SANYO SE MI COND UCT OR CORP b3E ]> 7 t1ci7D7ti D D i m i 313 « T S A J ^Under Development G-ao^'c rauiJii^er Type NQ Package Volume LC7520 DIP-28 LC7522 DIP-: LC 7523 LC7523M DIP-28S MFP-30 * LC7527E QIP-64E LC 7565 LC7565A DIP-42S QIP-48A LC7566 DIP-42S

28-pin SOJ SRAM

Abstract: clcc 32 socket TSOP dip adapter 28-pin SOJ SRAM 512k AK28D300-QSOP AK28D300-SOJ AK28D300-TSOP AK28D-LLP DA10 DIP600
Contextual Info: Accutek Microcircuit Corporation 28 Pin to 32 Pin DIP Adapters DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

28 pin ceramic dip

Abstract: 28-pin
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A07 EIAJ code :∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP

28-pin

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP

B-3067

Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
Contextual Info: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP

z86e2112psc

Abstract: Z86C1200ZEM Z86E0812PSC Z86C07 Z86E0812
Contextual Info: Z86C1200ZEM S UPPOR TP RODUCT Z86C1200ZEM ICEBOX FAMILY Z8 IN-CIRCUIT EMULATOR –C12 HARDWARE FEATURES • Supported Devices Package Emulation 18-Pin DIP Z86C04/07/08/ Z86E04/07/08 N/A 18-Pin SOIC 20-Pin DIP 20-Pin SOIC 20-Pin SSOP 28-Pin DIP 40-Pin DIP

P41 transistor

Abstract: 300MIL P29 Package 600-MIL P15 PACKAGE DIAGRAM P15 Package transistor p11 22-LEAD
Contextual Info: Package Diagram Plastic Dual-In-Line Packages 16-Lead 300-Mil Molded DIP P1 18-Lead (300-Mil) Molded DIP P3 20-Lead (300-Mil) Molded DIP P5 1 Package Diagram 22-Lead (400-Mil) Molded DIP P7 22-Lead (300-Mil) Molded DIP P9 24-Lead (600-Mil) Molded DIP P11

A 4506

Abstract: 8 pin ic A 4506 ic a 4506 A4506 PSB4505 PSB45030 Q67000-A6005 ic psb 4505 PSB RESISTORS ic vr PDIP28
Contextual Info: S IE M E N S Enhanced Speech Circuit ESC PSB 4505 PSB 4505A PSB 4506 PSB 4506A Preliminary Data Type PSB PSB PSB PSB 4505 4505 A 4506 4506 A Bipolar 1C Ordering Code Package Q67000-A8161 Q67000-A6005 Q67000-A8211 Q67000-A6004 P-DIP-28 P-DIP-28 P-DIP-28 P-DIP-28

14-PIN

Abstract: EP1206XX EP8700
Contextual Info: Table of Contents Family P/N Page Single Output 14 pin DIP 14 pin DIP high precision 14 pin DIP SMD 8 pin Mini-DIP 8 pin Mini-DIP SMD 4 pin Mini-SIL EP9430-XX EPA500-XX EPA810-XX EP9460-XX EPA426-XX EP9748-XX 2 3 4 5 6 7 Dual Output 8 pin Mini-DIP EPA445-XX

CXD1144

Abstract: CXD1244 CXD1088 CXD2551M CXD2551P CXD1088AQ
Contextual Info: Digital Filters Line-Up P/N Package No. of channels Filter Order Filter Ripple Characteristics Attenuation Data Output Resolution Data Output Format Other Features CXD1144BP 28P DIP 8Times sampling CXD1244S CXD2550P CXD2551P CXD2551M 40P SDIP * 18P DIP 18P DIP 24P

M38510/10101

Abstract: 14538B MOTOROLA smd transistor 72k code eprom smd atmel QP7C185A M38510-11003 QP7C198 8708 eprom M38510/11201 M38510/10105
Contextual Info: Product Selector Guide March 28, 2005 Analog Description Package SMD Number Part Number DIP 5962-87786 TDC1046 TRW DIP, LCC 5962-88532 TDC1049C1V TRW National A/D Converter, 6-Bit Flash A/D Converter, 9-Bit Comparator, Differential Die Mfg DIP, CAN, FP, LCC

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06

MIL-S-83734

Contextual Info: DIP Socket Military DIP Socket; MIL-S-83734 110-XX-XXX-41-5300. 1 of 3 . Home > Product Search > Product Details Product Number: 110-XX-XXX-41-530000 DESCRIPTION: DIP Socket Military DIP Socket; MIL-S-83734

28-pin

Abstract: SDIP028-P-0400-1
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03

28-pin

Abstract: DIP028-P-0300-1
Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M04 EIAJ code :∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-28P-M04

28 pin ceramic dip

Abstract: 28-pin
Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A10 EIAJ code :∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-28C-A10

Four position DIP switch

Contextual Info: Thru-Hole DIP Switches SERIES 76 SPST Rocker DIMENSIONS DIP Switches FEATURES • Raised and Recessed, Rocker and PIANO-DIP Styles • Sealed Base Standard • Spring and Ball Contact • Top Tape Seal Option In inches and millimeters Side Actuated PIANO-DIP®

76RSB04ST

Contextual Info: Thru-Hole DIP Switches SERIES 76 SPST Rocker DIMENSIONS DIP Switches FEATURES • Raised and Recessed, Rocker and PIANO-DIP Styles • Sealed Base Standard • Spring and Ball Contact • Top Tape Seal Option In inches and millimeters Side Actuated PIANO-DIP®

smd reed relay

Abstract: DIP12
Contextual Info: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations

Contextual Info: F-204 INDEX Series Description ALC AP APA APH APO APS ASP ATS AW Aluminum Lead Socket Carrier, DIP. " Adaptor Plug, DIP. * Adaptor Plug, DIP, Automated insertion Design .353

z-282

Contextual Info: 2.54 mm pitch connector Straight DIP type female connector for PCBs Z-282- FD For PCBs Straight DIP ● Configuration of product Part No. Z-282- ( ) FD ➀ ➁ ➂ ➀ Series name ➁ No. of contacts: 2–62 ➂ Type of contact FD: Straight DIP type, female