FACTORS AFFECTING THE RATE OF HEAT OF RESISTOR Search Results

koike relays

Abstract: ed27 smd diode EM 231 WIRING DIAGRAM corona discharge circuit simulation smd transistor marking xy TOSHIBA Thyristor tunnel diode GaAs QFP100 injection molding machine wire diagram position sensitive diode circuit
Contextual Info: [ 2 ] Semiconductor Reliability Contents 1. Reliability Concept . 1 1.1 Defining and Quantifying Reliability. 1 1.2 1.3 Reliability and Time. 1

IS32LT3117

Contextual Info: IS32LT3117 PRELIMINARY 60V, 350MA, 4-CHANNEL CONSTANT CURRENT REGULATOR WITH OTP GENERAL DESCRIPTION The IS32LT3117 is a 4-channel, linear regulated, constant current LED driver which can provide 4 equal currents of up to 350mA per channel to drive high brightness LEDs over an input voltage range of 5.5V to

Contextual Info: IS32LT3117 PRELIMINARY 60V, 350MA, 4-CHANNEL CONSTANT CURRENT REGULATOR WITH OTP GENERAL DESCRIPTION The IS32LT3117 is a 4-channel, linear regulated, constant current LED driver which can provide 4 equal currents of up to 350mA per channel to drive high brightness LEDs over an input voltage range of 5.5V to

QII53013-7

Contextual Info: Section III. Power Estimation and Analysis As FPGA designs grow larger and processes continue to shrink, power becomes an ever-increasing concern. When designing a printed circuit board, the power consumed by a device needs to be accurately estimated to develop an appropriate power budget, and to design the power

QII53013-10

Contextual Info: Section III. Power Estimation and Analysis As FPGA designs grow larger and processes continue to shrink, power is an everincreasing concern. When designing a PCB, the power consumed by a device must be accurately estimated to develop an appropriate power budget, and to design the

QII53013-7

Contextual Info: 10. PowerPlay Power Analysis QII53013-7.1.0 Introduction As designs grow larger and process technology continues to shrink, power becomes an increasingly important design consideration. When designing a printed circuit board PCB , the power consumed by a device

QII53013-10

Contextual Info: 12. PowerPlay Power Analysis QII53013-10.0.0 This chapter describes how to use the Altera Quartus® II PowerPlay Power Analysis tools to accurately estimate device power consumption. As designs grow larger and process technology continues to shrink, power becomes

JESD51-9

Contextual Info: PowerPlay Early Power Estimator User Guide for Cyclone III FPGAs 101 Innovation Drive San Jose, CA 95134 www.altera.com UG-01013-2.0 Software Version: Document Version: Document Date: QII v9.0 SP2 2.0 June 2009 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other

SO20-300

Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
Contextual Info: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions

F 739 DC

Abstract: AD9610 MSK739
Contextual Info: ISO-9001 CERTIFIED BY DSCC M.S.KENNEDY CORP. ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 739 315 701-6751 FEATURES: MIL-PRF-38534 QUALIFIED Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 5500 V/µS Typical

Contextual Info: ISO-9001 CERTIFIED BY DSCC M.S.KENNEDY CORP. ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 739 315 701-6751 FEATURES: MIL-PRF-38534 QUALIFIED Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 5500 V/µS Typical

CLC207

Abstract: KH207 MSK707
Contextual Info: ISO-9001 CERTIFIED BY DSCC M.S.KENNEDY CORP. ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 707 315 701-6751 MIL-PRF-38534 CERTIFIED FEATURES: Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 4500 V/µS Typical

MSK739

Abstract: F 739 DC AD9610
Contextual Info: MIL-PRF-38534 CERTIFIED M.S.KENNEDY CORP. ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 739 315 701-6751 FEATURES: Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 5500 V/µS Typical

Contextual Info: MIL-PRF-38534 CERTIFIED M.S.KENNEDY CORP. ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 707 315 701-6751 FEATURES: Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 4500 V/µS Typical

Contextual Info: MIL-PRF-38534 CERTIFIED M.S.KENNEDY CORP. ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 739 315 701-6751 FEATURES: Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 5500 V/µS Typical

Position Estimation

Contextual Info: White Paper FPGA Power Management and Modeling Techniques Introduction As designs get larger and add more system functions implemented on FPGAs, and as the advanced silicon process technology moves into smaller geometries, power consumption is increasingly a concern for today’s FPGAs. When

Position Estimation

Abstract: 8B10B
Contextual Info: PowerPlay Early Power Estimator User Guide For Arria GX FPGAs 101 Innovation Drive San Jose, CA 95134 www.altera.com Document Version: Document Date: 1.1 May 2008 Copyright 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and

resistor types with different ppm

Abstract: 63171 EN-140401-801 S102C 10k vishay EN140401-801
Contextual Info: VISHAY FOIL RESISTORS Resistive Products Technical Note Prediction of Drift in Foil Resistors By Joseph Szwarc, Roy Golombick, and Yuval Hernik, 2008 ABSTRACT The reliable functioning of electronic devices which incorporate high precision resistors requires maintaining the

Position Estimation

Abstract: 8B10B lvds fifo
Contextual Info: PowerPlay Early Power Estimator User Guide 101 Innovation Drive San Jose, CA 95134 www.altera.com Software Version: Document Version: Document Date: 10.0 2.0 July 2010 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other

8B10B

Contextual Info: PowerPlay Early Power Estimator User Guide PowerPlay Early Power Estimator User Guide 101 Innovation Drive San Jose, CA 95134 www.altera.com UG-01070-3.0 Document last updated for Altera Complete Design Suite version: Document publication date: 10.1 December 2010

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE INTRODUCTION Normal operation of Integrated Circuits will cause electrical power, P, to be converted into heat by the die

3335

Abstract: MC100EL91 MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 E1651
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE INTRODUCTION Normal operation of Integrated Circuits will cause electrical power, P, to be converted into heat by the die