EPOXY, GLASS LAMINATE Search Results

Contextual Info: AT-BUS Prototyping Board Stock No. RE 429 EP - Epoxy fibre-glass reinforced laminated FR4 1.50 mm double-sided 35 |jm CU - Plated through-holes HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido

Contextual Info: Epoxy glass cloth base laminated FR4 5.10 RATING ,5 .9 0 ^ °10 DATE CODE EPOXY SEAL « mm CO a d a d co MM MM TT TT 0.76+.o.oo 0.76+gi1 - 0.00 5.08 10.16 14.35 P.C. MOUNTING 6 .0 5 _ ▲ ID csi SWITCH FUNCTION + 3 POS. 1 T2 Model No. 1 01.09 & POS. 2 4

433.92 Mhz oscillator 12v

Abstract: mipot 433.92 43402 tip1220
Contextual Info: 433.92 MHZ - AM TRANSMUTER 12V VERSION Description: Highlights: Applications: p. n. 3-2000267 AM Transmitter Module, manufactured in SMT technology on glass-epoxy laminate developed for fixed systems applications. Stand-by supply current lower than 0.1 joA.

Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

Contextual Info: High Power Chipled EOC20IRH 100 AG Preliminary Data Chip-LED Features - Circuit substrate-glass laminated epoxy - Directive characteristic 110° - Dimension: 3.2 L x 2.8 (W) x 1,6 (H) mm3 - Soldering pads: gold plated, all soldering methods applicable - Infrared GaAlAs (870nm)

Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life

Contextual Info: NEW Dialight Surface Mount LED Right Angle Type Package 597-2xx1-4xx SUBSTRATE GLASS FIBER LAMINATE CLEAR EPOXY LENS LED DIE ANODE LUMINOUS DIRECTION 3.0 [.118] .88 [.035] 2.0 [.079] 2X .30 [.012] 1.00 [.039] MECHANICAL SOLDERING REINFORCEMENT PAD COLOR

Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life

CAT 7114

Abstract: SE12XC09
Contextual Info: TERMINAL & COMPONENT BOARDS COMPONENT CARRIERS Designed for mounting discrete components such as resistors, capacitors, diodes and other electronic components. Carriers plug directly into panel boards or sockets. FEATURES •VARIETY • FLAME RETARDANT EPOXY GLASS BASE

Contextual Info: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-180 Series Size 0805 Low Profile SMT LEDs DESCRIPTION AND FEATURES Features •Circuit substrate-glass laminated epoxy

Epoxy, glass laminate

Contextual Info: Multiadapter RE1070 - Glass reinforced epoxy laminate FR4 0.80 mm one-sided 35 µm CU<br><br>- 12 self-adhesive strips in pitch 0.50 mm<br>- scribed predetermined breaking point<br>- Surface area made from Au<br><br> - Size 90 x 100 mm

Contextual Info: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-130 Series Size 1206 Duplex SMT LEDs DESCRIPTION AND FEATURES Features •Circuit substrate-glass laminated epoxy

"Vibration Sensor"

Abstract: VIBRATION SENSOR Micro Sensor mvs-0608 VIBRATION SWITCH "Vibration switch" corrosion sensor VIBRATION SENSOR, vibrations sensor D-76133
Contextual Info: Data Sheet Micro Vibration Sensor MVS 0608.02 omnidirectional Version: V 2.0 The ball bridges two contacts reducing the resistance between the two external connection pads from several mega ohms (>30MOhm) to below 100 ohms. Material Package PCB laminate material (FR4, epoxy glass

Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)

Preci-Dip

Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)

Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O

FR4 epoxy dielectric constant 4.2

Abstract: panasonic r1551 FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.6 prepreg 1037 r1566 FR4 dielectric constant 4.4 thickness 1.6 R1551 epoxy prepreg panasonic FR4 dielectric constant 4.3
Contextual Info: Data Sheet Halogen-free Glass Epoxy Multi-layer Materials Laminate R-1566 W Prepreg R-1551(W) UL/ANSI FR-4 Primary:/127 IPC-4101 Slash Sheet Secondary:/92 /93 /94(*) /95(*) /122 /125(*) /128(*) (*)；Tg measurement is limited to DMA method for Slash Sheet

Contextual Info: AG Luitpoldstr. 6 D-85276 Pfaffenhofen EOM32 - White Series Standard LED – white - Size 1206 - Features 3 Size 1206 - 3,2 L x 1,6(W) x 1,2(H) mm Directive characteristic 150° Circuit substrate-glass laminated epoxy Soldering pads: gold plated, all soldering methods applicable

Contextual Info: FEATURES • Circuit substrate-glass laminated epoxy • Size 1206:3.2 L x 1.6 (W) x 1.2(H) mm • Soldering pads: gold plated, all soldering methods applicable • HY, HD (AllnGaP) high luminous intensity types • Taped in 8 mm-blister tape, cathode marking to

fr4 94v0

Abstract: 12X12 nema 23 NEMA FR-4
Contextual Info: Vectorbord: 12X12WE Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12WE 12.0" W x 12.0 " L .No Holes.FR-4 Epoxy Glass .UNCLAD PCB SHEET MATERIAL Dimension 12" X 12" Square Sheets of FR-4 PCB laminate with NO COPPER

150HY

Contextual Info: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-150 Series Size 1206 Standard SMT LEDs DESCRIPTION AND FEATURES 1.20 1.60 0.40 2.00 3.20 Features •Circuit substrate-glass laminated epoxy

Contextual Info: Surface Mount LED Right Angle Type Package SUBSTRATE GLASS FIBER LAMINATE 597-2xx1-4xx PART NO.* 597-2002-4xx 597-2111-4xx 597-2201-4xx 597-2212-4xx 597-2222-4xx 597-2311-4xx 597-2401-4xx ANODE CLEAR EPOXY LENS MECHANICAL SOLDERING REINFORCEMENT PAD .88

cem-1 94v-0

Abstract: CEM-1 pcb
Contextual Info: Vectorbord: 12X12C1 Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12C1 12.0" W x 12.0 " L .No Holes.CEM-1 Epoxy Glass COMPOSITE. .COPPER-CLAD 1 SID PCB Sheet Material Dimension 12" X 12" Square Sheets of CEM-1 PCB laminate