DS553 Search Results

DIM400DDM12-A000

Abstract: DS5532-3
Contextual Info: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Replaces July 2002, version DS5532-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5532-3.0 March 2003

DIM1600FSM12-A000

Abstract: LIN26324
Contextual Info: DIM1600FSM12-A000 Single Switch IGBT Module DS5533-3.1 August 2008 LIN26324 FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated AlSiC Base with AIN Substrates Lead Free Construction High Thermal Cycling Capability KEY PARAMETERS VCES

DIM400DDM12-A000

Contextual Info: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Preliminary Information DS5532-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS

Contextual Info: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces March 2003, version DS5534-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-4.0 July 2003 KEY PARAMETERS VCES typ VCE(sat)*

DIM800FSM12-A000

Contextual Info: DIM800FSM12-A000 Single Switch IGBT Module Replaces DS5531-3.1 DS5531-4 November 2010 LN27682 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

lm 124 ic

Abstract: ESM 310 DIM2400ESM12-A000
Contextual Info: DIM2400ESM12-A000 Single Switch IGBT Module Replaces DS5536-3.0 DS5536-4 October 2010 LN27615 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

12v to 1000v inverters circuit diagrams

Abstract: bi-directional switches IGBT DIM400LSS12-A000 6x55 diode IC LM 2003
Contextual Info: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*

DIM2400ESM12-A000

Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003

DIM1600FSM12-A000

Abstract: 6x transistor
Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003

DIM1600FSM12-A000

Abstract: DIM1600FSM12-A
Contextual Info: DIM1600FSM12-A000 Single Switch IGBT Module Replaces DS5533-4 DS5533-5 July 2014 LN31767 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

DIM400DDM12-A000

Abstract: DIM400DDM12-A
Contextual Info: 6 3 Replaces DS5532-4 FEATURES ±0.2 • ±0.2 10µs Short Circuit Withstand 18 6 x O7 Dual Switch IGBT Module DS5532-5 June 2014 LN31690 14 ±0.2 11.5 ±0.2 DIM400DDM12-A000 KEY PARAMETERS 28 ±0.5  High44 Thermal ±0.2 Cycling Capability  Non Punch

DIM2400ESM12-A000

Abstract: DIM2400ESM12-A
Contextual Info: DIM2400ESM12-A000 Single Switch IGBT Module Replaces DS5536-4 DS5536-5 August 2014 LN31869 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

DIM400DDM12-A000

Abstract: grease DS5532-4
Contextual Info: 6 3 DS5532-4 November 2009 LN26754 14 ±0.2 ±0.2 Replaces DS5532-3.1 Dual Switch IGBT Module 11.5 DIM400DDM12-A000 FEATURES ±0.2 18 10µs Short Circuit Withstand ±0.2 6 x O7 KEY PARAMETERS 28 ±0.5 Non Punch Silicon ±0.2 57 Through VCES VCE(sat) * (typ)

DIM1600FSM12-A000

Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information DS5533-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

2 way video splitter circuit diagram

Abstract: TV 2 way splitter, circuit diagram PHILIPS TV tuner block TV 3 way splitter, circuit diagram 2 way rf splitter circuit diagram video balun schematic f type connectors log tx2 tv schematic diagram PHILIPS zarlink modem
Contextual Info: SL2150F Front End Power Splitter with AGC Data Sheet DS5535 Features • • • • • • Single chip quadruple power splitter primary channel, secondary channel, OOB channel and loop through Wide dynamic range on all channels Independent AGC facility incorporated into all

DIM800FSM12-A000

Contextual Info: DIM800FSM12-A000 DIM800FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5531-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5531-3.0 March 2003

DIM1600FSM12-A000

Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003

LVCMOS33

Abstract: XA2C64A AEC-Q100 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q
Contextual Info: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.1 May 5, 2007 Features • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade • Guaranteed to meet full electrical specifications over TA = -40° C to +105° C with TJ Maximum = +125° C

LOG TX2 1044

Abstract: ctb 43
Contextual Info: SL2150F Front End Power Splitter with AGC Data Sheet DS5535 Features • • • • • • Single chip quadruple power splitter primary channel, secondary channel, OOB channel and loop through Wide dynamic range on all channels Independent AGC facility incorporated into all

DIM1600FSM12-A000

Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5533-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

DIM200MHS12-A000

Contextual Info: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Preliminary Information Replaces issue May 2002, version DS5535-1.4 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-2.1 June 2002 KEY PARAMETERS

DIM2400ESM12-A000

Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5536-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

Contextual Info: DIM400DDM12-A000 Dual Switch IGBT Module Replaces DS5532-3.1 FEATURES 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated AlSiC Base with AlN Substrates DS5532-4 November 2009 LN26754 KEY PARAMETERS VCES VCE(sat) * (typ)

vqg44

Contextual Info: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over