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    DIP20 PACKAGE Search Results

    DIP20 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    DIP20 PACKAGE Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DIP20 Package STMicroelectronics Thermal Data Original PDF
    DIP20 Package Unknown Scan PDF

    DIP20 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    db535

    Abstract: DIP20 DB586 DIP-20 SO20
    Text: ST7MDT10-20/DVP DIP20/SO20 Connection Kit for ST7MDT10-DVP3 DATA BRIEF The DIP20/SO20 Connection Kit ST7 MDT1020/DVP provides the hardware you need to connect your ST7MDT10-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in DIP20 and SO20 packages.


    Original     		PDF ST7MDT10-20/DVP DIP20/SO20 ST7MDT10-DVP3 MDT1020/DVP) ST7MDT10-DVP3 DIP20 DB586) db535 DB586 DIP-20 SO20

    DB535

    Abstract: DIP20 SO20 ST7MDT10-EMU3 DIP20-SO20 DB586 DIP-20
    Text: AC7MDT10-D20/S20 DIP20/SO20 Connection Kit for ST7MDT10-EMU3 DATA BRIEF The DIP20/SO20 Connection Kit AC7MDT10D20/S20 provides the hardware you need to connect your ST7MDT10-EMU3 emulator to your application when debugging applications for ST7 microcontrollers in DIP20 and SO20 packages.


    Original     		PDF AC7MDT10-D20/S20 DIP20/SO20 ST7MDT10-EMU3 AC7MDT10D20/S20) ST7MDT10-EMU3 DIP20 DB535 SO20 DIP20-SO20 DB586 DIP-20

    ST62E2X-EPB

    Abstract: SO28 DIP28 ST62E2XC-EPB DIP20 ST6200 ST626X-EMU2 DIP-28 SO16 package st6280b
    Text: ST62, Hardware Tools Overview Page 1 de1 Hardware Tools Overview ST62 FAMILY DEVICE GANG PROGRAMMER PACKAGE EPROM PROGRAMMER STARTER KIT EMULATOR ST62E0X-GP/DIP16 or ST62E2X-EPB ST62E0X-GP/SO16 ST622XC-KIT ST626X-EMU2 ST6208C/09C/10C/20C DIP20/SO20 ST62E10-GP/DIP20 or


    Original     		PDF ST62E0X-GP/DIP16 ST62E2X-EPB ST62E0X-GP/SO16 ST622XC-KIT ST626X-EMU2 ST6208C/09C/10C/20C DIP20/SO20 ST62E10-GP/DIP20 ST62E2XC-EPB ST62E10-GP/SO20 ST62E2X-EPB SO28 DIP28 ST62E2XC-EPB DIP20 ST6200 ST626X-EMU2 DIP-28 SO16 package st6280b

    D2 Package

    Abstract: DIP16 package d2 transistor DIP20
    Text: PACKAGE DIMENSIONS DIP16-D2 DIP20 24.2±0.3 11 1 10 6.4±0.2 20 7.62 0.46±0.1 0.51MIN 2.54 1.0±0.2 2.8MIN 1.22MAX 4.7MAX 1.5±0.2 +0.15 0.25 -0.05 0~15° UNIT : mm


    Original     		PDF DIP16-D2 DIP20 51MIN 22MAX D2 Package DIP16 package d2 transistor DIP20

    DIP20-P-300-2

    Abstract: No abstract text available
    Text: DIP20-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.49 TYP. 2/Dec. 11, 1996


    Original     		PDF DIP20-P-300-2 54-S1

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT245AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HCT245AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT273AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HCT273AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT688AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HCT688AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74ACT640P Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74ACT640P DIP20

    DIP20-P-300-2

    Abstract: No abstract text available
    Text: DIP20-P-300-2.54-W1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.50 TYP. 2/Dec. 11, 1996


    Original     		PDF DIP20-P-300-2 54-W1

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC240AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HC240AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC7240AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HC7240AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74ACT245P Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74ACT245P DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT244AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HCT244AP DIP20

    TLP621 optocoupler

    Abstract: SMPS IC 2003 diagram ATX PWM control atx SMPS 2003 ic LM7912CV pc atx 20 pin smps diagram IC 78L05 SMPS IC 2003 ATX control LM7912CV st SCHEMATIC DIAGRAM SMPS 12v 5A SMPS IC 2003 16 pin diagram ATX PWM control
    Text: TSM111 TRIPLE VOLTAGE AND CURRENT SUPERVISOR •OVERVOLTAGE PROTECTION FOR 3.3V, 5V AND 12V WITHOUT EXTERNAL COMPONENTS ■ OVERCURRENT PROTECTION FOR 3.3V, 5V AND 12V WITH INTERNAL THRESHOLD VOLTAGE N DIP20 Plastic Package ■ POWER GOOD CIRCUITRY ■ GENERATES POWER GOOD SIGNAL


    Original     		PDF TSM111 DIP20 TSM111 TLP621 optocoupler SMPS IC 2003 diagram ATX PWM control atx SMPS 2003 ic LM7912CV pc atx 20 pin smps diagram IC 78L05 SMPS IC 2003 ATX control LM7912CV st SCHEMATIC DIAGRAM SMPS 12v 5A SMPS IC 2003 16 pin diagram ATX PWM control

    atx SMPS 2003 ic

    Abstract: SMPS IC 2003 ATX control SMPS IC 2003 diagram ATX PWM control
    Text: TSM111 TRIPLE VOLTAGE AND CURRENT SUPERVISOR •OVERVOLTAGE PROTECTION FOR 3.3V, 5V AND 12V WITHOUT EXTERNAL COMPONENTS ■ OVERCURRENT PROTECTION FOR 3.3V, 5V AND 12V WITH INTERNAL THRESHOLD VOLTAGE N DIP20 Plastic Package ■ POWER GOOD CIRCUITRY ■ GENERATES POWER GOOD SIGNAL


    Original     		PDF TSM111 DIP20 TSM111 atx SMPS 2003 ic SMPS IC 2003 ATX control SMPS IC 2003 diagram ATX PWM control

    TDA8191

    Abstract: tda AMP 12V DIP20
    Text: TDA8191 TV SOUND CHANNEL . . . . HIGH SENSITIVITY EXCELLENT AM REJECTION DC VOLUME CONTROL PERITELEVISION FACILITY 4W OUTPUT POWER LOW DISTORTION THERMAL PROTECTION TURN-ON AND TURN-OFF MUTING DIP20 Plastic Package ORDER CODE : TDA8191 DESCRIPTION The TDA8191 is a monolithic integrated circuit that


    Original     		PDF TDA8191 DIP20 TDA8191 DIP20 PM-DIP20 tda AMP 12V

    CMOS NE555

    Abstract: lm393 equivalent DC MOTOR DRIVE WITH LM324 PWM generator TL084 NE556 PWM tsm103 application LM358 replacement UA741 DIP14 TL071 IC equivalent ic MC33079
    Text: Packages Thin Shrink Small Outline Packages Tiny Package OUT 1 SOT23-3 TSSOP8 SO8 DIP8 SOT23-5 TSSOP14 SO14 DIP14 TSSOP16 SO16 DIP16 SO20 DIP20 OPERATIONAL AMPLIFIERS COMPARATORS TIMERS VOLTAGE REFERENCES MIXED ANALOG 5 V+ V- 2 IN+ 3 Dual in Line Packages


    Original     		PDF OT23-3 OT23-5 TSSOP14 DIP14 TSSOP16 DIP16 DIP20 OT23-5 SO14/16 TSSOP14/16 CMOS NE555 lm393 equivalent DC MOTOR DRIVE WITH LM324 PWM generator TL084 NE556 PWM tsm103 application LM358 replacement UA741 DIP14 TL071 IC equivalent ic MC33079

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT540AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HCT540AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC244AP Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74HC244AP DIP20

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC9541P Package Name: DIP20 1. Thermal tests Test Item Heat resistance Flow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C Immersion time : 10 s (Lead shall be immersed only under stopper)


    Original     		PDF TC74VHC9541P DIP20

    BA6212

    Abstract: No abstract text available
    Text: Driver, 8-channel, high current BA6212 The BA6212 consists of an array of eight transistor circuits each of which has built-in input resistors. Dimensions U n its: mm BA6212 (DIP20) low voltage equipment. 20 )0 Features I • available in a DIP20 package


    OCR Scan     		PDF BA6212 BA6212 DIP20) DIP20

    DIP20

    Abstract: DMP16 QFP44-A1 QFP64-G1 SDIP22 SDIP24 SDIP28 SDIP42 SDMP30
    Text: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD 1. Soldering Method The recommended soldering methods for each are show In the following table. 1 Recommended Soldering Methods Table Through-Hole mount device type package PACKAGE DIP16 DIP20 SDIP22


    OCR Scan     		PDF DIP16 DIP20 SDIP22 SDIP24 SDIP28 SDIP42 DMP16 DMP24 SDMP30 QFP44-A1 QFP64-G1

    TDA8191

    Abstract: OV-10 DIP20 OV10 C417
    Text: /= T SGS-THOMSON TDA8191 TV SOUND CHANNEL • ■ ■ ■ ■ ■ ■ ■ HIGH SENSITIVITY EXCELLENT AM REJECTION DC VOLUME CONTROL PERITELEVISION FACILITY 4W OUTPUT POWER LOW DISTORTION THERMAL PROTECTION TURN-ON AND TURN-OFF MUTING DIP20 Plastic Package


    OCR Scan     		PDF TDA8191 TDA8191 DIP20 QG5Ab33 OV-10 DIP20 OV10 C417