EUTECTIC 157 Search Results

PT 2102 ic

Abstract: HXTR-41Q1 HXTR-4101TXV 2N6679 HPAC-70GT HXTR-2101 HXTR-4101 hxtr-6105 6105tx BV EI 302 2003
Contextual Info: H E W L E T T - P A C K A R D n CMPNTS EOE D £3 44475Û4 m General Purpose Transistors HXTR-2001 Chip Technical Data Features ^ k laert ; LJ Generic Chip HXTR-2001 Recommended Die Attach and Bonding Procedures Eutectic Die Attach at a stage temperature of 410 ± 10°C under

Contextual Info: Product Number: 350-10-157-00-001100 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Single Row Through Hole Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel # Of Pins Mill-Max Part Number 57 350-10-157-00-001100

Contextual Info: Product Number: 330-10-157-00-240000 Description: Interconnect Header Spring-Loaded Target Connector Single Row Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel # Of Pins Mill-Max Part Number 57 330-10-157-00-240000 RoHS Compliant LOOSE PIN:

LA-BGA-FG680-S-B-01

Abstract: TLA700 FG680
Contextual Info: LA-BGA-FG680-S-B-01 Drawing Top View 0.2620" [6.654mm] 6.2000" [157.480mm] 2.6000" [66.040mm] Bottom View Page 1 of 2 Description: LA adaptor for TEKTRONIX TLA700 series Logic Analyzer 680 position BGA land socket to 680 position surface mountable BGA emulator foot, with latch housing high density Mictor

AMD reflow soldering profile BGA

Abstract: visteon ford visteon eutectic 157 SMALL ELECTRONICS PROJECTS AMD reflow BGA ROHS nortel meridian Delco SIEMENS WASHING machine TOSHIBA GLASS MOLD
Contextual Info: Lead Pb -Free Packaging Strategy 2000− −2003 . . . . . JUNE 2000 (DECEMBER 2001 Update) . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that the words “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same, although they have

Contextual Info: Product Number: 340-43-157-30-780100 Description: Interconnect Socket .100 Grid; Surface Mount Socket Single Row; Block Style Surface Mount Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 " Tin matte finish over 100 μ" Nickel Inner Contact Plating:

amd (BGA) replacement alloy

Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony
Contextual Info: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different

Contextual Info: Product Number: 340-99-157-30-780100 Description: Interconnect Socket .100 Grid; Surface Mount Socket Single Row; Block Style Surface Mount Accepts .015-.025" Leads Plating Code: 99 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 340-44-157-30-780100 Description: Interconnect Socket .100 Grid; Surface Mount Socket Single Row; Block Style Surface Mount Accepts .015-.025" Leads Plating Code: 44 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:

eutectic 157

Abstract: advanced 94vo fr4
Contextual Info: SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE BGA LGA ADVANCED

eutectic 157

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE

Contextual Info: ADVANCED aKJA« INTERCONNECTIONS. LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 » Fax 401-823-8723 •Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter

Material density CDA 195

Abstract: eutectic 157 CDA 194 olin 7025 Eftec 64t X10-4 resistivity table sn 8400 MF202 silver
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

Allen-Bradley 509 heater elements

Abstract: Allen-Bradley bulletin 509 starter bj 945 513-BD Allen-Bradley W heater elements Allen-Bradley bulletin 512 starter Allen-Bradley starter 709 Bulletin 509 contactor coils 512-DA 513-BF
Contextual Info: PROGRAM Rockwell Automation Program for Allen-Bradley NEMA Combination and Non-Combination Starters WHEN YOU DON’T HAVE time TO WAIT SUPER ModCenter Program. One day shipment from factory. Time is money. You need products quickly. The Rockwell Automation SUPER ModCenter Program for Allen-Bradley

eutectic 157 b

Abstract: BT 742
Contextual Info: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications

Contextual Info: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications

Sn-37Pb

Abstract: PBGA 256 reflow profile C1448 STR 6253 IR50 37pb nec smd transistors
Contextual Info: 1. NEC Electronics Lead Elimination Policies 1-1. Preface The 21st century, which has been called the "Century of the Environment", is a time in which humanity must earnestly grapple with the global environmental problems that became manifest at the end of the 20th century.

Contextual Info: New High Density SMT B2B Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design – protects exposed male pins during handling and provides positive polarization to aid in blind mating applications

Contextual Info: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every

mmc cARD PCB FOOTPRINT

Abstract: CM1424 CM1424-01CP CM1424-01CS CM1424-03CP CM1424-03CS
Contextual Info: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every

D4 diode top mark

Abstract: top side marking b2 CM1424 CM1424-01CP CM1424-01CS CM1424-03CP CM1424-03CS mmc cARD PCB FOOTPRINT
Contextual Info: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every

Contextual Info: Product Number: 310-91-157-41-001000 Description: Interconnect Socket .100 Grid; Straight Socket Standard Solder Tail 0.125 Tail Single Row Through Hole Accepts .015-.025" Leads Plating Code: 91 Shell Plating: 200 " Tin/Lead(93/7) over 100 μ" Nickel