Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    FBGA 63 Search Results

    FBGA 63 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    SF Impression Pixel

    FBGA 63 Price and Stock

    Silicon Laboratories Inc EFM32LG290F256G-F-BGA112

    ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EFM32LG290F256G-F-BGA112 291
    • 1 $10.89
    • 10 $10.01
    • 100 $8.46
    • 1000 $6.9
    • 10000 $6.9
    		Buy Now

    Silicon Laboratories Inc EFM32LG895F256G-F-BGA120

    ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EFM32LG895F256G-F-BGA120
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $7.05
    		Get Quote

    Silicon Laboratories Inc EFM32LG890F256G-F-BGA112

    ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EFM32LG890F256G-F-BGA112
    • 1 -
    • 10 -
    • 100 -
    • 1000 $7.23
    • 10000 $7.23
    		Get Quote

    Silicon Laboratories Inc EFM32LG290F256G-F-BGA112R

    ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EFM32LG290F256G-F-BGA112R
    • 1 -
    • 10 -
    • 100 -
    • 1000 $6.9
    • 10000 $6.9
    		Get Quote

    Silicon Laboratories Inc EFM32LG990F256G-F-BGA112

    ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EFM32LG990F256G-F-BGA112
    • 1 -
    • 10 -
    • 100 -
    • 1000 $7.69
    • 10000 $7.69
    		Get Quote
    Find more FBGA 63 price and stock on Findchips.com

    FBGA 63 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    vr7pu

    Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F
    Text: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module


    Original     		PDF 72bit 128MX72 128Mx8 vr7pu VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F

    SODIMM DDR3 Mechanical Dimensions

    Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin
    Text: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module


    Original     		PDF 72bit 128MX72 128Mx8 SODIMM DDR3 Mechanical Dimensions VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    MT41K256M32

    Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
    Text: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) 09005aef84ad0652 MT41K256M32 MT41K256M3 8Gb DDR3 SDRAM twindie

    FBGA 63

    Abstract: JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS
    Text: NEC 119.6 8.15 9.20 A' 5.30 8.80 5.30 135° C MAX. FBGA5 x 5A A 299.2 315.0 322.6 7.90 5.30 Section A – A' (5.62) (5.79) 5.00 7.62 135.9 PPE 14 × 35=490 TRAY CONTAINER Applied Package Tray FBGA 5×5A 61-pin Plastic FBGA (5×5) Material Carbon PPE 61-pin Tape FBGA (5×5)


    Original     		PDF 61-pin 63-pin 97-pin SSD-A-H7519-2 FBGA 63 JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS

    224-PIN

    Abstract: 224 J
    Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 224 PIN PLASTIC BGA-224P-M03 224-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 18 Sealing method Plastic mold BGA-224P-M03 224-pin plastic FBGA (BGA-224P-M03) 16.00±0.10(.630±.004)SQ


    Original     		PDF BGA-224P-M03 224-pin BGA-224P-M03) B224003S-1C-1 224 J

    MTFC4G

    Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
    Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)


    Original     		PDF MTFC16GKQDI, MTFC32GKQDH 153-ball 169-ball 41-compliant 84-A441) 09005aef838eabba j534q567r MTFC4G MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI

    HYMP512S64CP8-Y5

    Abstract: HYMP564S64CP6-Y5 H5TQ1G63BFR-H9C h5ps2g83afr-s6c H5PS1G63EFR-Y5C H5TQ1G83BFR-H9C HYMP564S64CP6-C4 HY5PS121621Cfp-y5 H5PS1G63EFR-S5C HY5PS12821CFP-Y5
    Text: Q3’2009 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43AFP-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43BFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C


    Original     		PDF 256Mx4 H5TQ1G43AFP-H9C 78ball) H5TQ1G43BFR-H9C H5TQ1G43TFR-H9C H5TQ1G43AFP-G7C H5TQ1G43BFR-G7C HYMP512S64CP8-Y5 HYMP564S64CP6-Y5 H5TQ1G63BFR-H9C h5ps2g83afr-s6c H5PS1G63EFR-Y5C H5TQ1G83BFR-H9C HYMP564S64CP6-C4 HY5PS121621Cfp-y5 H5PS1G63EFR-S5C HY5PS12821CFP-Y5

    m312l

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM


    Original     		PDF 512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil m312l

    Diode 224

    Abstract: fujitsu BGA-224P 224-PIN
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 224 PIN PLASTIC To Top / Package Lineup / Package Index BGA-224P-M01 224-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 18 Sealing method Plastic mold BGA-224P-M01 224-pin plastic FBGA (BGA-224P-M01)


    Original     		PDF BGA-224P-M01 224-pin BGA-224P-M01) B224001S-1C-1 Diode 224 fujitsu BGA-224P

    H5TQ2G63BFR-H9C

    Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
    Text: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9


    Original     		PDF 256Mx4 H5TQ1G43BFR-H9C 78ball) H5TQ1G43TFR-H9C H5TQ1G43BFR-G7C H5TQ1G43TFR-G7C H5TQ1G83BFR-H9C H5TQ2G63BFR-H9C H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR

    Untitled

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 184pin Registered Module based on 512Mb B-die x4, x8 with 1,125mil/1,200mil Height 60 FBGA with Pb-Free (RoHS compliant) Revision 1.2 Nov. 2004 Revision 1.2 November. 2004


    Original     		PDF 512MB, DDR400 184pin 512Mb 125mil/1 200mil

    M312L2920BG0-CCC

    Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM


    Original     		PDF 512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil M312L2920BG0-CCC M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 M312L2923BG0-CCC

    MT41K512M16

    Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
    Text: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)


    Original     		PDF MT41K512M16 MT41K256M16 MT41K512M16. 96-ballw 09005aef84ccb467 MT41K512M16 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 128Mb HYMD512G726CFP4N 157max

    hynix module suffix

    Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 157max hynix module suffix DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431

    Untitled

    Abstract: No abstract text available
    Text: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm


    Original     		PDF 512Mb: MT42L32M16D1 09005aef8467caf2

    Untitled

    Abstract: No abstract text available
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz


    Original     		PDF STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128

    DDR266

    Abstract: DDR266B DDR333 DDR400 DDR400B HYMD512M646D
    Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb D ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb D ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb D ver. based unbuffered


    Original     		PDF 200pin 512Mb 200-pin DDR400, DDR333 HYMD512M646D DDR266 DDR266B DDR400 DDR400B

    NAND sample code for stm32f2xx

    Abstract: DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ FBGA FBGA Core: ARM 32-bit Cortex -M3 CPU 120 MHz


    Original     		PDF STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128 NAND sample code for stm32f2xx DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG

    hynix module suffix

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin DDR400 DDR333 HYMD525G726CFP4-D43/J hynix module suffix

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a


    Original     		PDF 184pin 256Mb 184-pin 128Mb HYMD212G726DF 157max

    FBGA DDR3 x32

    Abstract: MT41K256M32 MT41K256M16 MT41K256M3 MICRON fBGA package code
    Text: Preliminary‡ 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) SAC305 09005aef84ad0652 FBGA DDR3 x32 MT41K256M32 MT41K256M3 MICRON fBGA package code

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin HYMD525G726CFP4-D43/J