GLASS SUBSTRATE ST Search Results

Contextual Info: www.htr-india.com Alloy Resistance Wire, Wound On Fibre Glass Core/ Ceramic Core WIRE WOUND RESISTORS SILICONE COATED TYPE Mechanically Crimped, Tin Plated, PCB Type Termination HFP SERIES FIBRE GLASS SUBSTRATE Silicone Coated Wire Wound Resistors Plug in Style

HTR HSV resistors

Abstract: SV-9 marking sv4
Contextual Info: www.htr-india.com Alloy Wire Wound Element on Fibre Glass Substrate / Heat Conducting Ceramic Substrate WIRE WOUND RESISTORS CERAMIC ENCASED TYPE Quartz Silica Powder HSV SERIES VERTICAL MOUNTING Ceramic Type Fire Proof Ceramic Housing Mechanically Crimped

A1297

Contextual Info: Ordering number : ENA1297 AM-1820 Package Dimensions unit : mm Light Receiving Side Overcoat Side 1.1 ±0.1 (0.5) Overcoat ±0.2 ±0.3 Electrode (0.5) 26.0 Electrode 25.0 Effective Area 1.3MAX Glass 43.0 ±0.3 Note: Glass Substrate Thickness Module Thickness

Contextual Info: Reliability Test – SQV/ SQC Series SMD Wrie Wound Ferrite Chip Inductors SQV/ SQC Series Mechanical Performance No Item 1-1-1 Shear Test Specification Test Method Chip coil shall not be damaged Substrate: after tested as test method Glass-epoxy substrate

Contextual Info: MSTF-4 SERIES MECHANICAL DATA SIZE SUBSTRATE RESISTOR BONDING PADS .040" x . 0 4 0 " x . 0 1 0 " + .0 03" SILICON, QUARTZ. OR GLASS NICHROME OR TANTALUM NITRIDE 15.000 MINIMUM GOLD 10.000 À MINIMUM ALUMINUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL A BACKSIDE SURFACE

AM-5416

Contextual Info: Ordering number : ENA0056 AM-5416 Package Dimensions unit : mm Light Receiving Side Glass Juts(4 Corners) Width : 1.0MAX, Length : 15.0MAX (1.2) B 100 ±5 Lead Wires 34.3 (4.1) ±0.2 ±0.5 52.0 Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness

safety solar traffic light

Contextual Info: Ordering number : ENA1301 AM-5815 Package Dimensions unit : mm Light Receiving Side Overcoat Side 8.7 (1.05) Effective Area ±0.2 ±0.3 10.8 Electrode (6.35) Electrode (1.05) Glass Juts(4 Corners) Width : 0.6MAX, Length : 6.0MAX (2.65) 31.8 ±0.3 Note: Glass Substrate Thickness

Contextual Info: Ordering number : ENA1298 AM-5308 Package Dimensions unit : mm Light Receiving Side Overcoat Side ±0.3 ±0.2 44.8 Effective Area Electrode ±0.3 47.2 3.1 23.6 ±0.3 (1.2) Glass Juts(4 Corners) Width : 0.6MAX, Length : 6.0MAX (1.2) Electrode 50.1 ±0.3 Note: Glass Substrate Thickness

ceramic resistor C5B

Abstract: Ceramic Resistor 82K 5W HTR 6W RESISTOR
Contextual Info: www.htr-india.com Alloy Wire Wound Element On Heat Conducting Ceramic / Fibre Glass Substrate Fire Proof Ceramic Housing WIRE WOUND RESISTORS CERAMIC ENCASED TYPE HEA SERIES EUROPEAN STYLE Power Ceramic Encased Wire Wound Quartz Silica Powder Mechanically

12v 30a diagram

Abstract: output transformer 100w
Contextual Info: 2 Quarter Brick-sized DC/DC Converter HBQ Series 1 HBQ Series Outline To achieve operation at lower voltages and high currents, together with small device size, Shindengen developed its own synchronous rectification technology, while at the same time replacing the conventional aluminum substrate with a thick glass-epoxy multi-layered substrate of

R610

Abstract: 4x1206 CN1J4
Contextual Info: NETWORKS THICK FILM R-NETWORK NETWORKS PASSIVE COMPONENTS CONCAVE TERMINATIONS CN STRUCTURE 1 2 3 4 5 6 Ceramic substrate Inner electrode RuO2 resistive film Inner glass passivation Outer electrode Protective coating IDENTIFICATION COATING COLOR CN Black

sanyo 52

Abstract: AM-5812
Contextual Info: Ordering number : ENA0058A AM-5812 Package Dimensions unit : mm Light Receiving Side Overcoat Side ±0.2 Lead Wires (6) 59.0 ±0.3 52.6 ±0.2 (3.2) Effective Area Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness Standard lead wires length

Contextual Info: Non-magnetic Thick Film Chip Resistor－NMR Series •Construction L D1 3 W 4 T 7 65 1 D2 2 1 Alumina Substrate 5 Resistor Layer RuO2/Ag 2 Bottom Electrode (Ag) 6 Primary Overcoat (Glass) 3 Top Electrode (Ag-Pd) 7 Secondary Overcoat (Glass) 4 Edge Electrode (Ag-Pd)

5mm Sanyo led datasheet

Abstract: AM-5812
Contextual Info: Ordering number : ENA0058 AM-5812 Package Dimensions unit : mm Light Receiving Side Overcoat Side Wire Overcoat Lead Wires (6) 59.0 ±0.3 52.6 (3.2) ±0.2 Effective Area Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness Standard lead wires length

CC2570

Abstract: CC2544 CC2571
Contextual Info: BAL-CC25-01D3 50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun Datasheet  production data Description STMicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has

RK73G

Abstract: RC-2134B
Contextual Info: FLAT CHIP ENHANCED THICK FILM RK73G STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Top termination Bottom termination Resistive layer Glass layer Trimming cut Protective layer End termination Diffusion barrier Ni Solder plating IDENTIFICATION COATING COLOR

CC2570

Abstract: CC2544 CC2571
Contextual Info: BAL-CC25-01D3 50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun Datasheet  production data Description STMicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has

CN1J4

Contextual Info: NETWORKS THICK FILM R-NETWORK NETWORKS PASSIVE COMPONENTS CONcave TERMINATIONS Anti sulfuration CN RT • CNZ RT W NE STRUCTURE 1 2 3 4 5 6 Ceramic substrate Inner electrode RuO2 resistive film Inner glass passivation Outer electrode Protective coating IDENTIFICATION

TSN-06

Contextual Info: Construction Features         High mechanical strength and reliability are available due to thermistor film and glass-coated structure on alumina substrate. Thickness is fixed not related to resistance value. Thinner than the multilayer type.

RC-722

Abstract: platinum Hot wire SN62 PB36 ag2 108D RC0550 RC1206 vishay 1001
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES MECHANICAL SPECIFICATIONS Resistive Element Encapsulation Substrate Termination Solder Finish Ruthenium oxide Glass 96 % alumina Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold

4K7 20W

Contextual Info: www.htr-india.com Inorganic Fire Retardant Encapsulant Flame Proof High Temperature Ceramic Housing Mechanically Crimped Termination Assembly WIRE WOUND RESISTORS CERAMIC ENCASED TYPE HCA/HCV SERIES Alloy Wire Wound Element On Fibre Glass/Ceramic Substrate

cp20c

Abstract: CP15 CP-20Z
Contextual Info: www.htr-india.com Alloy Wire Wound Element On Fibre Glass / Ceramic Substrate Mechanically Crimped, Tin Plated, PCB Type Termination Inorganic Fire Retardant Encapsulant Flame Proof High Temperature Ceramic Housing WIRE WOUND RESISTORS CERAMIC ENCASED TYPE

Contextual Info: www.htr-india.com Alloy Wire Wound Element On Fibre Glass /Ceramic Substrate Mechanically Crimped, Tin/Nickel Plated, Lug Type Termination WIRE WOUND RESISTORS CERAMIC ENCASED TYPE Flame Proof High Temperature Ceramic Housing Inorganic Fire Retardant Encapsulant

HV733A

Abstract: HV732H RK73-series RC-2134B RK73 HV73 HV732BT M100K
Contextual Info: RESISTORS RESISTORS FLAT CHIP THICK FILM HIGH VOLTAGE HV73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Top termination Bottom termination Resistive layer Glass layer Trimming cut Protective layer End termination Diffusion barrier Ni Solder plating IDENTIFICATION