FLUX FOR SOLDER WIRE SN 96 Search Results

bellcore GR-78

Abstract: J-STD-006 SAC305
Contextual Info: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.

SAC405

Abstract: NC266 Flux for solder wire Sn 96 SN100C IPC-TM650 J-STD-004 SAC305 TM650 177E-09 solder paste SAC305 .032
Contextual Info: Glow Core No-Clean Cored Wire Solder Features: - Excellent Wetting - Wide Process Window - Cleanable with Saponifier - Lead-Free Compatible Description: Glow Core is a no-clean, resin-based flux cored wire solder designed to offer excellent wetting characteristics and

TS0300

Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Contextual Info: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

ECF564A

Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Contextual Info: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

Contextual Info: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

Contextual Info: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.

Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

84-1LM

Abstract: ECF564A
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with

ECF564A

Contextual Info: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

ROSIN FLUX TYPE ROL1

Abstract: IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement
Contextual Info: Soldering and Handling of High Brightness Through Holes LED Lamps Application Note 5334 Introduction LED is well known of its long useful life compare to conventional incandescent bulb. If LED is not being properly handled, it will significantly shorten its useful life and

Alpha WS609 solder

Abstract: mountaingate Kester steam aging system solder paste alpha WS609 ALS245 LS245 TL082 Dissolve Oxygen free energy matsua saw
Contextual Info: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as

Alpha WS609 solder

Abstract: Kester steam aging system solder paste alpha WS609 7406D mountaingate kester solder paste WS609 TL082 s05d SHINKO WS609
Contextual Info: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as

ipc 610 Class 3 pin protrusion

Abstract: flux ef 2202 ipc 610D ipc 610 Class 3 IPC-A-610D ipc 610 non-wetting IPCA610D ipc 610 IPC-A-610-D IPC-A610D
Contextual Info: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection

senju M705-221BM5-42-11

Abstract: casting JIS B 0405 ET-7403 PTC thermistor 4.7k ptc thermistor 330ohm senju m705 solder wire pth posistor PRF15BA471QB1RC PRF15BB471QB1RC PRF18BD471QB1RB
Contextual Info: PDF catalog is downloaded from!CAUTION the website for of Murata Manufacturing co., ltd. Therefore, it’s specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please

Contextual Info: APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has

Ablestik 84-1LMI

Abstract: mil-f-14256* rma h20E induction furnace circuit fiberglass laminate induction furnace circuit board
Contextual Info: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has

h20E

Abstract: induction furnace circuit induction furnace circuit board Ablestik 84-1LMI
Contextual Info: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has

CF-110VH-2A

Abstract: tamura CF-110VH-2A spud 002t p0.5 tensile strength Tamura kaken pud connector SPUD-002T-P0 SPUD-001T-P0 T-2-42353 JST PUD
Contextual Info: Page This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for m anufacturing, without our written and has to be returned to us. PRODUCT SPECIFICATION No. T-2-42353 R-2-42353 Customer: Revised: Title Subject.

thermistor ptc 15k ohm

Abstract: ET-7403 pth posistor BC components PTC SMD
Contextual Info: R90E7.pdf 05.3.30 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF

J-STD-006 electronic grade solder alloys

Abstract: TC-527 ASTM B32 4662-SM QQ-S-571F kester 245 solder wire Kester sn62 tinning RV8NA nte semiconductors ceiling fan
Contextual Info: E L E C T R O N I C S, I N C. www.nteinc.com Kester Solder Wide range of solders and related materials from the leader in the industry. Products KESTER • Wire Solder • Bar Solder • Carded & Counter Display Products • Chemicals • Techform Products

BGS67A

Abstract: philips if catv amplifier philips hybrid amplifier modules philips application catv
Contextual Info: Application Note BGS67A Application Note AN10201 Philips Semiconductors TPAN02_02W97 Philips Semiconductors BGS67A application note Application Note AN10201 Abstract The BGS67A is a high dynamic range hybrid amplifier designed for applications as a reverse amplifier in two-way CATV systems.

Sn60A

Abstract: distillation method F-2100 F-2101 SN60 SN63 F2102 electric blanket
Contextual Info: Reflow Soldering Process Considerations for Surface Mount Application by Jim Bergenthal KEMET Electronics Corporation P. O. Box 5928 Greenville, SC 29606 Phone 864 963-6300 Fax (864) 963-6521 www.kemet.com F-2102A 7/95 Reprinted 10/97 saying about it. Methods of improving on the process, to balance these criticisms, are also dis-cussed.