FLATPACK 48 V Search Results

MS-026ABC

Contextual Info: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Exposed Pad Plastic Packages EPTQFP Q48.7X7B (JEDEC MS-026ABC-HU ISSUE D) D 48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE D1 -D- MILLIMETERS SYMBOL -B- -AE E1 e PIN 1 TOP VIEW 11o-13o

MS-026BBC

Contextual Info: a 48-Lead Plastic Quad Flatpack [LQFO] 1.4 mm Thick ST-48 Dimensions shown in millimeters 1.60 MAX 0.75 0.60 0.45 PIN 1 INDICATOR 9.00 BSC 37 48 36 1 1.45 1.40 1.35 0.15 0.05 0.20 0.09 SEATING PLANE SEATING PLANE 7؇ 3.5؇ 0؇ 0.08 MAX COPLANARITY VIEW A

MS-026BBC

Contextual Info: a 48-Lead Plastic Quad Flatpack [LQFP] ST-48 Dimensions shown in millimeters 1.60 MAX 0.75 0.60 0.45 PIN 1 INDICATOR 9.00 BSC 37 48 36 1 1.45 1.40 1.35 0.15 0.05 0.20 0.09 SEATING PLANE SEATING PLANE 7؇ 3.5؇ 0؇ 0.08 MAX COPLANARITY VIEW A 7.00 BSC TOP VIEW

MS-026BBC

Contextual Info: a 48-Lead Plastic Quad Flatpack [LQFP] 1.4 mm Thick ST-48 Dimensions shown in millimeters 1.60 MAX 0.75 0.60 0.45 PIN 1 INDICATOR 9.00 BSC 37 48 36 1 1.45 1.40 1.35 0.15 0.05 0.20 0.09 SEATING PLANE SEATING PLANE 7؇ 3.5؇ 0؇ 0.08 MAX COPLANARITY VIEW A

48-PIN

Abstract: GDFP1-F48 dual flatpack
Contextual Info: MECHANICAL DATA MCFP010B – JANUARY 1998 WD R-GDFP-F* CERAMIC DUAL FLATPACK 48-PIN SHOWN 0.120 (3,05) 0.075 (1,91) 0.005 (0,13) TYP 1.200 (30,50) 0.950 (24,13) 0.390 (9,91) 0.370 (9,40) 48 1 0.025 (0,635) A 0.010 (0,25) TYP 25 24 NO. OF PINS* 48 56 A MAX

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.A 48 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 3, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.02) BSC PIN 1 INDEX AREA 0.572 (14.53)

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.B 48 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 0, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.016) BSC PIN 1

MS-026BBC

Abstract: SU-48 MS-026-BBC
Contextual Info: a 48-Lead Thin Plastic Quad Flatpack [TQFP] SU-48 Dimensions shown in millimeters 1.20 MAX 9.00 BSC SQ 0.75 0.60 0.45 37 48 36 1 7.00 BSC SQ TOP VIEW (PINS DOWN) 0.15 0.05 0؇ MIN 25 12 13 24 0.5 BSC 0.20 0.09 0.27 0.22 0.17 7؇ 0؇ SEATING PLANE COMPLIANT TO JEDEC STANDARDS MS-026BBC

GDFP1-F48

Contextual Info: MECHANICAL DATA MCFP010 – OCTOBER 1994 WD R-GDFP-F* CERAMIC DUAL FLATPACK 48 PIN SHOWN NO. OF PINS* 0.120 (3,05) 0.075 (1,91) A MIN MAX 48 0.630 (16,00) 0.730 (18,54) 56 0.610 (15,49) 0.710 (18,03) 0.005 (0,13) NOM 1.200 (30,50) 0.950 (24,13) 0.390 (9,91)

GDFP

Abstract: GDFP1-F48
Contextual Info: MECHANICAL DATA MCFP010A – JANUARY 1997 WD R-GDFP-F* CERAMIC DUAL FLATPACK 48 PIN SHOWN NO. OF PINS* 0.120 (3,05) 0.075 (1,91) A MIN MAX 48 0.630 (16,00) 0.730 (18,54) 56 0.610 (15,49) 0.710 (18,03) 0.005 (0,13) NOM 1.200 (30,50) 0.950 (24,13) 0.390 (9,91)

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK LP7D E – 7 x 7 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE TOP VIEW .280 .272 48

DAP 07

Abstract: top mark 530 MO220
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L48.7x7L 48 LEAD QUAD FLATPACK NO LEAD PLASTIC PACKAGE QFN Rev 0, 2/11 0.10 C A 7.00 4X 5.50 A PIN 1 INDEX AREA PIN 1 ID B 37 6 6 48 1 36 44X 0.50 EXP. DAP 7.00 5.30 ±0.10 SQ. 12 25 24 0.10 C B

MS-026-BBC

Abstract: MS-026BBC
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7A 48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE Rev 3, 1/10 9.00 BSC 7.00 BSC -D3 -B 8.2 7.00 BSC TYP (48X 1.6 ) (48x 0.3 ) 0.50 BSC (44x 0.5 ) TYPICAL RECOMMENDED LAND PATTERN TOP VIEW

MS-026BBC

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7A 48 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE LQFP Rev 4, 7/11 9.00 BSC 7.00 BSC -D3 -B(8.2) 7.00 BSC TYP (48X 1.6 ) (48x 0.3 ) 0.50 BSC (44x 0.5 ) TYPICAL RECOMMENDED LAND PATTERN TOP VIEW

Contextual Info: RF AMPLIFIER MODEL TM9318PM TM9318PM, 4 Pin TO-8 T4 TN9318PM, 4 Pin Surface Mount (SM3) FP9318PM, 4 Pin Flatpack (FP4) BX9318PM, Connectorized Housing (H1) Typical Intermodulation Performance at 25 ºC Features Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM6117

Abstract: BX6117 FP6117 TN6117
Contextual Info: Available as: RF AMPLIFIER MODEL TM6117 TM6117, 4 Pin TO-8 T4 TN6117, 4 Pin Surface Mount (SM3) FP6117, 4 Pin Flatpack (FP4) BX6117, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

Contextual Info: Available as: RF AMPLIFIER MODEL TM6615PM TM6615PM, 4 Pin TO-8 T4 TN6615PM, 4 Pin Surface Mount (SM3) FP6615PM, 4 Pin Flatpack (FP4) BX6615PM,Connectorized Housing (H1) Typical Intermodulation Performance at 25 ºC Features Second Order Harmonic Intercept Point . +48 dBm (Typ.)

Contextual Info: Available as: RF AMPLIFIER MODEL TM7207PM TM7207PM, 4 Pin TO-8 T4 TN7207PM, 4 Pin Surface Mount (SM3) FP7207PM, 4 Pin Flatpack (FP4) BX7207PM,Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 ºC ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

Contextual Info: RF AMPLIFIER MODEL TM9318PM Available as: TM9318PM, 4 Pin TO-8 T4 TN9318PM, 4 Pin Surface Mount (SM3) FP9318PM, 4 Pin Flatpack (FP4) BX9318PM, Connectorized Housing (H1) Typical Intermodulation Performance at 25 ºC Features Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM6533

Abstract: BX6533 FP6533 TN6533
Contextual Info: Available as: RF AMPLIFIER MODEL TM6533 TM6533, 4 Pin TO-8 T4 TN6533, 4 Pin Surface Mount (SM3) FP6533, 4 Pin Flatpack (FP4) BX6533, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

Contextual Info: Available as: RF AMPLIFIER MODEL TM9182 TM9182, 4 Pin TO-8 T4 TN9182, 4 Pin Surface Mount (SM3) FP9182, 4 Pin Flatpack (FP4) BX9182, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM9323

Contextual Info: Available as: RF AMPLIFIER MODEL TM9323 TM9323, 4 Pin TO-8 T4 TN9323, 4 Pin Surface Mount (SM3) FP9323, 4 Pin Flatpack (FP4) BX9323, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

BX9127

Abstract: FP9127 TM9127 TN9127
Contextual Info: Available as: RF AMPLIFIER MODEL TM9127 TM9127, 4 Pin TO-8 T4 TN9127, 4 Pin Surface Mount (SM3) FP9127, 4 Pin Flatpack (FP4) BX9127,Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point.+48 dBm (Typ.)

TM9266

Contextual Info: Available as: RF AMPLIFIER MODEL TM9266 TM9266, 4 Pin TO-8 T4 TN9266, 4 Pin Surface Mount (SM3) FP9266, 4 Pin Flatpack (FP4) BX9266, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)