|
68418-114HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail |
|
|
|
10137924-1811LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP. |
|
|
|
68418-116HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail |
|
|
|
131-4418-11D
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
|
|
|
131-3418-11H
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP. |
|
|
