FOOTPRINT VFBGA Search Results

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA48 package SOT1063-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

VFBGA144

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA144 package SOT1078-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA100 package SOT1087-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VFBGA56 package SOT702-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA81 package SOT1071-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

CSR BC212

Abstract: MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4
Contextual Info: Product Data Sheet Device Features BlueCore 2-External Low power 1.8V operation TM Small footprint in 96-Ball VFBGA Package 6x6mm Single Chip Bluetooth System Fully qualified Bluetooth component Full speed class 2 Bluetooth operation with full 7 slave piconet support

Contextual Info: CYWB0124AB West Bridge : Antioch™ USB/Mass Storage Peripheral Controller 1.0 Features • • • • DMA slave support Ultra low power, 1.8V core operation Low power modes Small footprint, 6x6mm VFBGA and less than 4x4mm WLCSP • Selectable clock input frequencies

CRC-16

Abstract: USB3290 USB3290-FH
Contextual Info: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification

CSR BLUECORE VIRTUAL MACHINE

Abstract: CSR BC212 BC212015BD CSR BLUECORE at command CSR BLUECORE 6 BCCMD Protocol MDR741F BlueCore BCCMD Commands BlueCore 3 csr CSR USB SPI converter csr BC212015
Contextual Info: _äìÉ`çêÉ OJbñíÉêå~ä= qj Device Features Single Chip Bluetooth System „ Low power 1.8V operation „ Small footprint in 96-ball VFBGA and LGA packages 6x6mm 8x8mm and 10x10mm „ Fully qualified Bluetooth component „ 0.18µm CMOS technology „

CRC-16

Abstract: USB3290 USB3290-FH
Contextual Info: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification

BlueCore 3 csr

Abstract: btm 110 bluetooth csr BlueCore 4 RFCOMM Stack CSR BLUECORE spp CSR BlueCore 4 API CSR BLUECORE SPI CSR BLUECORE spp protocol BLUECORE serial BlueCore 4 csr BC215
Contextual Info: Product Data Sheet Device Features Low power 1.8V operation 0.18µm CMOS technology Small footprint in 6 x 6 mm package BlueCore 2-ROM TM Single Chip Bluetooth System Advance Information Data Sheet Fully qualified Bluetooth component April 2002 Scatternet support

Contextual Info: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification

nrzi

Abstract: USB3290 USB3290-FH nrzi encoding in usb footprint vfbga
Contextual Info: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification

BlueCore 3 csr

Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application
Contextual Info: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included

Contextual Info: ARM-based Embedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for

Contextual Info: AT91SAM ARM-based Embbedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for

Contextual Info: AT91SAM ARM-based Embedded MPU SAM9G25 SUMMARY DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for

vFBGA* 96 bALL

Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are

LV 1084 73

Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Contextual Info: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

Contextual Info: Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height mm Pitch (mm) NXP 0.5 GX 0.3 GN TI Fairchild ON Toshiba CMX fsV MicroPak 0.8 x 0.8 x 0.35 MicroPak 1.0 x 0.9 x 0.35 MicroPak GF FHX 0.35 1.0 x 1.0 x 0.5 GF 1.0 x 1.0 x 0.35 GS

S71VS

Abstract: S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R
Contextual Info: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet

NXP PN544 user manual

Abstract: PN544 user manual NXP PN544 PN544 PN544 NFC controller data sheet nfc PN544 NXP PN544 Antenna Design Guide PN544 NFC controller nxp pn544 antenna design PN544 hardware design guide
Contextual Info: Application guide Portable devices and mobile handsets Introduction Your partner for portable devices and mobile handsets NXP Semiconductors is a recognized leader in portable and mobile applications. We offer a comprehensive portfolio of best-in-class solutions

S71VS256RD0AHK3M

Contextual Info: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet