EPOXY EMC TI Search Results

siemens 230 96

Abstract: z1221 HP 4194A
Contextual Info: EMC Components SMT Inductors SIMID 1812-Z Data Book Supplement SMT Inductors SIMID 1812-Z B82432-Z Size 1812/4532 inch/mm Rated inductance 0,22 to 1000 µH Rated current 0,04 to 0,7 A Construction ● Ferrite core ● Laser soldered, molded epoxy encapsulation

Z1223

Abstract: Z1122 siemens 350 98 z1471 z1394
Contextual Info: EMC Components SMT Inductors SIMID 1812 B82432-Z Data Book Supplement Vakatseite 2 SMT Inductors SIMID 1812 B82432- Z Size 1812/4532 (inch/mm) Rated inductance 0,22 to 1000 µH Rated current 0,04 to 0,7 A Construction ● Ferrite core ● Laser soldered, molded epoxy encapsulation

mkt 344 polyester

Abstract: r46 arcotronics en132400 275VAC MKT 100 arcotronics 1.40 MKT X2 arcotronics R60 arcotronics MKP 31.5 IEC60068-1 arcotronics R82 ARCOTRONICS R46 nissei capacitor
Contextual Info: EMC, FILTERS & SUPPRESSION EPCOS type B81130 / B3292❋ CAPACITORS, Plastic Film series & B81122 A range of radial lead X2 and Y2 capacitors, with extensive approvals, designed for mains interference suppression. Meets EN132400 IEC60384-14 2nd edition , the unified European safety standard. Epoxy resin encapsulated in flame retardant plastic cases.

H20E

Contextual Info: TPJ £ 1 1 *2 Tvdmob^i Slowave Miniature Delay Line ^ T J Mounting Instructions m . _ mm . A p p lic a tio n N o te s A p p lic a tio n N o te 0 0 6 S lo w a v e ® M in ia tu re D e la y Lin e M o u n tin g In s tru c tio n s Mounting Instructions for the Leadless Surface M ount Delay Line package.

TAG 203 350

Abstract: TPS103A TPS204B TPS203E SLT-P-22000
Contextual Info: Solder Mounted C Filter Data Sheets Solder Mounted C and Pi Circuit Filters SLT Circuit Diagram Ordering Information Please state Part Number. Materials SLT1/C/- Mounting eyelet: Brass, silver finish. Feedthrough terminations: Copper alloy, tin lead or silver finish.

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

Contextual Info: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

mg 5473

Contextual Info: Package Details SOT-223C Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223C Case

84-1LM

Abstract: ECF564A
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with

TR13

Abstract: bond wire gold
Contextual Info: Package Details - SOT-223 Mechanical Drawing Lead Code: Part Marking: Full Part Number. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R3 (5-November 2007)

MMR4

Abstract: case 418 sot223 TR13
Contextual Info: Package Details SOT-223 Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R4 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223 Case Tape Dimensions and Orientation (Dimensions in mm)

On semiconductor date Code sot-223

Abstract: 6382 tRANSISTOR CZT75 5648 marking transistor marking code 443
Contextual Info: CZT751 SURFACE MOUNT PNP HIGH CURRENT SILICON TRANSISTOR Central TM Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CZT751 type is a PNP Silicon Transistor manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for high

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

ECF564A

Contextual Info: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package R-1 Package Weight mg 181 Product Group Type No. 1H1 – 1H8 1A1 – 1A7 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBL Package Weight mg 2000 Product Group Type No. GBJ2A – GBJ2M GBL00 – GBL10 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package D3K Package Weight mg 1500 Product Group Type No. D2KB05 – D2KB100 D3KB05 – D3KB100 D4KB05 – D4KB100 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBJ-4 Package Weight mg 4600 Product Group Type No. GBJ4A – GBJ4M GBJ10A – GBJ10M Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBL Package Weight mg 5600 Product Group Type No. KBL400 – KBL410 KBL400G – KBL410G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package DF-S Package Weight mg 380 Product Group Type No. DF005S – DF10S DF150S – DF1510S DF200S – DF2010S Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBP Package Weight mg 1700 Product Group Type No. GBP200 – GBP210 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Solder Alloy Leadframe MSL Rating

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARS Package Weight mg 1600 Product Group Type No. ARS25A – ARS25J ARS35A – ARS35J ARS50A – ARS50J Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MB-S Package Weight mg 120 Product Group Type No. B1S – B10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBP Package Weight mg 1700 Product Group Type No. KBP150 – KBP1510 KBP200 – KBP2010 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin