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131-8118-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
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131-8118-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. |
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10137926-1811LF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP, Tape and Reel with cap. |
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10132450-1811GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing. |
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68418-114HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail |
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