Untitled
Abstract: No abstract text available
Text: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60Ball FBGA Revision 1.2 November, 2004 Revision 1.2 November, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (September, 2003)
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DDR400
512Mb
60Ball
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K4H510438B-ZC
Abstract: No abstract text available
Text: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant) Revision 1.1 March, 2004 Revision 1.1 March, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History
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DDR400
512Mb
200MHz
K4H510438B-ZC
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IEC60730
Abstract: CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM
Text: ARM9 Microcontroller TMPA900CMXBG Memory Features ADC 10-bit Ch. 16-bit Timer RTC / WDT 32 FBGA 289 √ √ H/D 2 3 2 1 8 6 √ 91 1.7~3.6 TMPA901CMXBG 2 ARM926EJ-S 200* - 32 FBGA 177 √ √ H/D 1 2 1 1 4 6 √ 43 1.7~3.6 ARM926EJ-S 200* - 56 FBGA 361 √
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TMPA900CMXBG
10-bit
16-bit
TMPA901CMXBG
ARM926EJ-S
TMPA911CRAXBG
TMPA912CMAXBG
IEC60730
CMOS Sensor to H.264
STK 361
ARM926EJ-S
lcd cross reference
VIA ARM926EJ-S
SD-Card layout
TMPA900CMXBG
toshiba lcd controller board
TMPA912CM
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Signetics
Abstract: 19X19 19X19MM
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This
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19x19MM
168hr,
192hr,
C/-55
C/100%
15PSIG,
168hrs
Signetics
19X19
19X19MM
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MTFC4G
Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)
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MTFC16GKQDI,
MTFC32GKQDH
153-ball
169-ball
41-compliant
84-A441)
09005aef838eabba
j534q567r
MTFC4G
MTFC16G
micron emmc
MTFC32G
micron eMMC 100 ball BGA
MTfc8g
emmc csd
MTFC4
micron emmc 4.4
MTFC16GKQDI
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m312l
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
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512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
m312l
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Untitled
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 184pin Registered Module based on 512Mb B-die x4, x8 with 1,125mil/1,200mil Height 60 FBGA with Pb-Free (RoHS compliant) Revision 1.2 Nov. 2004 Revision 1.2 November. 2004
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512MB,
DDR400
184pin
512Mb
125mil/1
200mil
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M312L2920BG0-CCC
Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
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512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
M312L2920BG0-CCC
M312L5720BG0-CCC
M312L6523BG0-CCC
M312L2920BG0
M312L2923BG0-CCC
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm
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168-ball
EDB2432BCPE
800Mbps
M01E1007
E1881E20
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a
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184pin
512Mb
184-pin
128Mb
HYMD512G726BF
157max
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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184pin
512Mb
184-pin
128Mb
HYMD512G726CFP4N
157max
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hynix module suffix
Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a
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184pin
512Mb
184-pin
157max
hynix module suffix
DDR333
DDR400
DDR400B
HYMD512G726BF4N
DQSO
d431
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Untitled
Abstract: No abstract text available
Text: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm
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512Mb:
MT42L32M16D1
09005aef8467caf2
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Untitled
Abstract: No abstract text available
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
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EDB4432BAPA
Abstract: No abstract text available
Text: DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB4432BAPA Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm
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168-ball
EDB4432BAPA
1066Mbps
M01E1007
E1775E40
EDB4432BAPA
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NAND sample code for stm32f2xx
Abstract: DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ FBGA FBGA Core: ARM 32-bit Cortex -M3 CPU 120 MHz
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
NAND sample code for stm32f2xx
DCMI timing specification
STM32F20xxx programming manual
stm32f205rx
STM32F20xxx reference manual
STM32F207ZE programming manual
stm32f205
STM32F20x
STM32F20xxx
STM32F207ZG
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hynix module suffix
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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184pin
512Mb
184-pin
DDR400
DDR333
HYMD525G726CFP4-D43/J
hynix module suffix
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a
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184pin
256Mb
184-pin
128Mb
HYMD212G726DF
157max
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Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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184pin
512Mb
184-pin
HYMD525G726CFP4-D43/J
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dual fet q51
Abstract: DDR333 DDR400 DDR400B HYMD512G726CFP4N-D43 hynix module suffix dc-dc 8030
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
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184pin
512Mb
184-pin
HYMD525G726CFP4-D43/J
dual fet q51
DDR333
DDR400
DDR400B
HYMD512G726CFP4N-D43
hynix module suffix
dc-dc 8030
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sdram dimm layout hynix
Abstract: 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23
Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a
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184pin
256Mb
184-pin
157max
sdram dimm layout hynix
6050
DDR333
DDR400
DDR400B
256mb ddr333 200 pin
hynix module suffix
DM U23
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4432BAPC Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm
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216-ball
EDB4432BAPC
1066Mbps
M01E1007
E1891E10
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Untitled
Abstract: No abstract text available
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ ■ ■ ■ ■ ■ ■ ■ Core: ARM 32-bit Cortex -M3 CPU with
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
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Untitled
Abstract: No abstract text available
Text: W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS Data rate = 667, 533, 400 Mb/s 62% Space savings vs. FBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm 42% I/O reduction vs FBGA
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W3H32M64EA-XSBX
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