FEP 07 Search Results

ASTM-B-355

Abstract: ASTM B355 103-051 103-026
Contextual Info: Non-Metallic Braid Selection Guide Material Type AmberStrand Thermoplastic PEEK Monofil FEP Teflon (Yarn) Halar (Monofil) Teflon FEP (Monofil) Nomex (Yarn) Glenair P/N 103-026 103-027 102-051 102-061 102-071 102-073 102-023 102-060 103-013 102-001 102-002

Contextual Info: FEP F,B 16AT thru FEP(F,B)16JT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability

Contextual Info: FEP F,B 6AT thru FEP(F,B)6DT Vishay General Semiconductor Dual Common-Cathode Ultrafast Rectifier TO-220AB FEATURES • Glass passivated chip junction ITO-220AB • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current 2

Contextual Info: FEP F,B 6AT thru FEP(F,B)6DT Vishay General Semiconductor Dual Common-Cathode Ultrafast Rectifier TO-220AB FEATURES • Glass passivated chip junction ITO-220AB • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current 2

Contextual Info: No OF POS x .050[1.27] + .021[0.53] REF DO NOT SCALE FROM THIS PRINT 01 .200 5.08 REF SFSSX-XX-XXX-XX-XX.XX-XX-XXX FEP CABLE OPTION -T: FEP INSULATION LEAVE BLANK FOR STANDARD PVC INSULATION No OF POSITIONS .070 1.78 REF .095 2.41 REF .080 2.03 REF -02 THRU -50

Contextual Info: FEP F,B 16AT thru FEP(F,B)16JT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability

16JT

Abstract: FEP16xT JESD22-B102 J-STD-002 16dt
Contextual Info: FEP F,B 16AT thru FEP(F,B)16JT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability

16BT

Contextual Info: FEP F,B 16AT thru FEP(F,B)16JT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability

JESD22-B102

Abstract: J-STD-002
Contextual Info: FEP F,B 16AT thru FEP(F,B)16JT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability

16JT

Abstract: FEP16GT FEP16HT
Contextual Info: FEP F,B 16AT thru FEP(F,B)16JT Vishay General Semiconductor Dual Common-Cathode Ultrafast Plastic Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability

Contextual Info: REVISION R TFSDX-XX-XXX-XX-XX.XX-XX-XXX FEP CABLE OPTION -T: FEP LEAVE BLANK FOR STANDARD PVC INSULATION (No OF POS x .050[1.27]) No OF POSITIONS + .120[2.54] REF -02 THRU -50 (PER ROW) -05, -07, -10, -15, -20, -25, -30, -35, -40, -45 & -50 N (SEE TABLE 2)

Contextual Info: REVISION Y NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. BURR ALLOWANCE: .003[.08] MAX. FEP CABLE OPTION 3. PARTS TO BE MOLDED TO POSITION. -T: FEP 4. MINIMUM PIN PULLOUT FORCE: 5.000LB[22.24N]. 5. CONTACT MUST BE INSERTED UNTIL RETENTION FEATURE LOCKS INTO PLACE.

Contextual Info: REVISION T SFSDX-XX-XXX-XX-XX.XX-XX-XXX NoOF POSx.050[1.27] + .015[0.38] REF FEP CABLE OPTION -T: FEP (LEAVE BLANK FOR STANDARD PVC INSULATION) No OF POSITIONS -05, -07,-10,-15, -20, -25, -30 -35 -40, -45, & -50 (PER ROW) AVAILABLE AS STANDARD -02 THRU -50 AVAILABLE AS ASO

DIODE 6AT

Abstract: JESD22-B102 J-STD-002 FEP6BT
Contextual Info: FEP F,B 6AT thru FEP(F,B)6DT Vishay General Semiconductor Dual Common-Cathode Ultrafast Rectifier TO-220AB FEATURES • Glass passivated chip junction ITO-220AB • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current 2

Contextual Info: FEP F,B 6AT thru FEP(F,B)6DT Vishay General Semiconductor Dual Common-Cathode Ultrafast Rectifier TO-220AB FEATURES • Glass passivated chip junction ITO-220AB • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current 2

Contextual Info: FEP F,B 6AT thru FEP(F,B)6DT Vishay General Semiconductor Dual Common-Cathode Ultrafast Rectifier TO-220AB FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability

Contextual Info: REVISION M TFSDX-XX-XXX-XX-XX.XX-XX-XXX .110 2.79 REF FEP CABLE OPTION -T: FEP LEAVE BLANK FOR STANDARD PVC INSULATION No OF POSITIONS -02 THRU -030 (PER ROW) -05, -07, -10, -15, -20, -25 & -30 AVAILABLE AS STANDARD (ALL OTHER SIZES AVAILABLE AS ASO) (No OF POS x .050[1.27])

Contextual Info: REVISION X NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. BURR ALLOWANCE: .003[.08] MAX. FEP CABLE OPTION 3. PARTS TO BE MOLDED TO POSITION. 4. MINIMUM PIN PULLOUT FORCE: 5.000LB[22.24N]. -T: FEP 5. CONTACT MUST BE INSERTED UNTIL RETENTION FEATURE LOCKS INTO PLACE.

Contextual Info: REVISION S TFSDX-XX-XXX-XX-XX.XX-XX-XXX FEP CABLE OPTION -T: FEP LEAVE BLANK FOR STANDARD PVC INSULATION (No OF POS x .050[1.27]) No OF POSITIONS + .120[2.54] REF -02 THRU -50 (PER ROW) -02, -04, -05, -07, -10, -15, -20, -25, -30, -35, N (SEE TABLE 2) -40, -45 & -50 AVAILABLE AS STANDARD

Contextual Info: REVISION AE NOTES: MMSDX-XX-XXX-X-XX.XX-X-X-XXX 1. C REPRESENTS A CRITICAL DIMENSION. FEP CABLE OPTION 2. BURR ALLOWANCE: .003[.08] MAX. -T: FEP INSULATION OPTION 3. PARTS TO BE MOLDED TO POSITION. LEAVE BLANK FOR STANDARD 4. MINIMUM PIN PULLOUT FORCE: 4.000LB[17.79N]

Contextual Info: REVISION AO DO NOT SCALE FROM THIS PRINT MMSDX-XX-XXX-X-XX.XX-X-X-XXX NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. FEP CABLE OPTION 2. BURR ALLOWANCE: .003[.08] MAX. 3. PARTS TO BE MOLDED TO POSITION. -T: FEP INSULATION 4. MINIMUM PIN PULLOUT FORCE: 4.000LB[17.79N]

Contextual Info: REVISION AH DO NOT SCALE FROM THIS PRINT NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. BURR ALLOWANCE: .003[.08] MAX. 3. PARTS TO BE MOLDED TO POSITION. FEP CABLE OPTION 4. MINIMUM PIN PULLOUT FORCE: 5.000LB[22.24N]. -T: FEP 5. CONTACT MUST BE INSERTED UNTIL RETENTION FEATURE LOCKS INTO PLACE.

Contextual Info: REVISION S NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. BURR ALLOWANCE: .003[.08] MAX. FEP CABLE OPTION 3. PARTS TO BE MOLDED TO POSITION. 4. MINIMUM PIN PULLOUT FORCE: 5.000LB[22.24N]. *-T: FEP 5. CONTACT MUST BE INSERTED UNTIL RETENTION FEATURE LOCKS INTO PLACE. LEAVE BLANK FOR STANDARD

Contextual Info: REVISION AE NOTES: MMSDX-XX-XXX-X-XX.XX-X-X-XXX 1. C REPRESENTS A CRITICAL DIMENSION. FEP CABLE OPTION 2. BURR ALLOWANCE: .003[.08] MAX. -T: FEP INSULATION OPTION 3. PARTS TO BE MOLDED TO POSITION. LEAVE BLANK FOR STANDARD 4. MINIMUM PIN PULLOUT FORCE: 4.000LB[17.79N]