FR4 THICKNESS 1.6MM Search Results

AMF1608B2450A1T

Abstract: AMF1005B2450AT AMF1608B2450B1T 2400-2500MHz
Contextual Info: MD-MDE013-201212 Multilayer Chip BPF AMF1005B / AMF1608B Series Applications Features • Mobile phone  Ultra Small Size and Low Profile 1.6mm（L）x0.8mm（W）×0.4mm（H） typ.  W-LAN , Bluetooth , etc. 1.0mm（L）×0.5mm（W）×0.4mm（H） typ.

Contextual Info: Application Note Packaging Solutions to Heat Generation Light Emitting Diode 1. Objective Multiple LEDs are generally mounted on a board for the desired light output, as panel light and illumination for facilities. Operating a single LED generates high heat; all the more heat is generated when multiple LEDs are

FR4 1.6mm substrate

Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
Contextual Info: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2

SG-BGA-7104

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7018

Contextual Info: GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7053

Abstract: IC-512
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

7052

Abstract: SG-BGA-7052
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7048

Abstract: ic 7048
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-6102

Abstract: SG-BGA-6120
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 28.225mm Ball guide prevents over compression of elastomer

IC 7108

Abstract: SG-BGA-7108 7108 and/cj 7108
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7051

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7149

Contextual Info: 12.225mm GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

7058

Abstract: SG-BGA-7058
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7070

Abstract: FR4 0.8mm thickness
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7057

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7059

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

Jack cat5e

Abstract: modular plug amp RJ45 cat5e keystone jack PBT 20 GF PBT20 AMP modular plug RJ45 PBT-20GF
Contextual Info: 2 3 5 4 6 7 A 14.50MM 14.50MM A 16.20MM 1 35.4MM B B 16.20MM 19.20MM C 21.20MM 8.13MM 3.80MM 7.1MM Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM

PBT 20 GF

Abstract: AMP modular plug RJ45 RJ45 JACK PCB CAT6
Contextual Info: 2 3 5 4 6 7 A 14.50MM 14.50MM A 16.20MM 1 35.4MM B B 16.20MM 19.20MM C 21.20MM 8.13MM 3.80MM 7.1MM Material: • Housing: PC UL94V-0 • Insert Material: PBT+20%GF UL94V-0 • PCB Material: FR-4 Thickness 1.6MM • Contact Material: Phosphor Bronze Stamp Pin T=0.50MM

IC 7012

Abstract: SG-BGA-7012 7012 ic
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7098

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7055

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

FR4 thickness 1.6mm

Abstract: 7101 11351 te 7101 SG-BGA-7101
Contextual Info: GHz CSP Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7148

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

7082 B

Abstract: SG-BGA-7082
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid