EMRS 42 Search Results

Contextual Info: EMRS-1L E-Series Surface Mount Mixer 0.5—500 MHz SM-1 Package Features • • • LO Power +3 dBm Up to –1 dBm RF Surface Mount Description M/A-COM’s EMRS-1L is a low drive , surface mount mixer suitable for use in wireless applications. Electrical Specifications @ -55°C - +100°C , Z0 = 50 Ohms, LO = +3dBm

em6ab160

Abstract: EM6AB160TSA EM6AB160TSA-5G DQ11 EM6AB160TS
Contextual Info: EtronTech EM6AB160TSA 32M x 16 bit DDR Synchronous DRAM SDRAM Etron Confidential Features • • • • • • • • Fast clock rate: 200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

AS4C8M16D1-5TIN

Contextual Info: AS4C8M16D1 8M x 16 DDR Synchronous DRAM SDRAM Released (Rev. 1.1, Feb. /2009) Confidential Features Overview Fast clock rate: 200MHz Differential Clock CK & CK input Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

Contextual Info: AS4C8M16D1 8M x 16 DDR Synchronous DRAM SDRAM Confidential Advanced (Rev. 1.1, Feb. /2009) Features Overview Fast clock rate: 200MHz Differential Clock CK & CK input Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

AS4C32M16D1-5TIN

Abstract: AS4C32M16D1
Contextual Info: AS4C32M16D1 32M x 16 bit DDR Synchronous DRAM SDRAM Alliance Memory Confidential Advanced (Rev. 1.1, July / 2011) Features Overview Fast clock rate: 200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation

AN-100

Abstract: CPC7582BC EIA-481-2 J-STD-020A 5510P
Contextual Info: CPC7584 Line Card Access Switch Description • Small 16-pin SOIC or micro-leadframe package • Micro-leadframe package MLP printed circuit board footprint is 70% smaller than 4TH generation EMRs and 60% smaller than SOIC version • Monolithic IC reliability

AS4C4M16D1-5TIN

Abstract: AS4C4M16D1
Contextual Info: AS4C4M16D1 4M x 16 DDR Synchronous DRAM SDRAM Alliance Memory Confidential Advanced (Rev. 1.0, May /2011) Overview Features Fast clock rate: 200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

EM6AA160TSA-5G

Abstract: EM6AA160TSA EM6AA160 EM6AA160TSA-4G EM6AA160TS Etron Technology
Contextual Info: EtronTech EM6AA160TSA 16M x 16 bit DDR Synchronous DRAM SDRAM Etron Confidential Features • • • • • • • • Fast clock rate: 250/200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

AS4C16M16D1-5TIN

Abstract: AS4C16M16D1
Contextual Info: AS4C16M16D1 16M x 16 bit DDR Synchronous DRAM SDRAM Alliance Memory Confidential Features Fast clock rate: 200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture Four internal banks, 4M x 16-bit for each bank

AN-100

Abstract: CPC7583 GR-1089-CORE J-STD-020A
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 28-pin SOIC or micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs, and 60% smaller footprint than SOIC version • Monolithic IC reliability

EM6A9160TSA-5G

Abstract: EM6A9160TSA EM6A9160 em6a9160ts em6a916
Contextual Info: EtronTech EM6A9160TSA 8M x 16 DDR Synchronous DRAM SDRAM Etron Confidential Features • • • • • • • • Fast clock rate: 200MHz Differential Clock CK & CK input Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

bt 1696

Abstract: 1A12 DDR200 DDR266A DDR266B DDR333
Contextual Info: Device Operations DDR SDRAM C. Device Operation Simplified State Diagram Power Applied Power On Precharge PREALL Self Refresh REFS REFSX MRS MRS EMRS REFA Idle Auto Refresh CKEL CKEH Active Power Down ACT Precharge Power Down CKEH CKEL Burst Stop Row Active

em6ab160

Abstract: EM6AB160TSC-5G EM6AB160TSC EM6AB160TS
Contextual Info: EtronTech EM6AB160TSC 32M x 16 bit DDR Synchronous DRAM SDRAM Etron Confidential Features • • • • • • • • Fast clock rate: 200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

EM6A8160

Abstract: EM6A8160TSA EM6A8160TSA-5G
Contextual Info: EtronTech EM6A8160TSA 4M x 16 DDR Synchronous DRAM SDRAM Etron Confidential Features • • • • • • • • Fast clock rate: 200MHz Differential Clock CK & CK Bi-directional DQS DLL enable/disable by EMRS Fully synchronous operation Internal pipeline architecture

CPC7583

Abstract: GR-1089-CORE
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

CPC7583

Abstract: GR-1089-CORE 05S400
Contextual Info: Not for New Designs CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

AN-100

Abstract: CPC7583 GR-1089-CORE Cadence
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 20 pin or 28 pin SOIC or 28 pin micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

Contextual Info: Not for New Designs CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

512 volt 100 current scr

Abstract: AN-100 CPC7583 GR-1089-CORE IPC-9502
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 20 pin or 28 pin SOIC or 28 pin micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

K0135

Contextual Info: Not for New Designs CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

anzac mixers

Abstract: "RF Mixers" ANZAC EMT-3MH anzac mixer anzac EMA-220 MIXER EMA ANZ ESCM-1 sm314 EMRS-5
Contextual Info: n / A - C O M INC/ AN ZA C DIV SIE jm om D • 5^43177 0003577 145 ■ ANZ ^ P 7^ o S ' O l ANZAC RF & CELLULAR COMPONENTS Low Cost Frequency Mixers LEVEL 3 +3 dBm LO, up to -3 dBm RF SURFACE MOUNT MIXER FREQUENCY MHz L0/RF IF MODEL NO. EMRS-2L CONVERSION LOSS dB

ca10 switch

Abstract: EM42AM1684RTA edo ram 16Mx16
Contextual Info: 256Mb DDR SDRAM Ordering Information EM 42 AM 16 8 4 R T A – 75 L EOREX MEMORY EDO/FPM D-RAMBUS DDRSDRAM DDRSGRAM SGRAM SDRAM : : : : : : Power S : Standard L : Low power 40 41 42 43 46 48 Package F : Pb-free G: Green Density 32M : 32 Mega Bits 16M : 16 Mega Bits

Contextual Info: ESM T M14D1G1664A 2D 7DDR II SDRAM 8M x 16 Bit x 8 Banks DDR II SDRAM Features  JEDEC Standard  VDD = 1.8V  Internal pipelined double-data-rate architecture; two data access per clock cycle  Bi-directional differential data strobe (DQS, DQS ); DQS can be disabled for single-ended data strobe operation.

Contextual Info: ESMT DDR II SDRAM M14D2561616A 4M x 16 Bit x 4 Banks DDR II SDRAM Features z JEDEC Standard z VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V z Internal pipelined double-data-rate architecture; two data access per clock cycle z Bi-directional differential data strobe DQS, DQS ; DQS can be disabled for single-ended data strobe operation.