G770 MOLD COMPOUND Search Results

PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently

PCN0516

Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

Contextual Info: RELIABILITY REPORT 06/15/2007 CONTACT: PRODUCT DESCRITION: MIC5301 MIC5301 MIC5302 MIC5303 MIC5318 MIC5318 Micrel QA/REL 408 435-3476 Device ID MIC5301 MIC5301 MIC5302 MIC5303 MIC5318 MIC5318 YD5 YML YMT YMT YML YD5 Base Die ID YD5 YML YMT YMT YD5 YML 5301A

Contextual Info: RELIABILITY REPORT 12/27/2005 CONTACT: PRODUCT DESCRITION: Micrel QA/REL MIC5305 2.9YML 408 435-3476 PRODUCT DETAILS QUAL VEHICLE : PACKAGE: MIC5305 2.9YML MLF 6L MIC5305 2.9YML MIC5305 2.9YML ASSEMBLY M/C D/C LOT PROCESS UNISEM G770 0524 5A11088MEF CSI .5

Contextual Info: RELIABILITY REPORT DATE : 06/15/07 QUALITY ENG : PART NUMBER : H. GRIMM MIC5318-YML : Single, 300mA uCap LDO. QUAL VEHICLE : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS MIC5318-2.85YML 1.6mm x 1.6 mm MLF-6L UNISEM 0606 5A45310MNX San Jose G770

Contextual Info: RELIABILITY REPORT DATE : 7/18/08 QUALITY ENG : PART NUMBER : Dinh Pham MIC33050 : 4MHz Internal Inductor PWM Buck Regulator With HyperLight Load. QUAL VEHICLES : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS MIC33050-GYHL 3x3 HMLF-12L UNISEM 0716

Contextual Info: RELIABILITY REPORT DATE : 12/05/2011 QUALITY ENG : PART NUMBER : Dinh Pham MIC23153 : 4MHz PWM 2A Buck Regulator With HyperLight Load and Power Good. MIC23155 : 3MHz PWM 2A Buck Regulator With HyperLight Load and Power Good. QUAL VEHICLES : PACKAGE TYPE :

Contextual Info: RELIABILITY REPORT DATE : 10/07/08 QUALITY ENG : PART NUMBER : Dinh Pham MIC5375/5376 : 150mA LNR Regulator Fixed Output Voltages . MIC5377/5378 : 150mA LNR Regulator (Adjustable Output Voltage) QUAL VEHICLE: PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB #

Contextual Info: RELIABILITY REPORT DATE : 8/26/08 QUALITY ENG : PART NUMBER : Dinh Pham MIC22600 : 1MHz 6A Integrated Switch Synchronous Buck Regulator MIC22601 : 4MHz 6A Integrated Switch Synchronous Buck Regulator QUAL VEHICLE : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB #

Contextual Info: RELIABILITY REPORT DATE : 7/25/06 QUALITY ENG : PRODUCT DESCRIPTION : PWM Synchronous Buck Regulator With LDO Stanby Mode. Dinh Pham 2 Mhz : MIC2205 & MIC2206 4 Mhz : MIC2245 8 Mhz : MIC2285 QUAL VEHICLE PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS

Contextual Info: RELIABILITY REPORT DATE : 04/02/08 QUALITY ENG : PART NUMBER : H.Grimm MIC5365 and MIC5366 Family 150mA LNR Regulators QUAL VEHICLE: PACKAGE TYPE : MIC5365 / MIC5366 MIC5365 / MIC5366 ASSEMBLY LOC RoHS Lead free M/C Fab Loc PROCESS 1.0mm x 1.0mm Thin MLF-4L

Contextual Info: RELIABILITY REPORT DATE : 5/25/07 QUALITY ENG : PART NUMBER : Dinh Pham MIC3385 : 8MHz Power System Module with LDO Stanby Mode QUAL VEHICLE : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB LOCATION M/C PROCESS MIC3385YML 3.5mm x 3.0mm MLF-14L UNISEM 0641 6A36704MNG

C1307

Abstract: MIC23163
Contextual Info: RELIABILITY REPORT DATE : 12/03/2013 QUALITY ENG : PART NUMBER : H GRIMM MIC23164: 4MHz_2A Synchronous Buck Regulator w HyperLight Load active pull down. MIC23163: 4MHz_2A Synchronous Buck Regulator w HyperLight Load. QUAL VEHICLES : PACKAGE TYPE : ASSEMBLY LOC

Contextual Info: RELIABILITY REPORT DATE : 07/24/13 QUALITY ENG : PART NUMBER : H.Grimm MIC5317_YMT 150mA LNR Regulator QUAL VEHICLE: PACKAGE TYPE : MIC5317 YMT 1.0mm x 1.0mm Thin MLF-4L ASSEMBLY LOC RoHS Lead free M/C Fab Loc PROCESS UNISEM_CN NiPdAu plating G770 San Jose

Contextual Info: RELIABILITY REPORT DATE : 8/11/05 QUALITY ENG : PART NUMBER : MIC5264, Dual 150mA uCap LDO Regulator Dinh Pham QUALIFICATION VEHICLE : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS MIC5264-PGYML 2.5mm x 2.5mm MLF-10L UNISEM 0447 3A49197MNE San Jose

Contextual Info: RELIABILITY REPORT DATE : 10/24/06 QUALITY ENG : PART NUMBER : Dinh Pham MIC5232 PROJECT # : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS 25065-3 MIC5232-1.2YD5 TSOT23-5L UNISEM 0520 5A12243MNM San Jose 6730 CSI 1.2 25065-4(MIC5232-3.3YD5) TSOT23-5L

ICS9LPRS387BKLF

Abstract: ICS9LPRS113AKLF 932SQ420 9lrs3165bkl ICS9LPRS918JKLF ICS9LPRS397DKLF ICS9LPRS387BKLFT ICS9LPRS476HKLF ICS9LPRS387AKLFT ICS9LPRS387
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0808-02R2 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 25-Aug-2010 MEANS OF DISTINGUISHING CHANGED DEVICES:

JESD22-A118

Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers

SUMITOMO CRM1076

Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers

sumitomo g770

Abstract: G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo
Contextual Info: Maxim > App Notes > 1-Wire devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electromechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment methods for the electro-mechanical SFN package

sumitomo g770

Abstract: SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING
Contextual Info: Maxim > App Notes > 1-Wire Devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electro-mechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment Methods for the Electro-Mechanical SFN Package

4900GC

Abstract: IDT72V36110L7-5PFG IDT72V36110L7-5PFGI IDT70261L20PFGI IDT7025S25PFG8 IDT70V06L20PFGI8 IDT7133SA35PF8 IDT70V28L20PFGI IDT72V255LA15PFGI IDT72285L10PFG
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0811-02 DATE: 9-Jan-2009 Product Affected: TQFP 64, TQFP 80, TQFP 100, TQFP 128, (Standard and RoHS) Refer to Attachment II for the affected part numbers