DS510 Search Results

MP02HB260-12

Abstract: MP02HB260-14 MP02HB260-16 MP02XX260
Contextual Info: MP02XX260 Series MP02XX260 Series Dual Diode Modules Replaces January 2000 version, DS5102-4.0 DS5102-5.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 1600V ■ Electrically Isolated Package IFSM 8100A ■ Pressure Contact Construction IF AV (per arm)

MP02HB280-16

Abstract: MP02HB280-18 MP02XX280 MP02XX280-16 MP02XX280-18 MP02XX280-20 busbar bolt torque value DS5103-5
Contextual Info: MP02XX280 Series MP02XX280 Series Dual Diode Modules Replaces January 2000 version, DS5103-4.0 DS5103-5.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2000V ■ Electrically Isolated Package IFSM 6000A ■ Pressure Contact Construction IF AV (per arm)

Contextual Info: MITEL MP02 XX 175 Series Dual Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS5101-3.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

MP03

Contextual Info: MP03 XX 440 Series MITEL Dual Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 1.0 DS5106-2.0 D ecem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina non-toxic Isolation Medium

Contextual Info: M ITEL MP03 XX 260 Series Dual Diode Modules SEMICONDUCTOR Supersedes April 1993 version, 1.0 DS5104-2.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

MP02280

Abstract: ds5103 MP02
Contextual Info: MP02 XX 280 Series MP02 XX 280 Series Dual Diode Modules Replaces December 1998 version, DS5103-3.0 DS5103-4.0 January 2000 FEATURES KEY PARAMETERS 2000V VRRM IFSM 6000A 280A IF AV (per arm) Visol 2500V CIRCUIT OPTIONS • Dual Device Module ■ Electrically Isolated Package

MP03A

Contextual Info: M ITEL MP03 XX 260 Series Dual Diode Modules SEMICONDUCTOR Supersedes April 1993 version, 1.0 DS5104-2.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina non-toxic Isolation Medium

MP03HB260-20

Abstract: MP03XX280 MP03XX280-16 MP03XX280-18 MP03XX280-20 heatsink calculation Thyristor
Contextual Info: MP03XX280 Series MP03XX280 Series Dual Diode Modules Replaces January 2000 version, DS5105-3.0 DS5105-4.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2000V ■ Electrically Isolated Package IFSM 6000A ■ Pressure Contact Construction IF AV (per arm)

MP02HB130-25

Abstract: MP02XX130 MP02XX130-20 MP02XX130-22 MP02XX130-25 DS5100-5
Contextual Info: MP02XX130 Series MP02XX130 Series Dual Diode Modules Replaces January 2000 version, DS5100-4.0 DS5100-5.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2500V ■ Electrically Isolated Package IFSM 2200A ■ Pressure Contact Construction IF AV (per arm)

DC DC supplies MEAN WELL diagrams

Abstract: MP03HB440-20 MP03HB440-18 MP03HB440-21 MP03XX440 MP03XX440-18 MP03XX440-20 MP03XX440-21
Contextual Info: MP03XX440 Series MP03XX440 Series Dual Diode Modules Replaces January 2000 version, DS5106-3.0 DS5106-4.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2100V ■ Electrically Isolated Package IFSM 11250A ■ Pressure Contact Construction IF AV (per arm)

DS5101-4

Abstract: MP02XX175 MP02XX175-08 MP02XX175-10 MP02XX175-12
Contextual Info: MP02XX175 Series MP02XX175 Series Dual Diode Modules Replaces January 2000 version, DS5101-4.0 DS5101-5.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2000V ■ Electrically Isolated Package IFSM 5625A ■ Pressure Contact Construction IF AV (per arm)

DS5101-3

Contextual Info: M ITEL MP02 XX 175 Series Dual Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS5101-3.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina non-toxic Isolation Medium

280 series

Abstract: MP02280
Contextual Info: MITEL MP02 XX 280 Series Dual Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS5103-3.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina non-toxic Isolation Medium

LT 7250

Contextual Info: M ITEL DSZ412SE Avalanche Diode SEMICONDUCTOR Supersedes Novem ber 1994, version 1.1 DS5107-2.0 FEATURES • Double Side Cooling. ■ High Surge Capability. ■ Avalanche Capability. December 1998 KEY PARAMETERS VRRM 4400V * 230A *fs m 1500A f a v APPLICATIONS

Contextual Info: M ITEL MP02 XX 130 Series Dual Diode Modules SEMICONDUCTOR Supersedes April 1993 version, 2.1 DS5100-3.0 D ecem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

Contextual Info: M ITEL MP02 XX 260 Series Dual Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS5102-3.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

MP03

Abstract: MP023 DS5104-3 ds5104
Contextual Info: MP03 XX 260 Series MP03 XX 260 Series Dual Diode Modules Replaces December 1998 version, DS5104-2.0 DS5104-3.0 January 2000 FEATURES KEY PARAMETERS VRRM 1600V IFSM 8100A 267A IF AV (per arm) Visol 2500V • Dual Device Module ■ Electrically Isolated Package

MP02

Abstract: unial
Contextual Info: MP02 XX 130 Series MP02 XX 130 Series Dual Diode Modules Replaces December 1998 version, DS5100-3.0 DS5100- January 2000 FEATURES KEY PARAMETERS 2500V VRRM IFSM 2200A 130A IF AV (per arm) Visol 2500V • Dual Device Module ■ Electrically Isolated Package

pic16f84a tutorial

Abstract: 18F452 picdem 2 plus using 18f452 examples f452tmpo DS33014 9 pin d type connector free projects for PIC 18f452 PIC16F84A PICSTART PIC18F452 template
Contextual Info: MPLAB IDE PICSTART® PLUS USER’S GUIDE  2004 Microchip Technology Inc. DS51028F Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.

programming PIC16F84 Free Projects of LED

Abstract: PIC16F84 Free Projects of LED psf20100 12c508a Microchip EEPROM Information Guide pic12c508A 9 pin d type connector picstart plus PIC16F84 Projects 12C508 ds33023
Contextual Info: M PICSTART PLUS USER’S GUIDE  2001 Microchip Technology Inc. DS51028D “All rights reserved. Copyright 2001, Microchip Technology Incorporated, USA. Information contained in this publication regarding device applications and the like is intended through

unial

Abstract: DS5101-4 MP02XX175 MP02XX175-08 MP02XX175-10 MP02XX175-12 MP02X
Contextual Info: MP02XX175 Series MP02XX175 Series Dual Diode Modules Replaces January 2000 version, DS5101-4.0 DS5101-5.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2000V ■ Electrically Isolated Package IFSM 5625A ■ Pressure Contact Construction IF AV (per arm)

MP02HB130-25

Abstract: MP02XX130 MP02XX130-20 MP02XX130-22 MP02XX130-25
Contextual Info: MP02XX130 Series MP02XX130 Series Dual Diode Modules Replaces January 2000 version, DS5100-4.0 DS5100-5.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2500V ■ Electrically Isolated Package IFSM 2200A ■ Pressure Contact Construction IF AV (per arm)

MP03HB260-14

Abstract: MP03XX260
Contextual Info: MP03XX260 Series MP03XX260 Series Dual Diode Modules Replaces January 2000 version, DS5104-3.0 DS5104-4.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 1600V ■ Electrically Isolated Package IFSM 8100A ■ Pressure Contact Construction IF AV (per arm)

MP03HB260-20

Abstract: MP03XX280 MP03XX280-16 MP03XX280-18 MP03XX280-20
Contextual Info: MP03XX280 Series MP03XX280 Series Dual Diode Modules Replaces January 2000 version, DS5105-3.0 DS5105-4.0 July 2002 FEATURES KEY PARAMETERS • Dual Device Module VRRM 2000V ■ Electrically Isolated Package IFSM 6000A ■ Pressure Contact Construction IF AV (per arm)