GOLD EMBRITTLEMENT Search Results

SZZA031

Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Contextual Info: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)

7209-1511-015

Abstract: 7002-1541-010 7441-1521-0XX 348 pins plug connector 6-40 UNF 2 B TORQUE 7105-1561-010 7009-1511-000 RG196 RG316 sma sma straight pcb mount
Contextual Info: D I G I TA L C ATA L O G Microminiature Coaxial Connectors SSMB SSLB SSMC APPLIED ENGINEERING PRODUCTS 104 John W. Murphy Drive • P.O. Box 510 • New Haven, CT 06513 203 776-2813 • FAX (203) 776-8294 www.aep.us • e-mail: aepsales@aep.us SSMB/SSLB/SSMC Microminiature Connectors

Contextual Info: O N L I N E C ATA L O G Microminiature Coaxial Connectors SSMB SSLB SSMC APPLIED ENGINEERING PRODUCTS 104 John W. Murphy Drive • P.O. Box 510 • New Haven, CT 06513 203 776-2813 • FAX (203) 776-8294 www.aepconnectors.com • e-mail: aepsales@aepconnectors.com

gold embrittlement

Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782
Contextual Info: AN-652 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards By Hubert Geitner

"tunnel diode" chip assembly

Abstract: "tunnel diode" wire bonding Ablestik gold embrittlement DATASHEET TUNNEL DIODE germanium diode Metelics Tunnel Diode
Contextual Info: Application Note Chip and Beam Lead Handling Chip and beam lead devices are packaged for shipment in either waffle packs or Gel-Packs . Chips in waffle packs are somewhat free to move around their wells, and can be accidently dislodged rather easily when the waffle pack is

2 to 3 GHz bandpass filter wide band

Abstract: cavity resonator 1.5 GHz Bandpass Filters Shielded Microstrip Line
Contextual Info: TM Miniature Ceramic Filters High Performance Filters from DLI Typical Specifications n Frequencies from 1 to > 67 n Insertion Loss ~ 2dB n Return Loss 15 dB typical n Rejection 45 dB typical n Pass band Width <15% GHz Symetrical Dual Mode Resonator Filter SDMRF

transistor working principle

Abstract: weller tinning rf transistor 320 SN62 SN63 Cold solder joint gold embrittlement METCAL MX-500 circuit metcal iron
Contextual Info: RF Power Innovations 310 320-6160 AN3025 Transistor Mounting and Soldering Brett Kelley and Eric Hokenson 18 December 2003 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. 1. Solder pre-tin the transistor leads.

AN3025

Abstract: transistor working principle tinning METCAL MX-500 circuit free transistor SN62 SN63 GC Electronics 108109 metcal transistor free
Contextual Info: Application Note AN3025 Transistor Mounting and Soldering Rev. 3 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. Solder pre-tin the transistor leads Mount the transistor Solder the transistor leads to the circuit trace

Contextual Info: Development General NXP Semiconductors BL-Cellular Systems, MST RF Power Basestations DEV&QAS Title: Solder mounting recommendations for Ldmos Power Amplifiers Author: Josselin FAY, Michael ASIS, Jose SALTA Doc. Nr. Date: 2008/02/14 General solder mounting recommendations

gold embrittlement

Abstract: shim CR-15 M567
Contextual Info: Application Note M567 CR-15 Package Handling and Mounting Procedure Rev. V4 Introduction Mounting Cavity Design The CR-15 is a high frequency, low thermal resistance package, which should be given special attention during cavity design and package mounting, to insure proper

shim

Abstract: CR-15 gold embrittlement
Contextual Info: CR-15 Package Handling and Mounting Procedure Introduction Mounting Cavity Design The CR-15 is a high frequency, low thermal resistance package, which should be given special attention during cavity design and package mounting, to insure proper electrical and thermal performance.

NICHROME wire 0.005 mm2

Abstract: gold embrittlement MSI nichrome resistor nicr-ni temperature waveguide selective switch microwave circulators AT*T Wireless Services coupler
Contextual Info: VISHAY ELECTRO-FILMS Vishay Film Resistors Tech Note An Introduction to Substrate PIMIC Passive Integrated Microelectronic Interconnect Circuitry Technology Introduction Document Number: 61082 Revision: 27-Mar-07 Simple Interconnect Advanced Interconnect

tva0300n07

Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,

waveguide selective switch

Abstract: quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators AT*T Wireless Services coupler AT*T coupler conductor
Contextual Info: MIC Technology Vishay Electro-Films An Introduction To Substrate PIMICTM Passive Intergrated Micro-Electron Interconnect Circuitry Technology Thin film microwave integrated circuits have been evolving from a simple substrate medium which carries microwave/

00709

Abstract: MA4SW210 MADR-007097-000100 MA4SW110 MADR-009190-000
Contextual Info: MA4SW110 MA4SW210 MA4SW310 HMIC Silicon PIN Diode Switches RoHS Compliant V8 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Broad Bandwidth Specified from 50 MHz to 20 GHz Usable from 50 MHz to 26.5 GHz Lower Insertion Loss and Higher Isolation than Comparable pHEMT/Discrete Component Designs

MADR-007097-000100

Abstract: MADR-009190-000100
Contextual Info: MA4SW510 HMIC Silicon SP5T PIN Diode Switch RoHS Compliant V5 Features ♦ Broad Bandwidth ♦ Specified from 50 MHz to 20 GHz ♦ Usable from 50 MHz to 26.5 GHz ♦ Lower Insertion Loss and Higher Isolation than Comparable pHEMT/ Discrete Component Designs

Contextual Info: MA4SW410 HMIC Silicon SP4T PIN Diode Switch RoHS Compliant V6 Features ♦ Broad Bandwidth ♦ Specified from 50 MHz to 20 GHz ♦ Usable from 50 MHz to 26.5 GHz ♦ Lower Insertion Loss and Higher Isolation than Comparable pHEMT or Discrete Component Designs

Three bond

Abstract: MADR-009190-000 MA4SW410
Contextual Info: MA4SW410 HMIC Silicon SP4T PIN Diode Switch RoHS Compliant V5 Features ♦ Broad Bandwidth ♦ Specified from 50 MHz to 20 GHz ♦ Usable from 50 MHz to 26.5 GHz ♦ Lower Insertion Loss and Higher Isolation than Comparable pHEMT/ Discrete Component Designs

trw RF POWER TRANSISTOR

Abstract: trw rf transistor trw transistors LT 9228 trw 131* RF POWER TRANSISTOR trw rf semiconductors 2023-12 TRW 52604 TP 9382 trw hybrid
Contextual Info: TR W RF SEMICONDUCTORS CATALOG 1981 EUROPEAN EDITION TABLE OF CONTENTS Pages • • • • INTRODUCTION. Q U A LITY .

SI00-06

Abstract: SN62 PB36 ag2 SN62 PB36 ag2 Copper design ideas with or without underfill MO-211 SFC05-4 thermal cycling reliability SN62 PB36 ag2 gold smd ag2
Contextual Info: SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate process for the UBM paired with screen printed solder balls. The balls are laid out in a grid with a pin out pattern per JEDEC standard outline MO-211.

AG04

Contextual Info: SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate process for the UBM paired with screen printed solder balls. The balls are laid out in a grid with a pin out pattern per JEDEC standard outline MO-211.

sirenza LNA

Abstract: C0603C100J5GAC C0603C103K5RAC C0603C221J5GAC SLX-2143 x10015
Contextual Info: Preliminary Product Description SLX-2143 The Sirenza Microdevices’ SLX-2143 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity base station applications where a high intercept point is

C0603C100J5GAC

Abstract: C0603C103K5RAC C0603C221J5GAC SLX-2043
Contextual Info: Preliminary Product Description SLX-2043 The Sirenza Microdevices’ SLX-2043 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity basestation applications where a high intercept point is

Contextual Info: OBSOLETE Product Description SLX-2143 The Sirenza Microdevices’ SLX-2143 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity base station applications where a high intercept point is