CTS 750 series
Abstract: 3570 1301 051 94v0 1052 schematic amplify CV 203 TMC 3162 3570 1301 PSA 88C Delco Electronics 3570 1301 151 Delco Electronics 185
Text: R E S I S T O R P R O D U C T S The CTS Resistor Products Catalog is also on the World Wide Web at www.ctscorp.com. The Web Catalog is updated regularly to provide all customers with the latest information on new products and improvements. You can also contact us at
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WAUKESHA 88 STAINLESS MATERIAL
Abstract: PMB 8878 20000 watt schematics power amp royal ohm chip resistor 0805 LA 7670 royal ohm chip resistor 0603 thick film chip resistor royal ohm CTS type 850 RESISTOR NETWORK 10k resistor array SIP Resistor 10K sip ROYAL OHM
Text: R E S I S T O R ELECTROCOMPONENTS C A T A L O G Complete Resistor Products Solutions CTS, a world leader in the design and manufacture of resistor products, has consistently led the industry in the development of thick film materials and the introduction of standard
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Untitled
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION A Change the vendor part number from TPS61222MDCK to TPS61222MDCKTEP as specified under paragraph 6.3. - ro Prepared in accordance with ASME Y14.24 DATE APPROVED 13-04-01 C. SAFFLE Vendor item drawing REV PAGE REV PAGE REV STATUS
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TPS61222MDCK
TPS61222MDCKTEP
V62/12603
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2n2 j100
Abstract: No abstract text available
Text: CH EA ce /R lian on iti HSmp Ro Co Ed 12 20 High Frequency Ceramic Solutions Antennas 88 MHz-10 GHz Baluns Capacitors (Hi Q, Low Loss) Chipset-Specific Impedance Matched Balun-Filters Couplers Diplexers Filters (Band-Pass, Low-Pass, etc) Inductors (Wirewound & Monolithic)
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Hz-10
2n2 j100
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2450BM15A0002
Abstract: 5400BL15B100 2450BM14A0002 microwave product 2450AT42A100 STLC2690 inductor marking Johanson Technology 2450FB15L0001 bluetooth BC05 5400BL15B050
Text: CH EA ce /R lian HSmp Ro Co High Frequency Ceramic Solutions Antennas 88 MHz-10 GHz Baluns Capacitors (Hi Q, Low Loss) Chipset-Specific Impedance Matched Balun-Filters Couplers Diplexers Filters (Band-Pass, Low-Pass, etc) Inductors (Wirewound & Monolithic)
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Hz-10
2450BM15A0002
5400BL15B100
2450BM14A0002
microwave product
2450AT42A100
STLC2690
inductor marking
Johanson Technology 2450FB15L0001
bluetooth BC05
5400BL15B050
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WLCSP stencil design
Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
Text: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages
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SBVA017
300mm
MO-211
WLCSP stencil design
ja 16201
WLCSP smt Texas
wcsp
wcsp reliability
A104B
IPC-7525
JESD22
S2062
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NFC 32062
Abstract: NVP 1204 NF C 32-070 M0352 cti 600 polyester tape 32070 IEEE standards 801-4 N3296 rodent UTP CAT7 cables
Text: CONTENTS The ACOLAN 2001 - Optical and Copper product range choosing your cable 3 General information concerning optical fibre cables 7 The ACOLAN 2001 - Optical cable range 10 General information concerning copper cables 28 The ACOLAN 2001 - Copper cable range
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Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 PMIC N/A PREPARED BY RICK OFFICER Original date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA 13-06-12 4
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V62/13612
5962-V050-13
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0900BL18B200
Abstract: S805D 500L41L120XG4 smd V05 2450BL15B200 substitution 0900BL18B100 SMD transistor package code V12 SMD package code V12 Johanson Dielectrics marking code v4t
Text: C e HlSianc Roomp High Frequency Ceramic Solutions Antennas Baluns Capacitors - Low Loss Couplers Combiners Diplexers Filters - Notch, BP, LP Inductors IPC’s Integrated Passive Components Modules 90 Hybrids Substrates 931 VIA ALONDRA, CAMARILLO, CALIFORNIA 93012 • TEL (805) 389-1166 • FAX (805) 389-1821
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TCAT-1103
0900BL18B200
S805D
500L41L120XG4
smd V05
2450BL15B200 substitution
0900BL18B100
SMD transistor package code V12
SMD package code V12
Johanson Dielectrics
marking code v4t
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Untitled
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE APPROVED A Add device type 02 and case outline Y. - ro 13-02-14 C. SAFFLE B Make correction to ENBL pin and IN pin input voltage, delete -5 V and substitute -0.3 V as specified under paragraph 1.3. Delete power dissipation limit entirely from paragraph 1.3. - ro
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27322M
UCC27322MDEP
V62/11601
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HR5000
Abstract: U10-2 SMD CAPACITOR 1206 2.2Mf 16V smd code 12.00 Jn 1K100 NOJB107M006 FXXXX Plastic Mold CRYSTAL SMD TCJD106M050 CWR11
Text: www.avx.com AVX Tantalum and Niobium Oxide Capacitors Version 10.10 Contents SECTION 1: SURFACE MOUNT COMMERCIAL TANTALUM Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
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S-TL0M1010-C
HR5000
U10-2
SMD CAPACITOR 1206 2.2Mf 16V
smd code 12.00 Jn
1K100
NOJB107M006
FXXXX
Plastic Mold CRYSTAL SMD
TCJD106M050
CWR11
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EIA 763
Abstract: AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC
Text: AN2348 Application note IPAD and ASD Application Specific Devices 400 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip-Chips. For information on 500 µm FlipChips, see Application note AN1235.
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AN2348
AN1235.
EIA 763
AN2348
EIA standards 783
STMicroelectronics smd marking code
WLCSP stencil design
10E12
10E4
10E8
AN1235
ANTISTATIC
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EIA standards 783
Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.
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AN1235
AN2348.
EIA standards 783
smd diode order marking code stmicroelectronics
EIA 481-C
bulk id
EIA standards 763
EIA 763
IEC-60286-3
WLCSP flip chip
WLCSP stencil design
st smd diode marking code
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TAJE107M025
Abstract: 3216 footprint IPC Ta2O5 phase diagram TLJG107M004 TPS 1028 CWR09 CWR11 CWR19 CWR29 TS16949
Text: www.avx.com AVX Tantalum and Niobium Oxide Capacitors Version 10.5 Contents SECTION 1: SURFACE MOUNT COMMERCIAL TANTALUM Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
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S-TL0M410-C
TAJE107M025
3216 footprint IPC
Ta2O5 phase diagram
TLJG107M004
TPS 1028
CWR09
CWR11
CWR19
CWR29
TS16949
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DO-2144AA
Abstract: No abstract text available
Text: World Products Inc. 19654 8th St. East, Sonoma, CA, USA, 95476 . . Phone: 707 996-5201 . . Fax: (707) 996-3380 Thyristors - SMTBJ Specifications FEATURES • · · · Bi-directional transient voltage protection. Nano second clamping response. Surge capability up to 250 amps.
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DO-2144AA
300mm
330mm
DO-214AA
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Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE APPROVED A Add a footnote to Table I. Add two footnotes to figure 1. Update boilerplate paragraph to current requirements. - ro 10-10-19 C. SAFFLE B Add device type 02. Table I, Line regulation and Load regulation tests, under conditions column,
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TPS54680QPWPREP
V62/04641-02XE
TPS54680MPWPEP
TPS54680MPWPREP
V62/04641
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Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 PMIC N/A PREPARED BY RICK OFFICER Original date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA 13-07-01 4
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V62/13610
5962-V048-13
V62/13610-01XE
THS4500MDGNREP
THS4500MDGNEP
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RL1206 Yageo
Abstract: Yageo Rl0805 Rl0805 RL1206 "material declaration sheet" for chip resistor YNSC005 1206 footprint dimension
Text: DATA SHEET LOW OHMIC HIGH POWER CHIP RESISTORS RL-High power series Pb Free 5%, 1% Product specification – May 30, 2005 V.0 sizes 0805/1206 Product specification Chip Resistor Surface Mount RL-High power SERIES 2 7 0805/1206 (Pb Free) SCOPE This specification describes RL0805/1206 low ohmic high power chip resistors with lead-free terminations made
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RL0805/1206
RL0805
RL1206
RL1206 Yageo
Yageo Rl0805
Rl0805
RL1206
"material declaration sheet" for chip resistor
YNSC005
1206 footprint dimension
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po720eb
Abstract: RD2 earth leakage relay WR1 marking code LXT441PE optoisolator wr1 zener WR1 scr optoisolator SCR TRIGGER PULSE TRANSFORMER 656 dsu csu LXT441PE pin out
Text: LXT441 Switched 56/DDS Integrated DSU/CSU Datasheet General Description The LXT441 is an integrated transceiver and data formatter for Switched 56 SW56 and Digital Data Service (DDS) Data Service Unit/Channel Service Unit (DSU/CSU) applications. The LXT441 line interface section performs transmit pulse shaping and receive signal data and
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LXT441
56/DDS
LXT441
EIA530
LXT441PE
44-Pin
LXT441PE
po720eb
RD2 earth leakage relay
WR1 marking code
optoisolator wr1
zener WR1
scr optoisolator
SCR TRIGGER PULSE TRANSFORMER
656 dsu csu
LXT441PE pin out
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560 resistor smd
Abstract: SMD MARKING CODE 221 resistor
Text: Features • ■ ■ Standard E.I.A. package compatible with automatic placement equipment Compliant leads to reduce solder joint fatiguing Tape and reel packaging standard For information on specific applications, download Bourns' application notes: DRAM Applications
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4400P
100ppm/
250ppm/
50ppm/
RS-481-2.
4416P
4420P
4814P
4816P
4818P
560 resistor smd
SMD MARKING CODE 221 resistor
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Abstract: No abstract text available
Text: Features • ■ ■ ■ ■ Standard E.I.A. package compatible with automatic placement equipment Tape and reel packaging standard Marking on contrasting background for permanent identification Compliant leads to reduce solder joint fatiguing ■ Standard electrical schematics: isolated,
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4800P
100ppm/
250ppm/
50ppm/
RS-481-2.
4416P
4420P
4814P
4816P
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Untitled
Abstract: No abstract text available
Text: Features • Standard E.I.A. package compatible with automatic placement equipment Compliant leads to reduce solder joint fatiguing Tape and reel packaging standard ■ ■ ■ ■ ■ Marking on contrasting background for permanent identification Standard electrical schematics: isolated,
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4400P
100ppm/
250ppm/
50ppm/
RS-481-2.
4416P
4420P
4814P
4816P
4818P
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y5s 0022 100v
Abstract: cera-mite z5u 1kv CERA-MITE Y5V 2KV cera-mite .1m 2kv y5s 0022 cera-mite z5u .05 440l cera-mite 5GAP10
Text: C E R A - H IT E CORP S 1 E D 2 0 Q 2 n 2 4 a a G G O lS b 2 b C E R A V I fIT £ = OVERLOAD R ES En A B LE OVERCURRENT PROTECTION WORKSHEET A ' /I- Í T KEY PARAMETERS: lc Carry Current of_ mA fo r. and_ . mA for. D iam eter min. @ 25°C Thickness
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X5F 100M 3KV
Abstract: y5u 103 m 1KV SEC ceramic capacitor 5GA-T20 y5s 0022 100v
Text: C E R A -n iT E CORP S1E OVERLOAD D • 20Q 2Q 24 . -. □ □ □ □ □ IS b 2 b ■ C E R k 'M / T E = . RESEnABLE OVERCURRENT PROTECTION WORKSHEET ^ / _ T KEY PARAMETERS: lc Carry Current o f _ mA f o r _ min. @ 25°C
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