FR4 DIELECTRIC Search Results
FR4 DIELECTRIC Result Highlights (4)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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LMH0356SQE-40/NOPB |
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3 Gbps HD/SD SDI Reclocker with 4:1 Input Mux and FR4 EQs 40-WQFN -40 to 85 |
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LMH0356SQE/NOPB |
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3 Gbps HD/SD SDI Reclocker with 4:1 Input Mux and FR4 EQs 48-WQFN -40 to 85 |
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LMH0356SQ-40/NOPB |
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3 Gbps HD/SD SDI Reclocker with 4:1 Input Mux and FR4 EQs 40-WQFN -40 to 85 |
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LMH0356SQ/NOPB |
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3 Gbps HD/SD SDI Reclocker with 4:1 Input Mux and FR4 EQs 48-WQFN -40 to 85 |
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FR4 DIELECTRIC Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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OP35Contextual Info: FEATURES DC to 4.25 Gbps per port NRZ data rate Adjustable receive equalization 3 dB, 6 dB, or 12 dB boost Compensates over 40 inches of FR4 at 4.25 Gbps Adjustable transmit preemphasis/deemphasis Programmable boost and output level Compensates over 40 inches of FR4 at 4.25 Gbps |
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8b10b, 352-Ball 22206-A BP-352 ADN4605 D09796-0-11/11 OP35 | |
Contextual Info: FEATURES DC to 4.25 Gbps per port NRZ data rate Adjustable receive equalization 3 dB, 6 dB, or 12 dB boost Compensates over 40 inches of FR4 at 4.25 Gbps Adjustable transmit preemphasis/deemphasis Programmable boost and output level Compensates over 40 inches of FR4 at 4.25 Gbps |
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8b10b, ADN4605ABPZ ADN4605-EVALZ 352-Ball BP-352 ADN4605 D09796-0-11/11 | |
XEB72353
Abstract: XFP EVALUATION BOARD RD006 Mod Jp1 DS3900 OC192 10GHz serializer HFRD DS1868 NC7WZ04P6X
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HFRD-06 DS3900 XEB72353 XFP EVALUATION BOARD RD006 Mod Jp1 OC192 10GHz serializer HFRD DS1868 NC7WZ04P6X | |
1210 case
Abstract: MC08FA101J-F MC08FA680J-F MC08FA750J-F MC08FA820J-F MC08FA910J-F MC12FA470J-F
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MC18Contextual Info: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power Chips and New Nonmagnetic Option. Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other larger size multilayer caps aren’t recommended. The natural mica dielectric |
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capacitor 560 pF 500VContextual Info: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power Chips and New Nonmagnetic Option. Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other larger size multilayer caps aren’t recommended. The natural mica dielectric |
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Contextual Info: TECHNICAL DATA SHEET 1/2 R223.990.000 MMBX DEMONSTRATION PCB Series : MMBX SMT TYPE RECEPTACLE All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS FR4 - - - Issue : 0736 B |
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TB342
Abstract: 10n5 n20 n10 C814 TB-342
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TB-342 IT-180TC WTB-342 TB342 10n5 n20 n10 C814 TB-342 | |
Contextual Info: TECHNICAL DATA SHEET 1/2 MMBX DEMONSTRATION PCB R223.991.000 SMT TYPE PLUG RECEPTACLE Series : MMBX All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS FR4 - - Issue : 0736 B |
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PS5570
Abstract: MAX3803 MAX3803UBP-T
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125Gbps MAX3803 160mW MAX3803 PS5570 MAX3803UBP-T | |
Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability |
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518-77-NNNMXX-XXX106 CuZn36Pb3 C36000) C17200) CH-2800 | |
TRANSISTOR C 608
Abstract: f AG19 610-AG22 FR4 GLASS EPOXY 608-AG21 AG10 TRANSISTOR CATALOGUE AG21 AG19
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600-AG 608-AG22 610-AG19 610-AG22 TRANSISTOR C 608 f AG19 610-AG22 FR4 GLASS EPOXY 608-AG21 AG10 TRANSISTOR CATALOGUE AG21 AG19 | |
Contextual Info: TG-CPCB3-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership |
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TG-CPCB3-LI98-0 Al203 D5470 50psi 1000g D3330 D1002 | |
PRBS7
Abstract: AN1473 DS40MB200 DS42BR400 DS42MB100 AN1541 an-1541 national
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DS42MB100, DS40MB200, DS42BR400 AN-1541 PRBS7 AN1473 DS40MB200 DS42MB100 AN1541 an-1541 national | |
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Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life |
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550-10-NNNMXX-XXX152 CuZn36Pb3 C36000) 20x20 550-10-256M20-001152. CH-2800 | |
Contextual Info: TG-CPCB1-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership |
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TG-CPCB1-LI98-0 Al203 D5470 50psi 1000g D3330 D1002 | |
Contextual Info: TG-CPCB2-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership |
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TG-CPCB2-LI98-0 Al203 D5470 50psi 1000g D3330 D1002 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life |
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558-10-NNNMXX-XXX104 CuZn36Pb3 C36000) 20x20 550-10-256M20-001152. CH-2800 | |
transistor a226
Abstract: A226 transistor PHILIPS capacitors 0402 GJM1555C1H5R6CB01 0402 footprint balun sma GRM1555C1H4R7CB01 ATR2406-DEV-BOARD ATR2406-DEV-KIT 1p5 sot 23
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STK500 ATR2406-DEV-BOARD ATR2406-DEV-BOARD 7-Sep-04 transistor a226 A226 transistor PHILIPS capacitors 0402 GJM1555C1H5R6CB01 0402 footprint balun sma GRM1555C1H4R7CB01 ATR2406-DEV-KIT 1p5 sot 23 | |
c105mContextual Info: Low Inductance Chip Capacitors InterDigitated Capacitor IDC GENERAL DESCRIPTION + - + + - - AVX’s interdigitated capacitor is a very low inductance, surface mount capacitor. A measured inductance of 175pH makes this the lowest, FR4 mountable device in the industry. With the high speed microprocessors approaching |
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175pH 500MHz, c105m | |
analog multimeter
Abstract: Metrawatt AN948 APP948 HP16500C MAX101A MAX101AEVKIT MAX104
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MAX101A. MAX101A com/an948 MAX101A: MAX101AEVKit: AN948, APP948, Appnote948, analog multimeter Metrawatt AN948 APP948 HP16500C MAX101AEVKIT MAX104 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life |
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550-10-NNNMXX-XXX166 CuZn36Pb3 C36000) 20x20 514-83-256M20-001148. CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200) |
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514-PP-NNNMXX-XXX148 CuZn36Pb3 C36000) C17200) CH-2800 | |
Preci-DipContextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200) |
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514-PP-NNNMXX-XXX148 CuZn36Pb3 C36000) C17200) 20x20 CH-2800 Preci-Dip |