FOOTPRINTS USE BY AMKOR Search Results

1292 BGA

Abstract: amkor flip flip chip bga 0,8 mm FOOTPRINTS USE BY AMKOR Flip Chip Substrate X3941 amkor
Contextual Info: LAMINATE data sheet Super FC Features: Super FC® Packages: Amkor’s SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the

lqfp 64 Shipping Trays

Abstract: DS310H
Contextual Info: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging

HL832N

Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
Contextual Info: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment

Contextual Info: LAMINATE data sheet Features: et CSP Package: Thermal Performance: Amkor's etCSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The

DS7409HGB

Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of

E679

Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Contextual Info: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

JEDEC Jc-11 free

Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
Contextual Info: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

CS-007

Abstract: Amkor Electronics Amkor mold compound
Contextual Info: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld

5M80ZT100

Abstract: 5M570ZM100 5M2210ZF256 5M160ZE64 5m240Zt100 5M1270ZF324 5m570ZT144 EP4CE15F17 5M40ZE64A5 5M1270ZT
Contextual Info: The Automotive-Grade Device Handbook The Automotive-Grade Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com AUT5V1-2.0 Document last updated for Altera Complete Design Suite version: Document publication date: 11.0 May 2011 Subscribe 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.

CU-106A

Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
Contextual Info: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT

Contextual Info: PRELIMINARY ICS843001-40 FEMTOCLOCKS CRYSTAL-TO-2.5V LVPECL FREQUENCY SYNTHESIZER GENERAL DESCRIPTION FEATURES The ICS843001-40 is an LVPECL output Synthesizer ICS and is a member of the HiPerClocksTM family of high HiPerClockS™ performance devices from IDT. The device uses a

EPM7128STC100-15

Abstract: EPF10K50RI240-4 ALTERA MAX EPM7128SQC100-15 EPF10K10LC84-3 qpsk modulation VHDL CODE 304 QFP amkor ALTERA EPF10K50RI240-4 MAX7000S EPF10K10LC84-4 EPF10K20A
Contextual Info: Newsletter for Altera Customers ◆ First Quarter ◆ February 1997 FLEX Devices: The Gate Array Alternative Altera’s FLEX 10K and FLEX 8000 devices combine the flexibility of programmable logic devices PLDs with the density and efficiency of gate arrays. As PLD unit

100MHZ

Abstract: 50MHZ MO-220
Contextual Info: ICS843001-40 FEMTOCLOCKS CRYSTAL-TO-2.5V LVPECL FREQUENCY SYNTHESIZER GENERAL DESCRIPTION FEATURES The ICS843001-40 is an LVPECL output Synthesizer ICS and is a member of the HiPerClocksTM family of high HiPerClockS™ performance devices from IDT. The device uses a

AN315

Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
Contextual Info: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are

ICS83PN625I

Abstract: TRANSISTOR REPLACEMENT GUIDE
Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN625I DATA SHEET General Description Features The ICS83PN625I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

ICS83PN156I

Abstract: ICS3PN156DIL TRANSISTOR REPLACEMENT GUIDE 2 pin crystal oscillator 20mhZ
Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN156I DATA SHEET General Description Features The ICS83PN156I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

ICS843PN187DKI

Abstract: ICS843PN187I
Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN187I DATA SHEET General Description Features The ICS83PN187I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN148I DATA SHEET General Description Features The ICS83PN148I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN187I DATA SHEET General Description Features The ICS83PN187I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN625I DATA SHEET General Description Features The ICS83PN625I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

TRANSISTOR REPLACEMENT GUIDE

Abstract: C392C
Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN148I DATA SHEET General Description Features The ICS83PN148I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG

ICS83PN156I

Abstract: ICS3PN156DIL 83PN156DKILF TRANSISTOR REPLACEMENT GUIDE
Contextual Info: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN156I DATA SHEET General Description Features The ICS83PN156I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG