FBGA PCB FOOTPRINT Search Results

taiyo PSR4000

Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

fBGA package tray 12 x 19

Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

bga rework

Abstract: 39K200 39K100 39K165 39K30 39K50 WT2-56
Contextual Info: Family, Package, and Density Migration in Delta39K and Quantum38K™ CPLDs Introduction I. Family Migration The Delta39K™ and Quantum38K™ family of Complex Programmable Logic Devices CPLDs combine dense logic, embedded memory, and configurable I/O standards. Further design flexibility is added by the easy migration options available

MCP market

Contextual Info: Multi Chip Package MCP Flash Memory and SRAM Solutions Small footprint consistent packaging Succeed with Flash technology leadership from AMD Succeed with AMD’s industry-leading family of multi-chip package (MCP) Flash and SRAM memory solutions. AMD’s MCP solutions feature high-performance AMD Flash and the highest quality SRAM, in a single convenient

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

BCM4750

Abstract: Broadcom bcm4750 broadcom sensitivity GPS broadcom Broadcom 4750 broadcom gps broadcom sensitivity BCM4750 Block diagram on gps receiver GPS receiver bcm4750
Contextual Info: BCM4750 Brief SINGLE-CHIP AGPS SOLUTION FEATURES SUMMARY OF BENEFITS • Single-chip solution—AGPS baseband and CMOS RF front- • Advanced low-power RFCMOS technology and low-power end integrated on a single-die—minimizing board space footprint <35 mm2 PCB area for a complete AGPS solution

BCM84752

Abstract: BCM84846 BROADCOM 100-pin FBGA BCM8475 BCM84846A0KFSBG
Contextual Info: Broadcom B CM8 48 46 Dua l 10G BA SE-T Trans ce i ve r DUAL-PORT 10GBASE-T TRANSCEIVER Overview Highlights • The BCM84846 offers low power in this second-generation 40 nm 10GBASE-T device. • The small 21 mm package size reduces the footprint for 10GBASE-T, ideal for servers and

ADA17

Contextual Info: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold

Contextual Info: Migration from 16 Megabit to 64 Megabit Flash Memory Devices Application Note This document will assist board-designers in creating a seamless migration path from AMD 16 Mb or 32 Mb low voltage LV flash and Simultaneous Read/Write (DL) devices to higher densities.

understanding test option

Abstract: TN-00-20
Contextual Info: TN-00-20: Understanding the Value of SI Testing Introduction Technical Note Understanding the Value of Signal Integrity Testing Introduction Historically, design engineers have used signal integrity SI testing as a key part of the design and development of new systems and for sustaining qualifications. While SI

OF4337

Abstract: 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD
Contextual Info: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.

BCM4750

Abstract: Broadcom bcm4750 GPS chip BCM4750 Broadcom 4750 Broadcom broadcom gps Broadcom RECEIVER broadcom sensitivity AGPS receiver spi GPS broadcom
Contextual Info: BCM4750 Brief SINGLE-CHIP AGPS SOLUTION FEATURES SUMMARY OF BENEFITS • Single-chip solution—AGPS baseband and CMOS RF front- • Advanced low-power RFCMOS technology and low-power end integrated on a single-die—minimizing board space footprint <35 sq mm 2 PCB area for a complete AGPS

NET2272REV1A-LF

Abstract: pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s
Contextual Info: Issue No. 29 PEX 8114 Key Features Application: ♦ Transparent and NonTransparent Modes ♦ Forward and Reverse Modes ♦ Low Power Consumption 2W ♦ Small Footprint 17 x 17 mm BGA Package ♦ Lead Free Available ♦ Supports PCI and PCI-X 33MHz thru 133MHz

Contextual Info: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.

NATIONAL RX F2

Contextual Info: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data

Contextual Info: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data

Contextual Info: DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—65 MHz General Description The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec

90CF386

Contextual Info: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/

Contextual Info: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/

S71WS256PC0HH3

Abstract: S71WS512PD0HH3 SWM032D spansion date code marking TRAY FBGA 11X13 S71WS256PD0HH3 S71WS256PC0HH3YR SWM064D133S1R S71WS256PC0HF3
Contextual Info: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

DS90C365MTD

Abstract: DS90C385
Contextual Info: DS90C385/DS90C365 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link-85 MHz, +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz General Description The DS90C385 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.

sx08a

Abstract: ATQ100 SX32a RTSX16
Contextual Info: A p p l i c a t i on N o t e SX to SX-A Design Migration In t ro d u c t i o n • Configurable Output State During Power-Up: All outputs can be programmed to either weak resistor pull-up or weak resistor pull-down for output tri-state. Actel’s newest line of antifuse FPGAs, SX-A, is fabricated