DS082 Search Results

VQFP44 package

Abstract: isp Cable Version 3.0 VQ44 XQR18V04 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N
Contextual Info: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.4 December 15, 2003 5 Features • Description Operating Temperature Range: –55° C to +100° C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5

18V04

Abstract: XQ18V04 600E VQ44 XQR18V04 XQV100 18V00
Contextual Info: QPRO XQ18V04 XQR18V04 QML In-System Programmable Configuration PROMs R DS082 (v1.1) July 27, 2001 5 Preliminary Product Specification Features Description • Xilinx introduces the QPro XQ18V04 and XQR18V04 series of in-system programmable and radiation hardenned

Contextual Info: FEA TU R ES MODEL NO. DS0820 är • 1 0 - 1500 MHz ■ 15 m A ,+5 VDC ■ TTL Driver & PIN Diode SP10T ■ Non-Reflective - P A R T IDENTIFICATION je : T .21 018 DIA 38 P L A C E S RF 8 38 37 LOGIC TABLE 7 8 9 10 PIN A3 A2 A1 AD FUNCTION 0 0 0 0 RF 1 TORF COM

XQR18V04

Abstract: XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000
Contextual Info: R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support • Program/erase temperature range: 0°C to +85°C

Diode 1_b

Contextual Info: FEATURES MODEL NO. DS0820 • 1 0 - 1500 MHz & ■ 15 m A ,+5 VDC ■ TTL Driver SP10T & PIN Diode SP10T ■ Non-Reflective PART IDENTIFICATION -.018 DIA 36 PLACES T RF 8 38 37 36 RF 7 35 34 RF fl 32 31 33 . . # 30 2« 28 RF s 26 27 25 24 RF 4 23 22 21 RF

XQR18V04

Abstract: XQR4000XL CLCC44 CLCC-44 XQVR1000 XQVR300 XQVR600 XQR2V1000
Contextual Info: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.5 October 5, 2004 5 Features • Product Specification Description Operating Temperature Range: –55°C to +100°C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5

DS0820

Abstract: SP10T
Contextual Info: MODEL NUMBER DS0820 PIN Diode SP10T FEATURES • 10 - 1500 MHz • 15 mA, +5 VDC • TTL Driver • Non-Reflective SP10T DAICO 170 Industries 310.507.3242 • FAX 310.507.5701 • www.daico.com

DS0820

Abstract: SP10T COM00
Contextual Info: FEATURES & • 10-1500 MHz ■ 15 m A ,+5 VDC ■ TTL Driver MODEL NO. DS0820 jx. PIN Diode SP10T ■ Non-Reflective SP10T • PART IDENTIFICATION -.018 DIA 38 PLACES RF RF 8 38 .X X .X X X 37 36 7 35 RF RF 5 26 6 34 33 32 31 30 29 28 A3 .’0" A2 "0" A1 "0"

XQ18V04VQ44N

Abstract: 18V04 XQ18V04 XQV100 18V00 XQR18V04CC44M 600E VQ44 XQR18V04 xq18v04cc44v
Contextual Info: QPro XQ18V04 XQR18V04 QML In-System Programmable Configuration PROMs R DS082 (v1.2) November 5, 2001 5 Preliminary Product Specification Features Radiation Hardenned XQR18V04 • In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs • Fabricated on Epitaxial Substrate

Contextual Info: MODEL NUMBER DS0820 PIN Diode SP10T FEATURES • 10 - 1500 MHz • 15 mA, +5 VDC • TTL Driver • Non-Reflective SP10T D A I CO 170 Industries 310.507.3242 • FAX 310.507.5701 • w w w.d aico .co m

18V04

Abstract: XQ18V04VQ44N 18V00
Contextual Info: QPRO XQ18V04 XQR18V04 QML In-System Programmable Configuration PROMs R DS082 (v1.0) May 1, 2001 5 Advance Product Specification Features Description • Xilinx introduces the QPro XQ18V04 and XQR18V04 series of in-system programmable and radiation hardenned

XQ18V04

Abstract: XQR18V04 XQVR1000 XQVR300 XQVR600 XQR2V1000
Contextual Info: ARCHIVED DATA SHEET - NO LONGER SUPPORTED R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support

SP10T

Abstract: RF10 DS082 com01
Contextual Info: F E AT U R E S MODEL NO. DS082 0 1 0 - 1 50 0 MHz 15 mA, +5 VDC TTL Driver Non-Reflective SP10T P IN Dio d e SP 10T PART IDENTIFICATION 2.00 MAX RF RF RF 8 7 6 38 37 36 35 34 33 32 .24 31 * 30 RF RF 5 4 26 25 24 23 22 * * 29 28 27 RF 3 21 20 .20 • .018±.002 DIA

SX6s

Abstract: DS0761
Contextual Info: ,I CLcD r <x Fixing Details 5 W DS0761/COI I *is. 5 Fixing Details H E S DS0821/C01 Data No. DS0761/Colour DS0818/Colour, DS0819/Colour DS0821/Colour, DS0822/Colour Terminations: Solder tags. Live to Panel, remote lamp type has flying lead . Solder tags. Live to Panel, (remote

DA0035

Abstract: DA0775 DA0784-1 DA0786 DS0028 DS0052 DS0073 DS0778 P35-4100 P35-4100-0
Contextual Info: D A I C O I N D U S T R I E S INC tl E D DAI E b O ^ E D OQOlfilS bib FEATURES • 0.05 - 3.5 GHz Frequency Range ■ ■ Flat Frequency Response With Direct Gain Control +22 dBm Output Power Capability ■ Matched to 50 Q Æ mm 5% äti'is iS «®sms: .400 MAX

Contextual Info: DAICO I N D U S T R I E S INC tlE D DAI Eti04TEQ OGOlfllb 552 FEATURES • 0.5 - 3.5 GHz Frequency Range Self Biased. No Separate Gate Supply Req. +22 dBm Output Power Capability Matched to 50 Q .400 MAX BOND PAD CONFIGURATION — .21 — - .180 SQ rfr; .0 5 0 |

Contextual Info: CP3CN17 CP3CN17 Reprogrammable Connectivity Processor with CAN Interface Literature Number: SNOSA98B CP3CN17 Reprogrammable Connectivity Processor with CAN Interface 1.0 General Description The CP3CN17 connectivity processor combines a powerful RISC core with on-chip SRAM and Flash memory for high

F300H

Abstract: FC44H BIT137
Contextual Info: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

USB cable AWM 2725 rx tx pinout

Contextual Info: CP3BT26 CP3BT26 Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces Literature Number: SNOSAE5C CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded

F1A4

Abstract: TR-28 national timer switch tb 208
Contextual Info: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

VQFP44 package

Abstract: XQV300 XQ17V16 VQ44 XQ18V04 XQ2V1000 XQV1000 XQV600 XQ18V04VQ44N
Contextual Info: QPro XQ18V04 Military 4Mbit ISP Configuration Flash PROM R DS125 v1.0 December 16, 2003 5 Advance Product Specification Features Description • Operating Temperature Range: –55° C to +125° C • Low-power advanced CMOS FLASH process memory cells immune to static single event upset

national timer switch tb 179

Contextual Info: CP3BT13 Reprogrammable Connectivity Processor with Bluetooth and CAN Interfaces General Description The CP3BT13 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

Contextual Info: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

CP3BT23

Abstract: CP3BT23G18NEP CP3BT23G18NEPNOPB CR16C LMX5251 LMX5252 LQFP-144 315 receiver module
Contextual Info: MAY 2004 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip