FLIP CHIP PRODUCTS Search Results

radioactivity detector

Abstract: 25-micron Alpha Industries alpha particle Delco
Contextual Info: Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology Alpha Partical Considerations In Flip Chip Technology 1 What are alpha particles? High energy particles are emitted during radioactive decay of heavier elements

motorola darlington power transistor

Abstract: LIN 2.0 alternator motorola automotive power transistor Alternator regulator MCCF33095 MCCF33096 20PS20
Contextual Info: Order this data sheet by MCCF33096/D MOTOROLA SEMICONDUCTOR~ MCCF33096 TECHNICAL OATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging

BGA 64 PACKAGE thermal resistance

Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect

E700G

Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

LSI Logic

Abstract: Flip Chip Substrate led flip-chip heatsink Signal Path Designer
Contextual Info: Flip Chip Ball Grid Array FPBGA Package Family Overview LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using

RCA03-4D

Abstract: SMD resistors codes FCR05 FCR06 FCR 06 smd jumper marking code G RCN06-10R smd code marking resistor RCA03 eia0603
Contextual Info: TOKEN FCR, RCA, RCN Chip Resistors Surface Mount Chip Resistors Token has introduced precision surface-mount resistor networks, chip array, and flip-chips. Preview Token has introduced precision surface-mount resistor networks, chip array, and flip-chips. Those no-lead packages are optimized

APP3599

Abstract: DS2760 DS2761 AN3599
Contextual Info: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS Keywords: DS2760, flip chip, DS2761, DS2761 flip-chip, RoHS, lead, Pb, lead free, Pb free, battery management, fuel gauge Sep 16, 2005 APPLICATION NOTE 3599 Assembling High-Lead Pb DS2761 Flip-Chips in a Pb-Free Assembly

Contextual Info: LUXEON Flip Chip Chip Scale Package LED Introduction Philips Lumileds LUXEON Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level

Pb95Sn5

Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Contextual Info: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377

MARKING CODE SMD IC

Abstract: MO-211 SFC2282-50 very low leakage tvs
Contextual Info: SFC2282-50 ChipClampΤΜ Flip Chip TVS Diode with T-Filter PRELIMINARY PROTECTION PRODUCTS Description Features ‹ Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ‹ ESD protection to The SFC2282-50 is a low pass T-filter with integrated

Gps circuit diagram

Abstract: POWER DIVIDER 3GHz
Contextual Info: SFC2282-50 ChipClampΤΜ Flip Chip TVS Diode with T-Filter PRELIMINARY PROTECTION PRODUCTS Description Features ‹ Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ‹ ESD protection to The SFC2282-50 is a low pass T-filter with integrated

MF0 IC U1X

Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1

Philips MF1 IC S50

Abstract: Philips Mifare 1 S50 mf1 s50 Mifare MF1 S50 Specification FCP2 Flip Chip Package FCP2 Philips Mifare 1 S50 specifications MF1 IC S50 mifare s50 mifare s50 MIFARE
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF1 FCP2 S50 Flip Chip Package Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.1 October 2004 Flip Chip Package Specification MF1 FCP2 S50

Contextual Info: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

VESD05C-FC1

Contextual Info: VESD05C-FC1 VISHAY Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

VESD05C-FC1

Contextual Info: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

Contextual Info: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

Contextual Info: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

Contextual Info: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

VESD05C-FC1

Contextual Info: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for

smd diode marking A3

Contextual Info: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping

tvs smd marking 20a

Contextual Info: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping