FILM FRAME CARRIER PACKING Search Results

SMD Hall sensors

Abstract: surface mount circuit board "bond pad" conductor
Contextual Info: OPTEK TECHNOLOGY INC 4ÔE D M ^ÔSÔO 0DD12fll CHb • OT* - T 'H Z S I OPTO HYBRID FEATURES Chip-on-board design can provide several advantages: SIZE: Used where the function cannot be accomplished with conventional through hole, leaded components. Space savings can be as much as 80% as compared with discrete packaged parts.

X3G-OH047

Abstract: X3G-OH048 X3T-OH047 X3T-OH048 X3G_T_OH047_048 KMZ44 rp2 position sensor
Contextual Info: X3G-OH047; X3T-OH047; X3G-OH048; X3T-OH048 Magnetic field sensor Rev. 1 — 4 April 2011 Product specification 1. Product profile 1.1 General description The X3G-OH047, X3G-OH048, X3T-OH047 and X3T-OH048 are sensitive magnetic field sensors, employing the magneto-resistive effect of thin film permalloy. The sensors

Contextual Info: X3G-OH047; X3T-OH047; X3G-OH048; X3T-OH048 Magnetic field sensor Rev. 1 — 4 April 2011 Product specification 1. Product profile 1.1 General description The X3G-OH047, X3G-OH048, X3T-OH047 and X3T-OH048 are sensitive magnetic field sensors, employing the magneto-resistive effect of thin film permalloy. The sensors

Silicon Controlled Rectifier Manual

Abstract: jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060
Contextual Info: Application Note AN-1060 Bare Die: Handling and Storage By Richard Clark Table of Contents Page Introduction .1 Packing/Carrier Type .1

Sony ACF

Abstract: IC 452 in pqc ADE407-001H ANISOLM induction cooker component list on pcb induction furnace hd66131 INCOMING RAW MATERIAL INSPECTION format induction heating cooker MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR
Contextual Info: Hitachi LCD Controller/Driver DATA BOOK ADE407-001H 8/98 Hitachi Ltd. MC-Setsu Contents GENERAL INFORMATION Quick Reference Guide.

digital watch circuit

Abstract: JESD22-A114 JESD22-A115 PCA2000 PCA2001 PCA2002
Contextual Info: PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 07 — 5 October 2010 Product data sheet 1. General description The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz

induction furnace

Abstract: induction cooker component list on pcb induction furnace manual cmos microcircuit catalog ANISOLM induction heating cooker IC 452 in pqc induction heating furnace MATSUSHITA OSCILLATOR EF INCOMING RAW MATERIAL INSPECTION procedure
Contextual Info: LCD Controller Driver Data Book Application Note 9/1/98 Notice When using this document, keep the following in mind: 1• This document may, wholly or partially, be subject to change without notice. 2• All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of

Contextual Info: PCA2000; PCA2001 32 kHz watch circuit with programmable adaptive motor pulse Rev. 9 — 24 November 2011 Product data sheet 1. General description The PCA2000 and PCA2001 are CMOS1 integrated circuits for battery operated wrist watches with a 32 kHz quartz crystal as timing element and a bipolar 1 Hz stepping motor.

Contextual Info: PCA2000; PCA2001 32 kHz watch circuit with programmable adaptive motor pulse Rev. 9 — 24 November 2011 Product data sheet 1. General description The PCA2000 and PCA2001 are CMOS1 integrated circuits for battery operated wrist watches with a 32 kHz quartz crystal as timing element and a bipolar 1 Hz stepping motor.

Contextual Info: PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 8 — 25 November 2011 Product data sheet 1. General description The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz

Contextual Info: PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 8 — 25 November 2011 Product data sheet 1. General description The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz

mpx2010 schematic

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX2010 MPXT2010 SERIES 10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors Motorola Preferred Device The MPX2010/MPXT2010 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output — directly proportional to the applied pressure.

MOA8

Abstract: Mifare MOB6 module package mifare classic 1k Contactless smart card module specification MOA8 MF1S503x MOB6 Package MIFARE Type Identification Procedure - Application note, BU-ID Document number 0184 MF1S5035DUH clrc632 antenna e purse
Contextual Info: MF1S503x MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development Rev. 3.1 — 21 February 2011 194031 Product data sheet PUBLIC 1. General description NXP Semiconductors has developed the MIFARE MF1S503x to be used in a contactless

rkm 34 transistor

Abstract: RKM 24 sm transistor rkm 21 transistor diode t95 mark J5 SOT-89 CRB20 T95 Diode sot36 rkm 45 transistor TS11
Contextual Info: Packing Monolithic ICs P ackage SOP QFP 2 Taping package SOP8 - 28 pin) P ackaging type Tube A rranged in pla stic tu b e s (antistatic treated) Taping (8 - 28 pins only) SOP ICs adh e re d to a tape and w ound on a reel Pallet H oused in individual cells on stacked

6C15

Abstract: Icode antenna design str 6707 diagram guide ICODE Coil design guide IBIS wafer map format -250/IBIS wafer map format
Contextual Info: INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I•CODE1 Label IC 97pF (IC with Bumps) Chip Specification Product Specification Revision 1.3 Public Philips Semiconductors January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4

ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

Abstract: snw-fq-627 6C15
Contextual Info: INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I•CODE1 Label IC 97pF (IC with Bumps) Chip Specification Product Specification Revision 1.2 Public Philips Semiconductors July 2000 Product Specification SL1 ICS31 01 Rev. 1.2 1 Contents 1 CONTENTS 2 2 DEFINITIONS

Mifare MOB6 module package

Abstract: mob6 package mifare classic 1k MIFARE Card Coil Design Guide nxp MOB6 MIFARE Classic Command SOT500-2 package outline Contactless Smart Card Module Specification MOB6 MIFARE Card IC Coil Design Guide MOA4 package specification
Contextual Info: MF1S503x MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development Rev. 3.0 — 2 December 2010 194030 Product data sheet PUBLIC 1. General description NXP Semiconductors has developed the MIFARE MF1S503x to be used in a contactless

ICS30

Abstract: "reset quiet bit" 6C15 ICODE1 Label ICs
Contextual Info: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.2 Public Philips Semiconductors January 2005 1 Chip Specification Rev. 2.2 January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1

ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

Abstract: ICODE1 Label ICs wafer map
Contextual Info: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.1 Public Philips Semiconductors April 2000 I•CODE1 Chip Specification Rev. 2.1 April 2000 1 Contents 1 CONTENTS 2 2 DEFINITIONS

ed28 smd diode

Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
Contextual Info: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM

sem 2106 inverter diagram

Abstract: induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual
Contextual Info: This version: Jan. 1998 Previous version: Nov. 1996 E2S0001-27-Y3 Introduction Thank you for supporting OKI Semiconductor products. In the rapidly advancing electronics industry, types of semiconductor applications are diversified, and customer demands for

pressure sensor MPX

Abstract: schematic sensor mpx2200 344C 10 pin MPX2202gp
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors MPX2202 MPXV2202G SERIES The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the

344D

Abstract: MPX 1,45 psi
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the

Contextual Info: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR TECHNICAL DATA Freescale Semiconductor, Inc. 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure sensor