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    FF1517 Price and Stock

    AMD XC2VP70-6FF1517C

    IC FPGA 964 I/O 1517FCBGA
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    AMD XC2VP70-5FF1517I

    IC FPGA 964 I/O 1517FCBGA
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    AMD XC2VP70-5FF1517C

    IC FPGA 964 I/O 1517FCBGA
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    AMD XC2VP50-5FF1517I

    IC FPGA 852 I/O 1517FCBGA
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    AMD XC2VP70-6FF1517I

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    FF1517 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    XILINX

    Abstract: PK050
    Text: R Flip Chip BGA FF1517 Package PK050 (v1.0) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


    Original     		PDF FF1517) PK050 XILINX PK050

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    CLK180

    Abstract: MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver
    Text: Application Note: Virtex-II Series R 644-MHz SDR LVDS Transmitter/Receiver Author: Ed McGettigan XAPP622 v1.2 July 2, 2002 Summary This application note describes single data rate (SDR) transmitter and receiver interfaces operating at up to 644 MHz, using 17 Low-Voltage Differential Signaling (LVDS) pairs (one


    Original     		PDF 644-MHz XAPP622 XC2V3000-FF1152 CLK180 MULT18X18 XAPP622 XC2V3000-FF1152 XC2V3000FF1152 sdr receiver

    Untitled

    Abstract: No abstract text available
    Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit FF1148) FF1517) FF1696) DS083-4

    EP3SL340F1517

    Abstract: altera cyclone 3 handbook texas instruments HC335FF1152 HC325Ff DDR3 jedec diode handbook fbga Substrate design guidelines hc335 texas instruments handbook
    Text: HardCopy III Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.2 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other


    Original     		PDF

    EP4SGX180KF40

    Abstract: f1517 EP4SGX180DF29 EP4SGX290KF40 228K EP4SGX230KF40 EP4SGX360KF40 EP4SGX290FF35 HC4GX25LF1152N EP4SGX180FF35
    Text: HardCopy IV GX ASIC Product Table v0.123 HardCopy Base Die HardCopy IV GX ASIC Package Body Size 2 LAF780 (29 mm) Generic Part Number HC4GX15LAF780N HC4GX15 LF780 (29 mm) LF780 (29 mm) LF1152 (35 mm) HC4GX15LF780N HC4GX25LF780N HC4GX25LF1152N HC4GX25 FF1152 (35 mm)


    Original     		PDF 18x18 M144Ks EP4SGX70DF29 LAF780 HC4GX15LAF780N EP4SGX110DF29 LF780 HC4GX15LF780N HC4GX25LF780N EP4SGX180KF40 f1517 EP4SGX180DF29 EP4SGX290KF40 228K EP4SGX230KF40 EP4SGX360KF40 EP4SGX290FF35 HC4GX25LF1152N EP4SGX180FF35

    EP3SE110F1152

    Abstract: f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517
    Text: HardCopy III ASIC Product Table v0.995 HardCopy Base Die HardCopy III ASIC Package Body Size 2 WF484 (23 mm) FF484 (23 mm) HC325 WF780 (29 mm) FF780 (29 mm) Generic Part Number HC325WF484N HC325FF484N HC325WF780N HC325FF780N Stratix III FPGA Prototype 107K


    Original     		PDF 18x18 EP3SE110--F7807 EP3SL200--H7807 EP3SL340--H11527 GEN-1002-00 EP3SE110F1152 f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517

    XC2V1000 Pin-out

    Abstract: Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V1500 XC2V250 XC2V40 XC2V500
    Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031-1 v1.7 October 2, 2001 Advance Product Specification Summary of Virtex -II Features • Industry First Platform FPGA Solution • IP-Immersion Architecture - Densities from 40K to 8M system gates


    Original     		PDF DS031-1 18-Kbit 18-bige. XC2V1500 FG676 FF1152, FF1517, BF957 DS031-3, DS031-1, XC2V1000 Pin-out Virtex-II MAKING A10 BGA matrix m21 IEEE1532 XC2V1000 XC2V250 XC2V40 XC2V500

    RX-2C G

    Abstract: tx2c transmitter TX 2E 1240 picosecond tx-2b equivalent Gigabyte 848 TX-2B RX-2B ROSENBERGER RX_2B XENPAK70
    Text: Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide UG076 v4.1 November 2, 2008 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG076 8B/10B RX-2C G tx2c transmitter TX 2E 1240 picosecond tx-2b equivalent Gigabyte 848 TX-2B RX-2B ROSENBERGER RX_2B XENPAK70

    VIRTEX-4

    Abstract: Virtex-4 datasheet Virtex-4 SF363 FFG676 DS112 DSP48 sf363 PPC405 XC4VLX100 XC4VLX15
    Text: ` R Virtex-4 Family Overview DS112 v3.0 September 28, 2007 Product Specification General Description Combining Advanced Silicon Modular Block (ASMBL ) architecture with a wide variety of flexible features, the Virtex™-4 Family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC


    Original     		PDF DS112 DS302) XC4VFX40 FF676 XC4VLX40, XC4VLX60, XC4VSX25, XC4VSX35, VIRTEX-4 Virtex-4 datasheet Virtex-4 SF363 FFG676 DS112 DSP48 sf363 PPC405 XC4VLX100 XC4VLX15

    AM3 pinout diagram

    Abstract: SX35 SX35 virtex XC4VLX25-SF363 AM1 marking FF1148 UG075 The Virtex-4 LC system board K155 AH512
    Text: Virtex-4 FPGA Packaging and Pinout Specification UG075 v3.3 September 19, 2008 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG075 10CESnL 10CESnR AM3 pinout diagram SX35 SX35 virtex XC4VLX25-SF363 AM1 marking FF1148 UG075 The Virtex-4 LC system board K155 AH512

    datasheet transistor said horizontal tt 2222

    Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out
    Text: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG002 datasheet transistor said horizontal tt 2222 interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out

    Untitled

    Abstract: No abstract text available
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.3 November 20, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded


    Original     		PDF DS083-1 18-bit DS083-4

    12x12 bga thermal resistance

    Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
    Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations


    Original     		PDF UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


    Original     		PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package

    4x4 unsigned multiplier VERILOG coding

    Abstract: vhdl code for lvds driver 32x32 multiplier verilog code MULT18X18 12v relay interface with cpld in vhdl verilog/verilog code for lvds driver 80C31 instruction set vhdl code for 18x18 unSIGNED MULTIPLIER vhdl pulse interval encoder book national semiconductor
    Text: R Chapter 2 Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • • • • • • • • Rocket I/O Transceiver Processor Block Global Clock Networks Digital Clock Managers DCMs Block SelectRAM Memory


    Original     		PDF UG012 4x4 unsigned multiplier VERILOG coding vhdl code for lvds driver 32x32 multiplier verilog code MULT18X18 12v relay interface with cpld in vhdl verilog/verilog code for lvds driver 80C31 instruction set vhdl code for 18x18 unSIGNED MULTIPLIER vhdl pulse interval encoder book national semiconductor

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    BG5751

    Abstract: No abstract text available
    Text: R Using Single-Ended SelectI/O Resources Summary The Virtex-II FPGA series includes a highly configurable, high-performance single-ended SelectI/O resource that supports a wide variety of I/O standards. The SelectI/O resource includes a robust set of features, including programmable control of output drive strength,


    Original     		PDF UG002 BG5751

    wireless encrypt

    Abstract: BF957
    Text: Virtex-II 1.5V Field-Programmable Gate Arrays R DS031 v1.1 December 6, 2000 Advance Product Specification Summary of Virtex -II Features • • Industry First Platform FPGA solution IP-Immersion architecture - Densities from 40K to 10M system gates


    Original     		PDF DS031 18-Kbit wireless encrypt BF957

    QF32

    Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
    Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)


    Original     		PDF TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176

    XC6VLX130T

    Abstract: XC6VLX195T XC5VL110T XC5VL155T PCI33 XC6VLX240T XC5vfx70t XC5VL330T XC4VSX35 ff1156
    Text: XI LI NX VI RTEX -6 FAM I LY FPGAS Virtex-6 LXT FPGAs Virtex-6 SXT FPGAs Optimized for High-Performance Logic and DSP with Low-Power Serial Connectivity 1.0 Volt, 0.9 Volt Part Number EasyPath FPGA Cost Reduction Solutions(1) Logic Resources XC6VLX760T


    Original     		PDF XC6VLX75T XC6VLX130T XC6VLX195T XC6VLX240T XC6VLX365T XC6VLX550T XC6VLX760T XC6VSX315T XC6VSX475T XC6VHX250T XC6VLX130T XC6VLX195T XC5VL110T XC5VL155T PCI33 XC6VLX240T XC5vfx70t XC5VL330T XC4VSX35 ff1156

    AB38R

    Abstract: tag l9 225 400 XC2VP20 XC2VP50
    Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on


    Original     		PDF DS083-1 18-bit and255-7778 DS083-4 AB38R tag l9 225 400 XC2VP20 XC2VP50