DIP14 PACKAGE Search Results

SOP20

Abstract: SOL20 DIP20 DIP-20
Contextual Info: BiCMOS Standard Logics TD74BC Series A4 Typo No. Package Function TD74BC00P Quad 2-Input NAND Gate DIP14 TD74BC08P Quad 2-Input AND Gate DIP14 TD74BC32P Quad 2-Input OR Gate DIP14 TD74BC230P/F/FW Octal Bus Butter/Inverting and Non-lnvertlng/3-state DIP20/SOP20/SOL20

DIP14

Abstract: DIP-14
Contextual Info: PACKAGE DIMENSIONS DIP14 UNIT : mm Ver.2010-11-26

BU4001B

Contextual Info: BU4001B BU4001BF Quad 2-input NOR gate The BU4001B and BU4001BF consist of four 2-input positive logic NOR gates for CMOS devices in a single structure. Dimensions Units : mm BU4001B (DIP14) Features • available in DIP14 and SOP14 packages • low power consumption

ba10339fv

Abstract: BA10339 BA10339F
Contextual Info: BA10339 BA10339F BA10339FV Quad comparators The BA10339, BA10339F, and BA10339FV each consist of four comparators in a single package. The open-collector output allows a wired OR connection. Dimensions Units : mm BA10339 (DIP14) o Features available in DIP14, SOP14, and

4069UBF

Abstract: 4069U 4069UB BU4069UB
Contextual Info: BU4069UB BU4069UBF Hex inverter The BU4069UB and 4069UBF consist of 6 inverters in a single package. Dimensions Units : mm BU4069B (DIP14) They are suitable for use in CMOS circuits. 19.4± 0.3 Features • available in DIP14 and SOP14 packages • low power consumption

Contextual Info: BU4030B BU4070B BU4030BF BU4070BF The BU4030B/F and BU4070B/F consist of four exclusive OR gates in a single package. They are suitable for CMOS circuits. Quad exclusive-OR gate Dimensions Units : mm BU4030B and BU4070B (DIP14) Features O available in DIP14 and SOP14

ba612

Contextual Info: BA612 Driver, 5-channel, high current The BA612 consists of an array of five Darlington-configured transistor pairs each of which has built-in input resistors. Dimensions Units : mm BA612 (DIP14) They are used as high current drivers. Features o available in a DIP14 package

QFP80

Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

SOP18 EIAJ

Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

DIP18

Abstract: DIP20 DIP40
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

QFP80

Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

DIP14

Abstract: DIP-14 SOT27-1 MAR111
Contextual Info: Philips Semiconductors Package outlines DIP14: plastic dual in-line package; 14 leads 300 mil 1995 Mar 11 1 SOT27-1

Contextual Info: BA9700A BA9700AF Regulator, switching The BA9700A and BA9700AF ICs are switching regulators that use a pulse width modulated system for a very stable output. D im en sio n s U n its : m m BA9700A (DIP14) I9 ,4 ± 0 .3 Features • o available in DIP14 and SOP14

Contextual Info: PACKAGE DIMENSIONS DIP14 19.0±0.3 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51MIN 4.7MAX 2.03MAX +0.15 0.25 -0.05 0 ~ 15º UNIT : mm

LS404 equivalent

Abstract: 067F
Contextual Info: LS404 HIGH PERFORMANCE QUAD OPERATIONAL AMPLIFIERS . . . SINGLE OR SPLIT SUPPLY OPERATION LOW POWER CONSUMPTION SHORT CIRCUIT PROTECTION LOW DISTORTION, LOW NOISE HIGH GAIN-BANDWIDTH PRODUCT HIGH CHANNEL SEPARATION N DIP14 Plastic Package DESCRIPTION

DIP14-P-300-2

Contextual Info: DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.93 TYP. 2/Dec. 11, 1996

Contextual Info: Reliability Tests Report Product Name: TC74HC7266AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HC164AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HCT74AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

3119A

Abstract: NDK 3119A US Crystal NDK 3119A-AQE70
Contextual Info: SIMPLE PACKAGED CRYSTAL OSCILLATORS 3100 SERIES • Model 3119A ■ Main applications : Facsimilies, OA products ■ Features 8 Compactness and light weight in addition to the use of DIP14 pin compatible package. 8 High-reliability metal package grounded

PVAPOX

Abstract: C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14
Contextual Info: Q094XS1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 094X PRODUCT NAME : TS94X LINE DESCRIPTION : OUTPUT RAIL TO RAIL BiCMOS µPOWER OPAMP WAFER CODE : C0941AAH/C0942AAZ/C0944AAH PACKAGES : SOT23/SO8/SO14/TSSOP14/DIP8/DIP14

Contextual Info: Reliability Tests Report Product Name: TC74HC4024AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HC86AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)

Contextual Info: Reliability Tests Report Product Name: TC74HC14AP Package Name: DIP14 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)