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    FFG676C Search Results

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    FFG676C Price and Stock

    AMD XC7K160T-1FFG676C

    IC FPGA 400 I/O 676FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC7K160T-1FFG676C Tray 108 1
    • 1 $501.25
    • 10 $501.25
    • 100 $501.25
    • 1000 $501.25
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    Avnet Americas XC7K160T-1FFG676C Tray 19 Weeks 1
    • 1 $507.265
    • 10 $507.265
    • 100 $507.265
    • 1000 $507.265
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    Mouser Electronics XC7K160T-1FFG676C 3
    • 1 $501.25
    • 10 $501.25
    • 100 $501.25
    • 1000 $501.25
    • 10000 $501.25
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    Newark XC7K160T-1FFG676C Bulk 20 1
    • 1 $501.25
    • 10 $501.25
    • 100 $501.25
    • 1000 $501.25
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    Avnet Asia XC7K160T-1FFG676C 19 Weeks 1
    • 1 $572.8571
    • 10 $495.06174
    • 100 $471.7647
    • 1000 $471.7647
    • 10000 $471.7647
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    AMD XC7K160T-2FFG676C

    IC FPGA 400 I/O 676FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC7K160T-2FFG676C Tray 79 1
    • 1 $626.6
    • 10 $626.6
    • 100 $626.6
    • 1000 $626.6
    • 10000 $626.6
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    Avnet Americas XC7K160T-2FFG676C Tray 19 Weeks 1
    • 1 $609.73
    • 10 $609.73
    • 100 $609.73
    • 1000 $609.73
    • 10000 $609.73
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    Mouser Electronics XC7K160T-2FFG676C
    • 1 $626.54
    • 10 $626.54
    • 100 $626.54
    • 1000 $626.54
    • 10000 $626.54
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    Newark XC7K160T-2FFG676C Bulk 75 1
    • 1 $626.54
    • 10 $626.54
    • 100 $626.54
    • 1000 $626.54
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    Avnet Asia XC7K160T-2FFG676C 19 Weeks 1
    • 1 $634.2105
    • 10 $595.0617
    • 100 $567.05884
    • 1000 $567.05884
    • 10000 $567.05884
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    AMD XC7Z030-1FFG676C

    IC SOC CORTEX-A9 667MHZ 676FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC7Z030-1FFG676C Tray 61 1
    • 1 $390
    • 10 $390
    • 100 $390
    • 1000 $390
    • 10000 $390
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    Mouser Electronics XC7Z030-1FFG676C 4
    • 1 $389.99
    • 10 $389.99
    • 100 $389.99
    • 1000 $389.99
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    Newark XC7Z030-1FFG676C Bulk 26 1
    • 1 $389.99
    • 10 $389.99
    • 100 $389.99
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    Win Source Electronics XC7Z030-1FFG676C 2,200
    • 1 $76.522
    • 10 $62.174
    • 100 $62.174
    • 1000 $62.174
    • 10000 $62.174
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    AMD XC7Z045-1FFG676C

    IC SOC CORTEX-A9 667MHZ 676FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC7Z045-1FFG676C Tray 47 1
    • 1 $1800
    • 10 $1800
    • 100 $1800
    • 1000 $1800
    • 10000 $1800
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    Mouser Electronics XC7Z045-1FFG676C 9
    • 1 $1871.83
    • 10 $1871.83
    • 100 $1871.83
    • 1000 $1871.83
    • 10000 $1871.83
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    Newark XC7Z045-1FFG676C Bulk 1
    • 1 $1800
    • 10 $1800
    • 100 $1800
    • 1000 $1800
    • 10000 $1800
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    AMD XC7K325T-1FFG676C

    IC FPGA 400 I/O 676FCBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC7K325T-1FFG676C Tray 44 1
    • 1 $1882.5
    • 10 $1882.5
    • 100 $1882.5
    • 1000 $1882.5
    • 10000 $1882.5
    Buy Now
    Avnet Americas XC7K325T-1FFG676C Tray 19 Weeks 1
    • 1 $1905.09
    • 10 $1905.09
    • 100 $1905.09
    • 1000 $1905.09
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    Mouser Electronics XC7K325T-1FFG676C 3
    • 1 $1852.17
    • 10 $1852.17
    • 100 $1852.17
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    Newark XC7K325T-1FFG676C Bulk 1
    • 1 $1852.17
    • 10 $1852.17
    • 100 $1852.17
    • 1000 $1852.17
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    Avnet Asia XC7K325T-1FFG676C 19 Weeks 1
    • 1 $1981.579
    • 10 $1859.2593
    • 100 $1771.7648
    • 1000 $1771.7648
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    FFG676C Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original
    PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original
    PDF UG112 UG072, UG075, XAPP427, BFG95