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    GA01PNS80-CAL SPICE

    Abstract: high-temperature-sic-bare-die
    Contextual Info: Die Datasheet GA01PNS80-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GA01PNS80-CAL device. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.1 $ * $Date: 30-APR-2015 $


    Original
    GA01PNS80-CAL GA01PNS80-CAL 30-APR-2015 GA01PNS80 2491e-015 7E-11 00E-03 GA01PNS80-CAL SPICE high-temperature-sic-bare-die PDF

    Contextual Info: Die Datasheet GA01PNS80-CAL Silicon Carbide PiN Diode Chip VRRM o IF @ 25 C = = 8000 V 2A Features •     8 kV blocking 250 °C operating temperature Fast turn off characteristics Soft reverse recovery characteristics Ultra-Fast high temperature switching


    Original
    GA01PNS80-CAL GA01PNS80-CAL GA01PNS80 2491e-015 7E-11 00E-03 PDF