|
54122-112722400LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch |
|
|
|
10137927-2242LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, 30u\\ Gold (Tin on Tails) plating, 22 Positions, Non GW Compatible LCP, Tape and Reel withcap. |
|
|
|
54122-412722400LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch |
|
|
|
10137927-2241LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, 30u\\ Gold (Tin on Tails) plating, 22 Positions, GW Compatible LCP, Tape and Reel withcap. |
|
|
|
SN65LVDS047D
|
|
Texas Instruments
|
Quad LVDS Driver with Flow-Through Pinout 16-SOIC -40 to 85 |
|
|
