FR4 DATASHEET Search Results

SM76

Abstract: Pletronics LV78 SM11 PE33 pletronics LV11
Contextual Info: PRODUCT CHANGE NOTIFICATION Title Keywords Article: Covers removed on Pletronics FR4 based oscillators Product Change Notification, SM76, SM11, LV76, LV78, LV11, PE76, PE78, PE11, PE33, PE37, Covers, FR4 Products Affected: Pletronics SM76, SM11, LV76, LV78, LV11,

FR4 substrate

Abstract: AP602 IMD3 equivalent
Contextual Info: Application Note Converting AP60x Ultralam Designs to FR4 This applications note outlines a method to convert our AP60x Ultralam designs to FR4. Currently all WJ AP60x reference designs use Ultralam as the substrate of choice as it provides the highest performance

Contextual Info: PRODUCT DATASHEET PART NUMBER: CX2232NL • • • • • 1:1 RF Transformer 800-1900 MHz Suitable for MoCA Applications Surface Mount, FR4 Substrate RoHS Compliant Electrical Specifications @ 25°C Operating Temperature -40°C to +85°C INSERTION LOSS :

8751

Contextual Info: BROTHANEK COMPONENTS GMBH Datasheet – Art.No.: BE 439 One-side prototyping boards for fast experiments with processors and logic circuits. Suitable for surface mounted circuits type QFP, SOP, SSOP and SDIP. Material : Epoxy FR4 , 1.5 mm Size : 160 x 100 mm

8751

Abstract: SOL package smd diode nr smd electronic SMD Packages sol 20 Package Smd components
Contextual Info: BROTHANEK COMPONENTS GMBH Datasheet – Art.No.: BE 461 SMD test board for soldering tests with SMD Components in different packages, e.g. 0603 up to 2220, SOT, SOL, PLCC, … Material : Epoxy FR4 , 1.5 mm Size : 140 x 100 mm Trace : Refer to picture Hole spacing :

E28F008SA

Abstract: EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

5100 B3 transmitter

Abstract: NKG3184A VCTCXO Oscillators Crystals KSS 213 12Mhz crystal oscillator nkg3 TCXO KSS ACP550 kss japan tcxo LMX9820
Contextual Info: June 2004 Revision 0.6 Preliminary - Confidential LMX9820A Bluetooth Serial Port Module 1.0 General Description The National Semiconductor LMX9820A Bluetooth™ Serial Port module is a highly integrated radio, baseband controller and memory device implemented on an FR4

PRBS7

Abstract: AN1473 DS40MB200 DS42BR400 DS42MB100 AN1541 an-1541 national
Contextual Info: National Semiconductor Application Note 1541 Leo Chang December 2006 TABLE 1. XAUI Jitter Budget Allowances. 1.0 Introduction This paper demonstrates how National Semiconductor’s DS42MB100, DS40MB200, and DS42BR400 equalize XAUI backplane FR4 traces and reduce data dependent jitter to

1.5528

Abstract: EDI7F33512C AM29F040 2192
Contextual Info: EDI7F33512C 512Kx32 Flash DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29F040 - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

AM29LV004T

Abstract: EDI7F33512V
Contextual Info: EDI7F33512V 512Kx32 FLASH DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29LV004T - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

transistor a226

Abstract: A226 transistor PHILIPS capacitors 0402 GJM1555C1H5R6CB01 0402 footprint balun sma GRM1555C1H4R7CB01 ATR2406-DEV-BOARD ATR2406-DEV-KIT 1p5 sot 23
Contextual Info: Features • Close to production PCB-Layout • Small Footprint FR4 2-Layer Module • Integrated Antenna & SMA-Antenna Connector • Printed Transmit/Receive Filters • Few Low Cost External Components • High Receiver Sensitivity of up to –91 dBm at Antenna-Port

1mx8

Abstract: AM29LV008T EDI7F2331MV EDI7F331MV
Contextual Info: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

EDI7F331MV

Abstract: AM29LV008T EDI7F2331MV
Contextual Info: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

Contextual Info: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren’t recommended because of cracking. The natural

LMX9820

Abstract: lmx9820asm block diagram bluetooth headset history of bluetooth bluetooth report 001C LMX9820A LMX9820SB TCXO 4322 190 LMX9820ADEV
Contextual Info: National Semiconductor Software Users Guide October 2006 Revision 1.6.4 Introduction The National Semiconductor LMX9820A Bluetooth Serial Port Module is a highly integrated radio, baseband, and memory implemented on a FR4 substrate. All hardware and firmware is included to provide a complete solution from antenna

AM29LV008T

Abstract: EDI7F4331MV
Contextual Info: EDI7F4331MV 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MV is organized as four banks of 1Mx32. The module is based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MV-BNC: 4x1Mx32 80 PIN SIMM

FR4 epoxy 4.3

Abstract: FR4 epoxy
Contextual Info: PGA/PGI/MGS - Series Pin Grid Array Sockets E-tec offers any configuration. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in plastic or FR4 Epoxy depending on material availability.

Contextual Info: Isolated Gate Driver Gate Driver for SiC SJT with Output and Signal Isolation GA15IDDJT22-FR4 VISO,min PDrive, cont PDrive,switch fMAX Features Package •      RoHS Compliant Requires single 12 V voltage supply Two-voltage level topology with low drive losses

FR4 epoxy

Contextual Info: PGA/PGI/MGS - Series Pin Grid Array Sockets E-tec offers any configuration. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in plastic or FR4 Epoxy depending on material availability.

AN-1380

Abstract: EQ50F100 LM27262 SCAN50C400
Contextual Info: National Semiconductor Application Note 1380 TK Chin April 2005 1.0 Introduction Figure 1 shows the transmission loss of a 20-inch FR4 board trace using a 6-mil trace width versus a 20-inch backplane using an 8-mil trace width. Figure 2 illustrates the dominating

Contextual Info: GA03IDDJT30-FR4 Isolated Gate Driver Gate Driver for SiC SJT with Output and Signal Isolation Features •       VISOLATION PDRIVE fmax = = = 3000 V 5W 350 kHz Product Image Requires single 12 V voltage supply Pin Out compatible with MOSFET driver boards

Contextual Info: HALLSENSOREV1 USER GUIDE DESCRIPTION The HALLSENSOREV1, Figure 1, is a PCB constructed using an FR4 base for demonstrating various Diodes Inc Hall sensor devices in a sales environment. There are on-board LEDs to show the operation of the devices, as well as test points to connect an oscilloscope or multimeter.

C1-D18

Abstract: R5000 mips ACT5260 ACT5260PC-P10-POD R4400 R4400PC R4700 R5000
Contextual Info: ACT5260PC-P10-POD FR4 Adapter The Aeroflex ACT5260PC-P10-POD adapts a QED RM5260 MIPS microprocessor to an R4400PC, R4600 or R4700 processor’s 179 pin PGA footprint. This product allows the evaluation of the latest MIPS IV 5XXX series performance in existing 4XXX series hardware. Some of the performance