DS610 Search Results

Contextual Info: Spartan-3A DSP FPGA Family: Complete Data Sheet R DS610 April 2, 2007 Advance Product Specification Module 1: Introduction and Ordering Information • DS610-1 v1.0 April 2, 2007 • • • • • • • Introduction Features Architectural Overview Configuration Overview

Contextual Info: DIM250PLM33-TS000 IGBT Chopper Module DS6108-1 June 2013 LN30636 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  Isolated AlSiC Base with AlN Substrates

Contextual Info: DIM1000ECM33-TL000 IGBT Chopper Module DS6105-1 June 2013 LN30633 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT

Contextual Info: DIM250PKM33-TS000 IGBT Chopper Module Replaces DS6106-1 DS6106-2 July 2013 LN30763 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max) IC(PK)

Contextual Info: DIM1000NSM33-TL000 Single Switch IGBT Module DS6109-1 June 2013 LN30637 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT

Contextual Info: DIM250PLM33-TS000 IGBT Chopper Module Replaces DS6108-1 DS6108-2 July 2013 LN30764 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max) IC(PK)

DFM250PXM33-TS000

Contextual Info: DFM250PXM33-TS000 Fast Recovery Diode Module DS6100-1 May 2013 LN30467 FEATURES KEY PARAMETERS • VRRM VF IF IFM Low Reverse Recovery Charge  High Switching Speed  Low Forward Volt Drop  Isolated AlSiC Base With AlN Substrates  High Current Density Enhanced DMOS

Contextual Info: DFM800XXM45-TS000 Fast Recovery Diode Module DS6101-1 May 2013 LN30483 FEATURES KEY PARAMETERS • VRRM VF IF IFM Low Reverse Recovery Charge  High Switching Speed  Low Forward Volt Drop  Isolated AlSiC Base With AlN Substrates  Dual Diodes Can Be Paralleled For 1600A Rating

DIM1500ASM33-TL001

Contextual Info: DIM1500ASM33-TL001 Single Switch IGBT Module DS6103-1 June 2013 LN30625 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10.2kV Isolation  10µs Short Circuit Withstand VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Thermal Cycling Capability

G5D2

Contextual Info: Spartan-3A DSP FPGA Family: Data Sheet R DS610 June 18, 2007 Product Specification Module 1: Introduction and Ordering Information • DS610-1 v1.2 June 18, 2007 • • • • • • • Introduction Features Architectural Overview Configuration Overview

Contextual Info: Data DIM1200ASM45-TS000 Single Switch IGBT Module Replaces DS6102-3 DS6102-4 December 2014 LN32160 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ)

DIM250PLM33-TS000

Abstract: DIM250PLM33-TS
Contextual Info: DIM250PLM33-TS000 IGBT Chopper Module Replaces DS6108-2 DS6108-3 September 2014 LN31958 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max)

Contextual Info: Preliminary Information Data DIM1200ASM45-TS000 Single Switch IGBT Module DS6102-1 May 2013 LN30516 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ)

Contextual Info: Preliminary Information Data DIM1200ASM45-TS001 Single Switch IGBT Module DS6107-1 June 2013 LN30635 FEATURES KEY PARAMETERS • 10.2kV Isolation  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK)

DFM800XXM45-TS000

Contextual Info: DFM800XXM45-TS000 Fast Recovery Diode Module DS6101-1 May 2013 LN30483 FEATURES KEY PARAMETERS • VRRM VF IF IFM Low Reverse Recovery Charge  High Switching Speed  Low Forward Volt Drop  Isolated AlSiC Base With AlN Substrates  Dual Diodes Can Be Paralleled For 1600A Rating

XC3SD3400ACS484

Abstract: XC3SD1800A L45N BLVDS25 SPARTAN-3A DSP 1800A UG332
Contextual Info: Spartan-3A DSP FPGA Family: Data Sheet R DS610 June 2, 2008 Product Specification Module 1: Introduction and Ordering Information • DS610-1 v2.1 June 2, 2008 • • • • • • • Introduction Features Architectural Overview Configuration Overview

Contextual Info: Preliminary Information Data DIM1200ASM45-TS000 Single Switch IGBT Module DS6102-1 May 2013 LN30516 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ)

progress of diagram of voice command

Abstract: power line communication modem 8251A
Contextual Info: Ja Dallas Semiconductor 212A MODEM Module FEATURES DS6101 DS6103 PIN DIAGRAM • Very small size - 2.28" x 1.0" x 0.5" • Full Bell 212A/103 Modem compatibility • FCC Part 68 registered DAA • Call progress Monitoring • Tone or pulse dialing • DTMF sensing and decoding

DIM1000ECM33-TL000

Abstract: DIM1000ECM33-TL
Contextual Info: DIM1000ECM33-TL000 IGBT Chopper Module Replaces DS6105-1 DS6105-2 March 2014 LN31424 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT

xc3sd3400a

Abstract: CS484 XC3SD1800A DS610 DSP48A fg676 xc3s1800a SRL16 UG331 UG332
Contextual Info: Spartan-3A DSP FPGA Family: Data Sheet R DS610 March 11, 2009 Product Specification Module 1: Introduction and Ordering Information • DS610-1 v2.2 March 11, 2009 • • • • • • • Introduction Features Architectural Overview Configuration Overview

Contextual Info: Preliminary Information Data DIM1200ASM45-TS001 Single Switch IGBT Module DS6107-1 June 2013 LN30635 FEATURES KEY PARAMETERS • 10.2kV Isolation  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK)

DIM1000NSM33-TL000

Abstract: DIM1000NSM33-TL
Contextual Info: DIM1000NSM33-TL000 Single Switch IGBT Module DS6109-1 June 2013 LN30637 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT

xc3s1800a

Abstract: XC3SD1800A xc3sd3400a DS610 DSP48A SRL16 UG331 UG332 T4 621 L42P
Contextual Info: Spartan-3A DSP FPGA Family: Data Sheet R DS610 July 16, 2007 Product Specification Module 1: Introduction and Ordering Information • DS610-1 v2.0 July 16, 2007 • • • • • • • Introduction Features Architectural Overview Configuration Overview

DIM1200ASM45-TS001

Contextual Info: Data DIM1200ASM45-TS001 Single Switch IGBT Module Replaces DS6107-1 DS6107-2 October 2013 LN31065 FEATURES KEY PARAMETERS • 10.2kV Isolation  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)