EMMC IMPEDANCE Search Results

16G nand flash

Abstract: emmc csd emmc mmc EXT_CSD emmc Extended CSD NAND16GAH0D EXT_CSD NUMONYX emmc 3R14 CRC16
Contextual Info: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,

CMD24

Abstract: emmc ball
Contextual Info: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,

NAND08GAH0B

Abstract: emmc csd emmc Initialization CMD24 emmc ball emmc 4.4 standard jedec MultiMediaCard System Specification MultiMediaCard System Specification Version MMCA emmc jedec mechanical standard emmc spi
Contextual Info: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification, compliant with V4.2

EXT_CSD

Abstract: eMMC emmc 4.5 MultiMediaCard System Specification Version MMCA 16G nand flash CMD60-CMD63 mmc EXT_CSD NAND08GAH0A eMMC 4.4 rca a 8321
Contextual Info: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC™/MultiMediaCard system

KLM8G2FEJA-A001

Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Contextual Info: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.

emmc 5.0

Abstract: numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc
Contextual Info: NAND225AQA5P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM

eMMC data retention

Abstract: emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0
Contextual Info: NAND225AQA9P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM

emmc pin

Abstract: 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp
Contextual Info: NAND114APA5M 1-Gbit, mux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • ■ ■ MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM

emmc pin

Abstract: emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH
Contextual Info: NAND114AQA5M 1-Gbit, demux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM

sandisk emmc 4.5

Abstract: sandisk eMMC 4.41 emmc controller sandisk emmc emmc 4.41 spec emmc spec circuit diagram sandisk 64 mb hitachi eMMC eMMC 4.51 sandisk micro sdhc
Contextual Info: TMS320C5535/34/33/32 Ultra-Low Power DSP Technical Reference Manual Literature Number: SPRUH87 August 2011 2 Copyright 2011, Texas Instruments Incorporated SPRUH87 – August 2011 Submit Documentation Feedback Contents . 33

Manufacturer ID list eMMC

Abstract: emmc 4.41 spec finder type 81.11
Contextual Info: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Contextual Info: CONFIDENTIAL ADVANCE INFORMATION Phoenix 3 CD SoC Product Brief Analog Reinvented The Phoenix III CD is an SoC targeted for CD home-theater receivers and mini-components applications. It integrates all required CD AFE/servo, audio and microcontroller MCU functions in a 176-pin Low Profile Quad Flat Pack (LQFP)

OMAP5430

Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Contextual Info: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.

rk3188

Abstract: RK3188-T ARGB888 emmc boot sequence
Contextual Info: RK3188Technical Reference ManualRev 1.2 Chapter 1 Introduction RK3188 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates quad-core Cortex-A9 with separately NEONand FPU coprocessor.

SVID protocol

Contextual Info: Agilent Infiniium 9000 H-Series High-Definition Oscilloscopes Data Sheet See Your Signals in HD See Your Signals in HD The high-deinition 9000 H-Series oscilloscope offers up to 12 bits of resolution, which represents 4096 quantization levels, for precision signal viewing. The 9000 H-Series’

beaglebone black

Abstract: KE4CN2H5A-A58 D2516EC4BXGGB NC107 MTFC4GLDEA
Contextual Info: A B C D C B A6A A6 1. Changed R46, R47,R48 to 0 ohms. 2. Changed R45 to 22 Ohms. Change was made due to production failures on some boards due to differences in impedances. A5C 5 4 THERE IS NO WARRANTY FOR THIS DESIGN , TO THE EXTENT PERMITTED BY APPLICABLE LAW. EXCEPT WHEN OTHERWISE STATED

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Samsung eMMC 4.51

Abstract: samsung eMMC 4.5
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch